ADG1412
1.5 Ω On Resistance, ±15 V/+12 V/±5 V, iCMOS®, Quad SPST Switch
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Features
- 1.5 Ω on resistance
- 0.3 Ω on-resistance flatness
- 0.1 Ω on-resistance match between channels
- Continuous current per channel
- LFCSP: 250 mA
- TSSOP: 190 mA
- Fully specified at +12 V, ±15 V, and ±5 V
- No VL supply required
- 3 V logic-compatible inputs
- Rail-to-rail operation
- 16-lead TSSOP and 16-lead, 4 mm × 4 mm LFCSP
- AEC-Q100 qualified for automotive applications
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The ADG1411/ADG1412/ADG1413 are monolithic complementary metal-oxide semiconductor (CMOS) devices containing four independently selectable switches designed on an iCMOS® process. iCMOS (industrial CMOS) is a modular manufacturing process combining high voltage CMOS and bipolar technologies. It enables the development of a wide range of high performance analog ICs capable of 33 V operation in a footprint that no previous generation of high voltage devices has been able to achieve. Unlike analog ICs using conventional CMOS processes, iCMOS components can tolerate high supply voltages while providing increased performance, dramatically lower power consumption, and reduced package size.
The on-resistance profile is very flat over the full analog input range, ensuring excellent linearity and low distortion when switching signals.
iCMOS construction ensures ultralow power dissipation, making the devices ideally suited for portable and battery-powered instruments.
The ADG1411/ADG1412/ADG1413 contain four independent single-pole/single-throw (SPST) switches. The ADG1411 and ADG1412 differ only in that the digital control logic is inverted. The ADG1411 switches are turned on with Logic 0 on the appropriate control input, whereas the ADG1412 switches are turned on with Logic 1. The ADG1413 has two switches with digital control logic similar to that of the ADG1411; the logic is inverted on the other two switches. Each switch conducts equally well in both directions when on and has an input signal range that extends to the supplies. In the off condition, signal levels up to the supplies are blocked.
The ADG1413 exhibits break-before-make switching action for use in multiplexer applications. Inherent in the design is low charge injection, which results in minimum transients when the digital inputs are switched
Product Highlights
- 2.6 Ω maximum on resistance over temperature
- Minimum distortion
- Ultralow power dissipation: <0.03 μW
- 16-lead TSSOP and 16-lead, 4 mm × 4 mm LFCSP
Applications
- Automated test equipment
- Data acquisition systems
- Battery-powered systems
- Sample-and-hold systems
- Audio signal routing
- Video signal routing
- Communications systems
- Relay replacement
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Ask a Question
Submit your question below and we will return the best answer from ADI’s knowledge database:
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Analog Devices Support Portal is a one-stop shop to answer all your ADI questions.
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ADG1412
Documentation
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ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| ADG1412YCPZ-REEL |
16-Lead LFCSP (4mm x 4mm w/ EP)
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| ADG1412YCPZ-REEL7 |
16-Lead LFCSP (4mm x 4mm w/ EP)
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| ADG1412YRUZ |
16-Lead TSSOP
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| ADG1412YRUZ-REEL7 |
16-Lead TSSOP
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- ADG1412YCPZ-REEL
- Pin/Package Drawing
-
16-Lead LFCSP (4mm x 4mm w/ EP)
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- ADG1412YCPZ-REEL7
- Pin/Package Drawing
-
16-Lead LFCSP (4mm x 4mm w/ EP)
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- ADG1412YRUZ
- Pin/Package Drawing
-
16-Lead TSSOP
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
- ADG1412YRUZ-REEL7
- Pin/Package Drawing
-
16-Lead TSSOP
- Documentation
-
HTML
Material Declaration
-
HTML
Reliablity Data
- CAD Symbols, Footprints, and 3D Models
-
Ultra Librarian
-
SamacSys
Filter by Model
Part Models
Product Lifecycle
PCN
May 5, 2014
- 14_0020
Conversion of 4x4mm body Size LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines.
ADG1412YCPZ-REEL
PRODUCTION
ADG1412YCPZ-REEL7
PRODUCTION
Feb 15, 2010
- 07_0061
LFCSP Package Manufacturing Line Transfer from Amkor Korea to Amkor PRC
ADG1412YCPZ-REEL
PRODUCTION
ADG1412YCPZ-REEL7
PRODUCTION
Nov 16, 2009
- 06_0157
Qualification of the 8" H6 Thin Film BiPolar Wafer Fab Process at Analog Devices, Limerick, Ireland
ADG1412YCPZ-REEL
PRODUCTION
ADG1412YCPZ-REEL7
PRODUCTION
ADG1412YRUZ
PRODUCTION
ADG1412YRUZ-REEL7
PRODUCTION
Jan 27, 2009
- 09_0013
Changes to Idd Specifications on ADG12xx, ADG14xx and ADG13xx datasheets
ADG1412YCPZ-REEL
PRODUCTION
ADG1412YCPZ-REEL7
PRODUCTION
ADG1412YRUZ
PRODUCTION
ADG1412YRUZ-REEL7
PRODUCTION
Apr 5, 2021
- 21_0035
Amkor Philippines as an Alternate Site for TSSOP_4.4
ADG1412YRUZ
PRODUCTION
ADG1412YRUZ-REEL7
PRODUCTION
Jan 20, 2012
- 11_0218
Halogen Free Material Change for Certain TSSOP Products at Carsem
ADG1412YRUZ
PRODUCTION
ADG1412YRUZ-REEL7
PRODUCTION
Filter by Model
Part Models
Product Lifecycle
PCN
May 5, 2014
- 14_0020
Conversion of 4x4mm body Size LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines.
ADG1412YCPZ-REEL
PRODUCTION
ADG1412YCPZ-REEL7
PRODUCTION
Feb 15, 2010
- 07_0061
LFCSP Package Manufacturing Line Transfer from Amkor Korea to Amkor PRC
ADG1412YCPZ-REEL
PRODUCTION
ADG1412YCPZ-REEL7
PRODUCTION
Nov 16, 2009
- 06_0157
Qualification of the 8" H6 Thin Film BiPolar Wafer Fab Process at Analog Devices, Limerick, Ireland
ADG1412YCPZ-REEL
PRODUCTION
ADG1412YCPZ-REEL7
PRODUCTION
ADG1412YRUZ
PRODUCTION
ADG1412YRUZ-REEL7
PRODUCTION
Jan 27, 2009
- 09_0013
Changes to Idd Specifications on ADG12xx, ADG14xx and ADG13xx datasheets
ADG1412YCPZ-REEL
PRODUCTION
ADG1412YCPZ-REEL7
PRODUCTION
ADG1412YRUZ
PRODUCTION
ADG1412YRUZ-REEL7
PRODUCTION
Apr 5, 2021
- 21_0035
Amkor Philippines as an Alternate Site for TSSOP_4.4
ADG1412YRUZ
PRODUCTION
ADG1412YRUZ-REEL7
PRODUCTION
Jan 20, 2012
- 11_0218
Halogen Free Material Change for Certain TSSOP Products at Carsem
ADG1412YRUZ
PRODUCTION
ADG1412YRUZ-REEL7
PRODUCTION
Evaluation Kits 2
EVAL-16LFCSP
Evaluation Board for the 16-Lead LFCSP Devices in the Switches and Multiplexers Portfolio
Product Detail
The EVAL-16LFCSPEBZ enables easy evaluation of the 16-lead lead frame chip scale package (LFCSP) devices in the Switches and Multiplexers Portfolio that are purchased separately. The EVAL-16LFCSPEBZ is supplied with a clamshell socket to secure a 16-lead LFCSP device to the evaluation board without the need for soldering. In addition, there are three sets of gold pin connectors in each trace, for board flexibility and reusability for multiple evaluations.
Figure 1 in the user guide shows the EVAL-16LFCSPEBZ. A 16-lead LFCSP device can be inserted into the socket in the center of the evaluation board. Each device pin has a corresponding three-pin header link, from K1 to K16. This can either be connected to an external signal source by removing the corresponding link or use the link to choose between VDD or GND. A wire screw terminal, J5, supplies the VDD and GND. The Subminiature Version B (SMB) connectors on the EVAL-16LFCSPEBZ allow additional external signals to be supplied to the device. In addition, there is a perfboard space and two 16-lead LFCSP pads (3 mm x 3 mm and 2.1 mm x 2.1 mm) available on top of the EVAL-16LFCSPEBZ for prototyping.
The full specifications of the device under test (DUT) are available in the corresponding product data sheet, which must be consulted with the EVAL-16LFCSPEBZ user guide when using the EVAL-16LFCSPEBZ.
EVAL-16TSSOP
Evaluation Board for 16 lead TSSOP Devices in the Switch/Mux Portfolio
Product Detail
The EVAL-16TSSOPEBZ evaluation board evaluates 16-lead TSSOP devices in the Switches and Multiplexers Portfolio that are purchased separately. A clamp is supplied with the EVAL-16TSSOPEBZ to secure a 16-lead TSSOP device to the evaluation board without the need for soldering, making the board reusable for multiple devices.
A 16-lead TSSOP device can be clamped or soldered to the center of the evaluation board. Each pin of the device has a corresponding link from K1 to K16 that can be set to either VDD or GND. A wire screw terminal supplies VDD and GND. SMB connectors on the board allow additional external signals to be supplied to the device. In addition, there is space available at the top of the board for prototyping.
Full specifications of the device under test (DUT) are available in the corresponding product data sheet, which should be consulted in conjunction with this user guide when using the evaluation board.
Tools & Simulations 2
LTspice® is a powerful, fast and free simulation software, schematic capture and waveform viewer with enhancements and models for improving the simulation of analog circuits.
To launch ready-to-run LTspice demonstration circuits for this part:
Step 1: Download and install LTspice on your computer.
Step 2: Click on the link in the section below to download a demonstration circuit.
Step 3: If LTspice does not automatically open after clicking the link below, you can instead run the simulation by right clicking on the link and selecting “Save Target As.” After saving the file to your computer, start LTspice and open the demonstration circuit by selecting ‘Open’ from the ‘File’ menu.
Lt Spice
SPICE Model 1
