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Features and Benefits

  • Integrated 16 (2x8) channel beamformer paired with a 2 transmit (TX) and 2 receive (RX) channel upconverter/downconverter (UDC)
  • RF range: 37.0 GHz to 43.5 GHz
  • x4 LO multiplier chain
  • Optional external filtering for spurious rejection
  • Significant power consumption reduction per beamformer channel vs. previous generations
  • 16 configurable TX and RX channels
  • Dual polarization, 8 horizontal and 8 vertical channels paired to independent UDCs
  • Matched to 50 Ω, single-ended RF inputs/outputs and single-ended LO input
  • Fast TDD switching using TRX_x pins
  • On-chip temperature sensor for RX and TX automatic temperature compensation for Gain
  • Memory for TX and RX beam positions
  • NVM for phase and gain calibration
  • Upconversion mode
    • Sideband rejection and carrier feedthrough optimization
    • Envelope detector for LO feedthrough calibration
    • Single channel power detector
  • Downconversion mode
    • Integrated individual RX channel overload detection circuits
  • 3-wire or 4-wire SPI that supports up to 133 MHz SPI clock speed

Product Details

The ADMV1239 is a 37.0 GHz to 43.5 GHz, mmW 5G dual channel upconverter, dual channel downconverter and beamformer integrated on a single chip. The RF integrated circuit (RFIC) combines two transmit/receive streams (2T2R) with 16 independent TX and RX beamformer channels in a 2 by 8 configuration supporting both single and dual polarization array designs.

The on-chip transmit receive switches connect the upconverter RF output and downconverter RF input for each polarization into eight independent channels via the 1:8 power splitters/combiners.

The ADMV1239 comes in a compact chip scale ball grid array package. The ADMV1239 operates over the −40°C to +95°C case temperature (TC) range. This package allows heatsinking the ADMV1239 from the topside of the package for the most efficient thermal heatsinking and to allow flexible antenna placement on the opposite side of the printed circuit board (PCB).


  • mmW 5G application
  • Broadband communication
  • For more information please contact ADI at

    Product Lifecycle icon-recommended Pre-Release

    This product is new and engineering validation may still be underway. Quantities may be limited and design specifications may change while we ready the product for release to production.

    Documentation & Resources

    Design Resources

    ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well.  "Zero defects" for shipped products is always our goal.