ADG1434
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ADG1434

4 Ω RON, Quad SPDT ±15 V/+12 V/±5 V iCMOS™ Switch

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Info: : PRODUCTION tooltip
Info: : PRODUCTION tooltip
Part Details
Part Models 5
1ku List Price Starting From $4.00
Features
  • 4.7 Ω maximum on resistance at 25°C
  • 0.5 Ω on-resistance flatness
  • Fully specified at ±15 V/+12 V/±5 V
  • 3 V logic-compatible inputs
  • Up to 115 mA continuous current per channel
  • Rail-to-rail operation
  • Break-before-make switching action
  • 16-/20-lead TSSOP and 4 mm × 4 mm LFCSP
Additional Details
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The ADG1433 and ADG1434 are monolithic industrial CMOS (iCMOS®) analog switches comprising three independently selectable single-pole, double-throw (SPDT) switches and four independently selectable SPDT switches, respectively.

All channels exhibit break-before-make switching action that prevents momentary shorting when switching channels. An EN input on the ADG1433 (LFCSP and TSSOP) and ADG1434 (LFCSP only) is used to enable or disable the device. When disabled, all channels are switched off.

The iCMOS modular manufacturing process combines high voltage, complementary metal-oxide semiconductor (CMOS), and bipolar technologies. It enables the development of a wide range of high performance analog ICs capable of 33 V operation in a footprint that no other generation of high voltage devices has been able to achieve. Unlike analog ICs using a conventional CMOS process, iCMOS components can tolerate high supply voltages while providing increased performance, dramatically lower power consumption, and reduced package size.

The ultralow on resistance and on resistance flatness of these switches make them ideal solutions for data acquisition and gain switching applications, where low distortion is critical. iCMOS construction ensures ultralow power dissipation, making the devices ideally suited for portable and battery-powered instruments.

Applications

  • Relay replacement
  • Audio and video routing
  • Automatic test equipment
  • Data acquisition systems
  • Temperature measurement systems
  • Avionics
  • Battery-powered systems
  • Communication systems
  • Medical equipment
Part Models 5
1ku List Price Starting From $4.00

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Documentation

Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
ADG1434YCPZ-REEL
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ADG1434YCPZ-REEL7
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ADG1434YRUZ
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ADG1434YRUZ-REEL
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ADG1434YRUZ-REEL7
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Part Models

Product Lifecycle

PCN

Jul 25, 2017

- 17_0068

CANCELLED: Addition of ASE Korea as an Alternate Assembly Site for Select 3x3mm and 4x4mm Body Sizes LFCSP Devices

May 5, 2014

- 14_0020

Conversion of 4x4mm body Size LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines.

Feb 15, 2010

- 07_0061

LFCSP Package Manufacturing Line Transfer from Amkor Korea to Amkor PRC

Jan 27, 2009

- 09_0013

Changes to Idd Specifications on ADG12xx, ADG14xx and ADG13xx datasheets

ADG1434YCPZ-REEL

PRODUCTION

ADG1434YCPZ-REEL7

PRODUCTION

ADG1434YRUZ

PRODUCTION

ADG1434YRUZ-REEL

PRODUCTION

ADG1434YRUZ-REEL7

PRODUCTION

Oct 13, 2008

- 06_0084

Qualification of the 8" H Wafer Fab process at Analog Devices, Limerick, Ireland.

ADG1434YCPZ-REEL7

PRODUCTION

ADG1434YRUZ

PRODUCTION

ADG1434YRUZ-REEL

PRODUCTION

ADG1434YRUZ-REEL7

PRODUCTION

Apr 5, 2021

- 21_0035

Amkor Philippines as an Alternate Site for TSSOP_4.4

ADG1434YRUZ

PRODUCTION

ADG1434YRUZ-REEL

PRODUCTION

ADG1434YRUZ-REEL7

PRODUCTION

Jul 23, 2014

- 13_0241

Qualification of ASE Chungli as an Alternate Assembly Site for Select 16L, 20L and 24L TSSOP Packages

Jan 20, 2012

- 11_0218

Halogen Free Material Change for Certain TSSOP Products at Carsem

ADG1434YRUZ

PRODUCTION

ADG1434YRUZ-REEL

PRODUCTION

ADG1434YRUZ-REEL7

PRODUCTION

Filter by Model

reset

Reset Filters

Part Models

Product Lifecycle

PCN

Jul 25, 2017

- 17_0068

arrow down

CANCELLED: Addition of ASE Korea as an Alternate Assembly Site for Select 3x3mm and 4x4mm Body Sizes LFCSP Devices

May 5, 2014

- 14_0020

arrow down

Conversion of 4x4mm body Size LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines.

Feb 15, 2010

- 07_0061

arrow down

LFCSP Package Manufacturing Line Transfer from Amkor Korea to Amkor PRC

Jan 27, 2009

- 09_0013

arrow down

Changes to Idd Specifications on ADG12xx, ADG14xx and ADG13xx datasheets

ADG1434YCPZ-REEL

PRODUCTION

ADG1434YCPZ-REEL7

PRODUCTION

ADG1434YRUZ

PRODUCTION

ADG1434YRUZ-REEL

PRODUCTION

ADG1434YRUZ-REEL7

PRODUCTION

Oct 13, 2008

- 06_0084

arrow down

Qualification of the 8" H Wafer Fab process at Analog Devices, Limerick, Ireland.

ADG1434YCPZ-REEL7

PRODUCTION

ADG1434YRUZ

PRODUCTION

ADG1434YRUZ-REEL

PRODUCTION

ADG1434YRUZ-REEL7

PRODUCTION

Apr 5, 2021

- 21_0035

arrow down

Amkor Philippines as an Alternate Site for TSSOP_4.4

ADG1434YRUZ

PRODUCTION

ADG1434YRUZ-REEL

PRODUCTION

ADG1434YRUZ-REEL7

PRODUCTION

Jul 23, 2014

- 13_0241

arrow down

Qualification of ASE Chungli as an Alternate Assembly Site for Select 16L, 20L and 24L TSSOP Packages

Jan 20, 2012

- 11_0218

arrow down

Halogen Free Material Change for Certain TSSOP Products at Carsem

ADG1434YRUZ

PRODUCTION

ADG1434YRUZ-REEL

PRODUCTION

ADG1434YRUZ-REEL7

PRODUCTION

Software & Part Ecosystem

Software & Part Ecosystem

Evaluation Kit

Evaluation Kits 1

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EVAL-24TSSOP

Evaluation Board for 24-Lead TSSOP Devices in the Switches and Multiplexers Portfolio

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EVAL-24TSSOP

Evaluation Board for 24-Lead TSSOP Devices in the Switches and Multiplexers Portfolio

Evaluation Board for 24-Lead TSSOP Devices in the Switches and Multiplexers Portfolio

Features and Benefits

  • 24-lead TSSOP evaluation board 
  • Clamp allows the main device to be easily changed 
  • Gold pin connectors allow the addition of passive components 
  • SMB connectors for the input/output of signals 
  • Additional space on-board to allow for prototyping 

Product Detail

The EVAL-24TSSOPEBZ evaluation board evaluates 24-lead TSSOP devices in the Switches and Multiplexers Portfolio that are purchased separately. A clamp is supplied with the EVAL-24TSSOPEBZ to secure a 24-lead TSSOP device to the evaluation board without the need for soldering, making the board reusable for multiple devices.


A 24-lead TSSOP device can be clamped or soldered to the center of the evaluation board. Each pin of the device has a corresponding link from K1 to K24 that can be set to either VDD or GND. A wire screw terminal supplies VDD and GND. SMB connectors on the board allow additional external signals to be supplied to the device. In addition, there is space available at the top of the board for prototyping.


Full specifications of the device under test (DUT) are available in the corresponding product data sheet, which should be consulted in conjunction with this user guide when using the evaluation board.

Tools & Simulations

Tools & Simulations 1

LTspice® is a powerful, fast and free simulation software, schematic capture and waveform viewer with enhancements and models for improving the simulation of analog circuits.

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