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HMC1106 Data Sheet4/22/2015
Overview
Features and Benefits
- Passive: No DC Bias Required
- Low LO Power: +15 dBm
- High LO/RF Isolation: 42 dB
- Wide IF Bandwidth: DC to 24 GHz
- Upconversion & Downconversion Applications
- Die Size: 1.79 x 1.46 x 0.1 mm
Product Details
The HMC1106 is a double-balanced mixer, which can be used as an upconverter or a downconverter, with DC to 24 GHz at the IF port, 20 to 50 GHz at the LO port, and 15 to 36 GHz at the RF port. This passsive MMIC mixer is fabricated with GaAs Shottky diode technology. All bond pads and the die backside are Ti/Au metallized and the Shottky devices are fully passivated for reliable operation. All data shown herein is measured with the chip in a 50 Ohm environment and contacted with RF probes.
APPLICATIONS
- Microwave Point-to-Point Radios
- SATCOM
- Test Equipment & Sensors
- Military End-Use
- Automotive Radar
Product Categories
Markets and Technologies
Product Lifecycle
Recommended for New Designs
This product has been released to the market. The data sheet contains all final specifications and operating conditions. For new designs, ADI recommends utilization of these products.
Documentation & Resources
Tools & Simulations
Design Tool
ADIsimRF
ADIsimRF is an easy-to-use RF signal chain calculator. Cascaded gain, noise, distortion and power consumption can be calculated, plotted and exported for signal chains with up to 50 stages. ADIsimRF also includes an extensive data base of device models for ADI’s RF and mixed signal components.
ZIP
HMC1106 Outline Drawing
80.47 K
Design Resources
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal.View our quality and reliability program and certifications for more information.
| Part Number | Material Declaration | Reliability Data | Pin/Package Drawing | CAD Symbols, Footprints & 3D Models |
|---|---|---|---|---|
| HMC1106 | Material Declaration | Reliability Data | CHIPS OR DIE | |
| HMC1106-SX | Material Declaration | Reliability Data | CHIPS OR DIE | |
| Wafer Fabrication Data |
Support & Discussions
HMC1106 Discussions
Sample & Buy
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Buy Now Pricing
(**) Displayed Buy Now Price and Price Range is based on small quantity orders.
List Pricing
(*)The 1Ku list pricing shown is for BUDGETARY USE ONLY, shown in United States dollars (FOB USA per unit for the stated volume), and is subject to change. International prices may differ due to local duties, taxes, fees and exchange rates. For volume-specific price or delivery quotes, please contact your local Analog Devices, Inc. authorized distributor. Pricing displayed for Evaluation Boards and Kits is based on 1-piece pricing.
Lead Times
Please see the latest communication from our CCO regarding lead times.
Sampling
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