HMC1126-Die

RECOMMENDED FOR NEW DESIGNS

GaAs, pHEMT, MMIC, Power Amplifier, 2 GHz to 50 GHz

Data Sheet (Rev. C) Product Selection Table

Part Models: 2
1ku List Price: Starting From $139.41

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Overview

Output power for 1 dB compression (P1dB): 17.5 dB typical
Saturated output power (P_SAT): 21 dBm typical
Gain: 11 dB typical

Output third-order intercept (IP3): 28 dBm typical
Supply voltage: 5 V at 65 mA
50 Ω matched input/output
Die size: 2.3 mm × 1.45 mm × 0.05 mm

The HMC1126 is a gallium arsenide (GaAs), pseudomorphic high electron mobility transfer (pHEMT), monolithic microwave integrated circuit (MMIC), distributed power amplifier that operates from 2 GHz to 50 GHz. The HMC1126 provides 11 dB of gain, 28 dBm output IP3, and 17.5 dBm of output power at 1 dB gain compression, while requiring 65 mA from a 5 V supply.

The HMC1126 amplifier inputs/outputs are internally matched to 50 Ω facilitating integration into multichip modules (MCMs). All data is taken with the chip connected via two 0.025 mm (1 mil) wire bonds of minimal length 0.31 mm (12 mils).

APPLICATIONS

Test instrumentation

Microwave radios and VSATs

Military and space

Telecommunications infrastructure

Fiber optics

Part Models: 2
1ku List Price: Starting From $139.41

Documentation

Data Sheet 1

HMC1126-Die: GaAs, pHEMT, MMIC, Power Amplifier, 2 GHz to 50 GHz Data Sheet (Rev.C) 08/09/2022

Application Note 2

AN-2591: When It Comes to Long-Term Reliability of RF Amplifier ICs, Focus First on Die Junction Temperature 08/05/2024

AN-2622: Selecting an Analog Devices RF Low Noise Amplifier 09/04/2025

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
HMC1126	DIE	Material Declaration Reliability Report Package Resources	Ultra Librarian SamacSys
HMC1126-SX	DIE	Material Declaration Reliability Report Package Resources	Ultra Librarian SamacSys

This is the most up-to-date revision of the Data Sheet.

Software Resources

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Tools & Simulations

S-Parameter 1

HMC1126-Die S-Parameters

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