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HMC-MDB218 Data Sheet4/22/2015
Overview
Features and Benefits
- Wide IF Bandwidth: DC - 3 GHz
- RF Frequency: 54 to 64 GHz
- LO Frequency: 27 to 32 GHz
- High Image Rejection: 30 dB
- Passive; No DC Bias Required
- Die Size: 1.54 × 1.41 × 0.1 mm
Product Details
The HMC-MDB218 is a sub-harmonically pumped (x2) MMIC Mixer which can be used as either an image reject mixer (IRM) or a single sideband upconverter. This passive MMIC mixer is fabricated with GaAs Heterojunction Bipolar Transistor (HBT) Shottky diode technology. For downconversion applications, an external quadrature hybrid can be used to select the desired sideband while rejecting image signals. All bond pads and the die backside are Ti/Au metallized and the Shottky devices are fully passivated for reliable operation. The HMC-MDB218 Sub Harmonic IRM is compatible with conventional die attach methods, as well as thermocompression and thermosonic wire bonding, making it ideal for MCM and hybrid microcircuit applications. All data shown herein is measured with the chip in a 50 Ohm environment and contacted with RF probes.
APPLICATIONS
- Short-Haul / High Capacity Radios
- SATCOM
- Military Radar, ECM & EW
- Sensors
- Test & Measurement Equipment
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Recommended for New Designs
This product has been released to the market. The data sheet contains all final specifications and operating conditions. For new designs, ADI recommends utilization of these products.
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ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal.View our quality and reliability program and certifications for more information.
| Part Number | Material Declaration | Reliability Data | Pin/Package Drawing | CAD Symbols, Footprints & 3D Models |
|---|---|---|---|---|
| HMC-MDB218 | Material Declaration | Reliability Data | CHIPS OR DIE | |
| HMC-MDB218-SX | Material Declaration | Reliability Data | CHIPS OR DIE | |
| Wafer Fabrication Data |
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