ADMV1009
Info : RECOMMENDED FOR NEW DESIGNS
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ADMV1009

12.7 GHz to 15.4 GHz, GaAs, MMIC, Upper Sideband, Differential Upconverter

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Info : RECOMMENDED FOR NEW DESIGNS tooltip
Info : RECOMMENDED FOR NEW DESIGNS tooltip
Part Models 2
1ku List Price Starting From $45.23
Features
  • RF output frequency range: 12.7 GHz to 15.4 GHz
  • IF input frequency range: 2.8 GHz to 4 GHz
  • LO input frequency range: 9 GHz to 12.6 GHz
  • Matched 50 Ω RF output, LO input, and IF input
  • 20 dB of image rejection
  • 32-terminal, 4.9 mm × 4.9 mm LCC package
Additional Details
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The ADMV1009 is a compact, gallium arsenide (GaAs) design, monolithic microwave integrated circuit (MMIC), upper sideband (USB), differential, upconverter in a RoHS compliant package optimized for point to point microwave radio designs that operate in the 12.7 GHz to 15.4 GHz frequency range.

The ADMV1009 provides 21 dB of conversion gain with 20 dB of sideband rejection. The ADMV1009 uses a radio frequency (RF) amplifier preceded by a passive, double balanced mixer, where a driver amplifier drives the local oscillator (LO). IF1 and IF2 mixer inputs are provided, and an external 180° balun is needed to drive the IF pins differentially. The ADMV1009 is a much smaller alternative to hybrid style single sideband (SSB) upconverter assemblies and eliminates the need for wire bonding by allowing the use of surface-mount manufacturing assemblies.

The ADMV1009 upconverter comes in a compact, thermally enhanced, 4.9 mm × 4.9 mm LCC package. The ADMV1009 operates over the −40°C to +85°C temperature range.

Applications

  • Point to point microwave radios
  • Radars and electronic warfare systems
  • Instrumentation, automatic test equipment
Part Models 2
1ku List Price Starting From $45.23

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Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
ADMV1009AEZ
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ADMV1009AEZ-R7
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Software & Part Ecosystem

Evaluation Kits 1

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EVAL-ADMV1009

ADMV1009 Evaluation Board

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EVAL-ADMV1009

ADMV1009 Evaluation Board

ADMV1009 Evaluation Board

Product Detail

The circuit board used in the application must use RF circuit design techniques. Signal lines must have 50 Ω impedance, and the package ground leads and exposed pad must be connected directly to the ground plane. Use a sufficient number of via holes to connect the top and bottom ground planes. The evaluation circuit board is available from Analog Devices, Inc., upon request.

Resources

Tools & Simulations 2

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