Features and Benefits
- OP1dB: 29 dBm typical
- Gain: up to 15 dB typical
- OIP3: up to 43 dBm typical
- Self biased at VDD = 12 V at 385 mA typical with an optional bias control on VGG1 for IDQ adjustment
- 50 Ω matched input/output
- 32-lead, 5 mm × 5 mm LFCSP
The ADPA9002 is a gallium arsenide (GaAs), pseudomorphic high electron mobility transistor (pHEMT), monolithic microwave integrated circuit (MMIC), power amplifier that operates between dc and 10 GHz. The amplifier provides 15 dB of gain, 42 dBm of OIP3, and 31.5 dBm of saturated output power (PSAT) while requiring 385 mA from a 12 V supply. The ADPA9002 is self biased in normal operation and has an optional bias control for supply quiescent current (IDQ) adjustment. The amplifier is ideal for military and space and test equipment applications. The ADPA9002 also features inputs and outputs that are internally matched to 50 Ω, housed in a RoHS compliant, 5 mm × 5 mm LFCSP premolded cavity package, making it compatible with high volume surface-mount technology (SMT) assembly equipment.
Note that throughout this data sheet, multifunction pins, such as RFOUT/VDD, are referred to either by the entire pin name or by a single function of the pin, for example, VDD, when only that function is relevant.
- Military and space
- Test instrumentation
Product Lifecycle Recommended for New Designs
This product has been released to the market. The data sheet contains all final specifications and operating conditions. For new designs, ADI recommends utilization of these products.
Evaluation Kits (1)
The ADPA9002-EVALZ consists of a dual-layer printed circuit board (PCB) fabricated from 10 mil thick, Rogers 4350B, copper clad mounted to an aluminum heat sink. The heat sink assists in providing thermal relief to the ADPA9002 as well as mechanical support to the PCB. Mounting holes on the heat sink allow attachment to larger heat sinks for improved thermal management. The RFIN and RFOUT ports on the ADPA9002-EVALZ are populated with 2.9 mm, female, coaxial connectors (J1 and J2) and the corresponding RF traces have a 50 Ω characteristic impedance. The ADPA9002-EVALZ is populated with components suitable for use over the entire −40°C to +85°C operating temperature range of the ADPA9002. To calibrate board trace losses, a through calibration path is provided between the J5 and J6 connectors. J5 and J6 must be populated with RF connectors to use the through calibration path. Refer to Table 2 and Figure 3 for the through calibration path performance.
The device ground path and gate control voltage are accessed through the 4-pin headers, J3 and J4 (see Table 1 for header connections).
The RF traces on the ADPA9002-EVALZ are 50 Ω, grounded coplanar waveguide. The package ground leads and the exposed pad connect directly to the ground plane. Multiple vias connect the top and bottom ground planes with particular focus on the area directly beneath the ground paddle to provide adequate electrical conduction and thermal conduction to the heat sink.
The power supply decoupling capacitors on the ADPA9002-EVALZ represent the configuration that was used to characterize and qualify the device. A scope can be used to reduce the number of capacitors, but the scope varies from system to system. It is recommended to first remove or combine the largest capacitors that are farthest from the ADPA9002 when modifying the capacitor configurations.
For full details on the ADPA9002, see the ADPA9002 data sheet, which must be consulted in conjunction with this user guide when using the ADPA9002-EVALZ.
Features & Benefits
- Dual-layer Rogers 4350 evaluation board with heat sink
- End launch, 2.9 mm, RF connectors
- Through calibration path
Documentation & Resources
UG-1637: ADPA9002 Evaluation Board (Rev. A)11/25/2019479 K
RF, Microwave, and Millimeter Wave Product Selection Guide7/13/20189M
Tools & Simulations
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal.View our quality and reliability program and certifications for more information.
|Part Number||Material Declaration||Reliability Data||Pin/Package Drawing||CAD Symbols, Footprints & 3D Models|
|ADPA9002ACGZN||Material Declaration||Reliability Data||32-Lead LFCSP (5mm x 5mm w/ EP)|
|ADPA9002ACGZN-R7||Material Declaration||Reliability Data||32-Lead LFCSP (5mm x 5mm w/ EP)|
|Wafer Fabrication Data|
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Pricing displayed is based on 1-piece. The USA list pricing shown is for budgetary use only, shown in United States dollars (FOB USA per unit), and is subject to change. International prices may vary due to local duties, taxes, fees and exchange rates.