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  5. ADGS1212


Overview

Features and Benefits

  • SPI interface with error detection
    • Includes CRC, invalid read/write address, and SCLK count error detection
    • Supports burst mode and daisy-chain mode
    • Industry-standard SPI Mode 0 and SPI Mode 3 compatible
  • Guaranteed break-before-make switching allowing external wiring of switches to deliver multiplexer configurations
  • VSS to VDD analog signal range
    • Fully specified at ±15 V and +12 V supply
    • ±4.5 V to ±16.5 V dual-supply operation
    • 5 V to 16.5 V single-supply operation
  • Ultralow capacitance and leakage allows fast settling time
    • 1 pF typical off switch drain capacitance at 25°C, ±15 V
    • 2.6 pF typical on switch capacitance at 25°C, ±15 V
    • <1 pC typical charge injection at 25°C
  • 1.8 V logic compatibility with 2.7 V ≤ VL ≤ 3.3 V

Product Details

The ADGS1212 contains four independent single-pole/single-throw (SPST) switches. A serial peripheral interface (SPI) controls the switches. The SPI interface has robust error detection features such as cyclic redundancy check (CRC) error detection, invalid read/write address detection, and SCLK count error detection.

It is possible to daisy-chain multiple ADGS1212 devices together. Daisy-chain mode enables the configuration of multiple devices with minimal digital lines. The ADGS1212 can also operate in burst mode to decrease the time between SPI commands.

iCMOS construction ensures ultralow power dissipation, making the device ideal for portable and battery-powered instruments.

Each switch conducts equally well in both directions when on, and each switch has an input signal range that extends to the supplies.

In the off condition, signal levels up to the supplies are blocked. The ultralow capacitance and charge injection of these switches make them ideal solutions for data acquisition and sample-andhold applications where low glitch and fast settling are required.

Fast switching speed coupled with high signal bandwidth make the device suitable for video signal switching.

Multifunction pin names may be referenced by their relevant function only.

Product Highlights

  1. SPI interface removes the need for parallel conversion, logic traces, and reduces the general-purpose input/output (GPIO) channel count.
  2. Daisy-chain mode removes additional logic traces when multiple devices are used.
  3. CRC error detection, invalid read/write address detection, and SCLK count error detection ensure a robust digital interface.
  4. CRC and error detection capabilities allow the ADGS1212 to be used in safety critical systems.
  5. Guaranteed break-before-make switching allows the the ADGS1212 to be used in multiplexer configurations with external wiring.
  6. The ADGS1212 1.8 V logic compatibility with 2.7 V ≤ VL ≤ 3.3 V
  7. Ultralow capacitance.
  8. <1 pC charge injection.

Applications

  • Automated test equipment
  • Data acquisition systems
  • Battery-powered systems
  • Sample-and-hold systems
  • Audio signal routing
  • Video signal routing
  • Communications systems

Product Lifecycle icon-recommended Recommended for New Designs

This product has been released to the market. The data sheet contains all final specifications and operating conditions. For new designs, ADI recommends utilization of these products.

Evaluation Kits (1)

Tools & Simulations

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LTspice

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ADGS1212

IBIS Models

SPICE Models

Design Resources

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well.  "Zero defects" for shipped products is always our goal.View our quality and reliability program and certifications for more information.

Part Number Material Declaration Reliability Data Pin/Package Drawing CAD Symbols, Footprints & 3D Models
ADGS1212BCPZ Material Declaration Reliability Data 24-Lead LFCSP (4mm x 4mm w/ EP)
ADGS1212BCPZ-RL7 Material Declaration Reliability Data 24-Lead LFCSP (4mm x 4mm w/ EP)
Wafer Fabrication Data

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Pricing displayed is based on 1-piece. The USA list pricing shown is for budgetary use only, shown in United States dollars (FOB USA per unit), and is subject to change. International prices may vary due to local duties, taxes, fees and exchange rates.