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Features
- 44 V Supply Maximum Rating
- ±15 V Analog Signal Range
- Low RON (60Ω)
- Low Leakage (0.5nA)
- Break-Before-Make Switching Action
- Extended Plastic Temperature Range (-40ºC to +85ºC)
- Low Power Dissipation (33 mW)
- TTL/CMOS Compatible
- Superior Second Source for
- DG201A/HI201
- 16-Lead DIP/SOIC Packages
ADG201A-EP supports defense and aerospace applications (AQEC standard)
- Download ADG201A-EP data sheet (pdf)
- Military temperature range: −55°C to +125°C
- Controlled manufacturing baseline
- One assembly and test site
- One fabrication site
- Enhanced product change notification
- Qualification data available on request
- V62/12638 DSCC Drawing Number
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The ADG201A is a monolithic CMOS device comprising four independently selectable switches. They are designed on an enhanced LC2MOS process which gives an increased signal handling capability of ±15 V. These switches also feature high switching speeds and low RON.
The ADG201A switches are turned on with a logic low on the appropriate control input. Each switch conducts equally well in both directions when ON and each has an input signal range that extends to the supplies. All switches exhibit break-before-make switching action for use in multiplexer applications. Inherent in the design is low charge injection for minimum transients when switching the digital inputs.
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ADG201A
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Product Selection Guide 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| ADG201ABCHIPS | none available |
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| ADG201AKNZ |
16-Lead PDIP
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| ADG201AKPZ |
20-Lead Flatpack
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| ADG201AKPZ-REEL |
20-Lead Flatpack
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| ADG201AKRZ |
16-Lead SOIC
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| ADG201AKRZ-REEL |
16-Lead SOIC
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| ADG201AKRZ-REEL7 |
16-Lead SOIC
|
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| ADG201ASRZ-EP |
16-Lead SOIC
|
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| ADG201ASRZ-EP-RL7 |
16-Lead SOIC
|
|
- ADG201ABCHIPS
- Pin/Package Drawing
- none available
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Material Declaration
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HTML
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16-Lead SOIC
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HTML
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PCN
Feb 8, 2010
- 04_0080
Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland.
ADG201ABCHIPS
PRODUCTION
ADG201AKNZ
ADG201AKRZ
PRODUCTION
ADG201AKRZ-REEL
ADG201AKRZ-REEL7
Mar 29, 2021
- 21_0033
Assembly Site Transfer for 14/16L 300_MIL PDIP to Cirtek
Aug 19, 2009
- 07_0024
Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad
Nov 23, 2010
- 10_0004
Halogen Free Material Change for SOIC Narrow Body Products Assembled at Amkor
ADG201AKRZ
PRODUCTION
ADG201AKRZ-REEL
ADG201AKRZ-REEL7
Filter by Model
Part Models
Product Lifecycle
PCN
Feb 8, 2010
- 04_0080
Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland.
ADG201ABCHIPS
PRODUCTION
ADG201AKNZ
ADG201AKRZ
PRODUCTION
ADG201AKRZ-REEL
ADG201AKRZ-REEL7
Mar 29, 2021
- 21_0033
Assembly Site Transfer for 14/16L 300_MIL PDIP to Cirtek
Aug 19, 2009
- 07_0024
Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad
Nov 23, 2010
- 10_0004
Halogen Free Material Change for SOIC Narrow Body Products Assembled at Amkor
ADG201AKRZ
PRODUCTION
ADG201AKRZ-REEL
ADG201AKRZ-REEL7
