HMC-ALH102-DIE
Wideband Low Noise Amplifier Chip, 2 - 20 GHz
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Overview
Features and Benefits
- Noise Figure: <2.5 dB
- Gain: 11.6 dB @ 10 GHz
- P1dB Output Power: +10 dBm
- Supply Voltage: +2V @ 55 mA
- Die Size: 3.0 x 1.435 x 0.1 mm
Product Details
The HMC-ALH102 is a GaAs MMIC HEMT Low Noise Distributed Amplifier die which operates between 2 and 20 GHz. The amplifier provides 11.6 dB of gain at 10 GHz, <3.5 dB noise figure and +10 dBm of output power at 1 dB gain compression while requiring only 55 mA from a +2V supply voltage. The HMC-ALH102 amplifier is ideal for integration into Multi-Chip-Modules (MCMs) due to its small size.
Applications
- Wideband Communications Receivers
- Surveillance Systems
- Point-to-Point Radios
- Point-to-Multi-Point Radios
- Military & Space
- Test Instrumentation
Product Categories
Markets and Technologies
Product Lifecycle
Recommended for New Designs
This product has been released to the market. The data sheet contains all final specifications and operating conditions. For new designs, ADI recommends utilization of these products.
Documentation & Resources
Tools & Simulations
Sys-Parameters
Sys-Parameter Models for Keysight Genesys
Sys-Parameter models contain behavioral parameters, such as P1dB, IP3, gain, noise figure and return loss, which describe nonlinear and linear characteristics of a device.
S-Parameters
ZIP
HMC-ALH102 S-Parameters
1.72 K
Design Tools
ADIsimRF
ADIsimRF is an easy-to-use RF signal chain calculator. Cascaded gain, noise, distortion and power consumption can be calculated, plotted and exported for signal chains with up to 50 stages. ADIsimRF also includes an extensive data base of device models for ADI’s RF and mixed signal components.
Design Resources
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal.View our quality and reliability program and certifications for more information.
| Part Number | Material Declaration | Reliability Data | Pin/Package Drawing | CAD Symbols, Footprints & 3D Models |
|---|---|---|---|---|
| HMC-ALH102 | Material Declaration | Reliability Data | CHIPS OR DIE | |
| HMC-ALH102-SX | Material Declaration | Reliability Data | CHIPS OR DIE | |
| Wafer Fabrication Data |
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