ADPA7009

RECOMMENDED FOR NEW DESIGNS

20 GHz to 54 GHz, GaAs, pHEMT, MMIC, 29 dBm (0.5 W) Power Amplifier

Data Sheet (Rev. 0) Product Selection Table

Part Models: 2
1ku List Price: Starting From $204.42

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Overview

Output P1dB: 28.5 dBm typical at 24 GHz to 36 GHz
P_SAT: 29 dBm typical at 24 GHz to 36 GHz
Gain: 19.5 dB typical at 24 GHz to 36 GHz
Input return loss: 17.5 dB typical at 24 GHz to 36 GHz

Output return loss: 22.0 dB typical at 24 GHz to 36 GHz
Output IP3: 35 dBm typical at 24 GHz to 36 GHz
Supply voltage: 5 V typical at 750 mA
50 Ω matched input and output
Die size: 2.750 mm × 1.845 mm× 0.102 mm

The ADPA7009CHIP is a gallium arsenide (GaAs), pseudomorphic high electron mobility transistor (pHEMT), monolithic microwave integrated circuit (MMIC), 29 dBm saturated output power (0.5 W) distributed power amplifier that operates from 20 GHz to 54 GHz. The amplifier provides a gain of 19.5 dB, an output power for 1 dB compression (P1dB) of 28.5 dBm, and a typical output third-order intercept (IP3) of 35 dBm at 24 GHz to 36 GHz. The ADPA7009CHIP requires 750 mA from a 5 V supply voltage (V_DD) and features inputs and outputs that are internally matched to 50 Ω, facilitating integration into multichip modules (MCMs). All data is taken with the RFIN and RFOUT pads connected via one 0.076 mm (3 mil) ribbon bond of 0.076 mm (3 mil) minimal length.

APPLICATIONS

Military and space
Test instrumentation
Satellite communications

Part Models: 2
1ku List Price: Starting From $204.42

Documentation

Data Sheet 1

ADPA7009 20 GHz to 54 GHz, GaAs, pHEMT, MMIC, 29 dBm (0.5 W) Power Amplifier Data Sheet (Rev.0) 04/15/2021

Application Note 3

AN-2591: When It Comes to Long-Term Reliability of RF Amplifier ICs, Focus First on Die Junction Temperature 08/05/2024

AN-2578: Using the VREF Pin of RF Amplifier Power Detectors to Monitor Die Temperature 02/12/2024

AN-1363: Meeting Biasing Requirements of Externally Biased RF/Microwave Amplifiers with Active Bias Controllers 05/13/2020

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
ADPA7009C-KIT	CHIPS OR DIE	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
ADPA7009CHIP	CHIPS OR DIE	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys

This is the most up-to-date revision of the Data Sheet.

Software Resources

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Tools & Simulations

S-Parameter 1

ADPA7009CHIP S-Parameter

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