DAC8426
Quad 8-Bit Voltage Out CMOS DAC Complete with Internal 10V Reference
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Features
- No Adjustments Required, Total Error ±1 LSB Max Over Temperature
- Four Voltage-Output DACs on a Single Chip
- Internal 10 V Bandgap Reference
- Operates from a Single +15 V Supply
- Fast 50 ns Data Load Time, All Temperatures
- Pin-for-Pin Replacement for PM-7226 and AD7226 Eliminates External Reference
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The DAC8426 is a complete quad voltage output D/A converter with internal reference. This product fits directly into any existing 7226 socket where the user currently has a 10 V external reference. The external reference is no longer necessary. The internal reference of the DAC-8426 is laser-trimmed to ±0.4% offering a 25ppm/°C temperature coefficient and 5mA of external load driving capability.
The DAC8426 contains four 8-bit voltage-output CMOS D/A converters on a single chip. A 10 V output bandgap reference sets the latches and interface control logic.
One of the four latches, selected by the address inputs, is loaded from the 8-bit data bus input when the write strobe is active low. All digital inputs are TTL/CMOS (5V) compatible. The on-board amplifiers can drive up to 10mA from either a single or dual supply. The on-board reference that is always connected to the internal DACs has 5mA available to drive external devices.
Its compact size, low power, and economical cost-per-channel, make the DAC8426 attractive for applications requiring multiple D/A converters without sacrificing circuit-board space. System reliability is also increased due to reduced parts count.
Analog Devices' advanced oxide-based, silicon-gate, CMOS process allows the DAC8426's analog and digital circuitry to be manufactured on the same chip. This, coupled with Analog Devices' highly stable thin-film R-2R resistor ladder, aids in matching and temperature tracking between DACs.
APPLICATIONS
- Process Controls
- Multichannel Microprocessor Controlled:
System Calibration
Op Amp Offset and Gain Adjust
Level and Threshold Setting
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DAC8426
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Documentation
Solutions Bulletin & Brochure 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| DAC8426AR/883C |
20-Lead CerDIP
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| DAC8426EPZ |
20-Lead PDIP
|
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| DAC8426FPZ |
20-Lead PDIP
|
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| DAC8426FSZ |
20-Lead SOIC (Wide)
|
|
- DAC8426AR/883C
- Pin/Package Drawing
-
20-Lead CerDIP
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- DAC8426EPZ
- Pin/Package Drawing
-
20-Lead PDIP
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- DAC8426FPZ
- Pin/Package Drawing
-
20-Lead PDIP
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- DAC8426FSZ
- Pin/Package Drawing
-
20-Lead SOIC (Wide)
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
Filter by Model
Part Models
Product Lifecycle
PCN
Apr 9, 2018
- 16_0026
Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices
DAC8426AR/883C
Feb 1, 2016
- 16_0001
DAC8426AR/883 Datasheet Correction.
DAC8426AR/883C
Nov 7, 2012
- 12_0199
Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.
Jun 6, 2012
- 12_0066
Add capacity for Burn In of Hermetic, 883 & QMLQ/Class B devices at TSSI Cavite
Nov 9, 2011
- 11_0050
Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines
DAC8426AR/883C
Nov 9, 2011
- 11_0182
Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
DAC8426AR/883C
DAC8426EPZ
PRODUCTION
DAC8426FPZ
PRODUCTION
DAC8426FSZ
PRODUCTION
Jul 31, 2009
- 09_0106
Removal of Die Fab Code from Topside Marking of Remaining Mil-Grade Products
DAC8426AR/883C
Mar 7, 2019
- 19_0046
Assembly Transfer of 18,20,24,28 Lead PDIP to Cirtek
DAC8426EPZ
PRODUCTION
DAC8426FPZ
PRODUCTION
Aug 19, 2009
- 07_0024
Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad
DAC8426EPZ
PRODUCTION
DAC8426FPZ
PRODUCTION
Aug 4, 2010
- 10_0117
Halogen Free Material Change for SOIC_W Products at Carsem
DAC8426FSZ
PRODUCTION
Filter by Model
Part Models
Product Lifecycle
PCN
Apr 9, 2018
- 16_0026
Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices
Feb 1, 2016
- 16_0001
DAC8426AR/883 Datasheet Correction.
Nov 7, 2012
- 12_0199
Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.
Jun 6, 2012
- 12_0066
Add capacity for Burn In of Hermetic, 883 & QMLQ/Class B devices at TSSI Cavite
Nov 9, 2011
- 11_0050
Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines
Nov 9, 2011
- 11_0182
Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
DAC8426AR/883C
DAC8426EPZ
PRODUCTION
DAC8426FPZ
PRODUCTION
DAC8426FSZ
PRODUCTION
Jul 31, 2009
- 09_0106
Removal of Die Fab Code from Topside Marking of Remaining Mil-Grade Products
Mar 7, 2019
- 19_0046
Assembly Transfer of 18,20,24,28 Lead PDIP to Cirtek
DAC8426EPZ
PRODUCTION
DAC8426FPZ
PRODUCTION
Aug 19, 2009
- 07_0024
Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad
DAC8426EPZ
PRODUCTION
DAC8426FPZ
PRODUCTION
Aug 4, 2010
- 10_0117
Halogen Free Material Change for SOIC_W Products at Carsem
Tools & Simulations 1
Precision DAC Error Budget Tool
