ADG1411
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ADG1411

1.5 Ω On Resistance, ±15 V/+12 V/±5 V, iCMOS®, Quad SPST Switch

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Info: : PRODUCTION tooltip
Part Details
Part Models 5
1ku List Price Starting From $3.22
Features
  • 1.5 Ω on resistance
  • 0.3 Ω on-resistance flatness
  • 0.1 Ω on-resistance match between channels
  • Continuous current per channel
    • LFCSP: 250 mA
    • TSSOP: 190 mA
  • Fully specified at +12 V, ±15 V, and ±5 V
  • No VL supply required
  • 3 V logic-compatible inputs
  • Rail-to-rail operation
  • 16-lead TSSOP and 16-lead, 4 mm × 4 mm LFCSP
  • AEC-Q100 qualified for automotive applications
Additional Details
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The ADG1411/ADG1412/ADG1413 are monolithic complementary metal-oxide semiconductor (CMOS) devices containing four independently selectable switches designed on an iCMOS® process. iCMOS (industrial CMOS) is a modular manufacturing process combining high voltage CMOS and bipolar technologies. It enables the development of a wide range of high performance analog ICs capable of 33 V operation in a footprint that no previous generation of high voltage devices has been able to achieve. Unlike analog ICs using conventional CMOS processes, iCMOS components can tolerate high supply voltages while providing increased performance, dramatically lower power consumption, and reduced package size.

The on-resistance profile is very flat over the full analog input range, ensuring excellent linearity and low distortion when switching signals.

iCMOS construction ensures ultralow power dissipation, making the devices ideally suited for portable and battery-powered instruments.

The ADG1411/ADG1412/ADG1413 contain four independent single-pole/single-throw (SPST) switches. The ADG1411 and ADG1412 differ only in that the digital control logic is inverted. The ADG1411 switches are turned on with Logic 0 on the appropriate control input, whereas the ADG1412 switches are turned on with Logic 1. The ADG1413 has two switches with digital control logic similar to that of the ADG1411; the logic is inverted on the other two switches. Each switch conducts equally well in both directions when on and has an input signal range that extends to the supplies. In the off condition, signal levels up to the supplies are blocked.

The ADG1413 exhibits break-before-make switching action for use in multiplexer applications. Inherent in the design is low charge injection, which results in minimum transients when the digital inputs are switched

Product Highlights

  1. 2.6 Ω maximum on resistance over temperature
  2. Minimum distortion
  3. Ultralow power dissipation: <0.03 μW
  4. 16-lead TSSOP and 16-lead, 4 mm × 4 mm LFCSP

Applications

  • Automated test equipment
  • Data acquisition systems
  • Battery-powered systems
  • Sample-and-hold systems
  • Audio signal routing
  • Video signal routing
  • Communications systems
  • Relay replacement
    Part Models 5
    1ku List Price Starting From $3.22

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    Documentation

    Documentation

    Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
    ADG1411WBCPZ-REEL
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    ADG1411YCPZ-REEL
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    ADG1411YCPZ-REEL7
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    ADG1411YRUZ
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    ADG1411YRUZ-REEL7
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    Filter by Model

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    Part Models

    Product Lifecycle

    PCN

    Feb 18, 2020

    - 20_0025

    ADG1411WBCPZ-REEL Assembly Site Transfer and Datasheet Specification Changes.

    May 4, 2016

    - 14_0178

    Conversion of 3x3mm, 4x4mm and 5x5mm LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines

    Feb 15, 2010

    - 07_0061

    LFCSP Package Manufacturing Line Transfer from Amkor Korea to Amkor PRC

    Nov 16, 2009

    - 06_0157

    Qualification of the 8" H6 Thin Film BiPolar Wafer Fab Process at Analog Devices, Limerick, Ireland

    ADG1411YCPZ-REEL

    PRODUCTION

    ADG1411YCPZ-REEL7

    PRODUCTION

    ADG1411YRUZ

    PRODUCTION

    ADG1411YRUZ-REEL7

    PRODUCTION

    Jan 27, 2009

    - 09_0013

    Changes to Idd Specifications on ADG12xx, ADG14xx and ADG13xx datasheets

    ADG1411YCPZ-REEL

    PRODUCTION

    ADG1411YCPZ-REEL7

    PRODUCTION

    ADG1411YRUZ

    PRODUCTION

    ADG1411YRUZ-REEL7

    PRODUCTION

    Apr 5, 2021

    - 21_0035

    Amkor Philippines as an Alternate Site for TSSOP_4.4

    Jan 20, 2012

    - 11_0218

    Halogen Free Material Change for Certain TSSOP Products at Carsem

    Filter by Model

    reset

    Reset Filters

    Part Models

    Product Lifecycle

    PCN

    Feb 18, 2020

    - 20_0025

    arrow down

    ADG1411WBCPZ-REEL Assembly Site Transfer and Datasheet Specification Changes.

    May 4, 2016

    - 14_0178

    arrow down

    Conversion of 3x3mm, 4x4mm and 5x5mm LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines

    Feb 15, 2010

    - 07_0061

    arrow down

    LFCSP Package Manufacturing Line Transfer from Amkor Korea to Amkor PRC

    Nov 16, 2009

    - 06_0157

    arrow down

    Qualification of the 8" H6 Thin Film BiPolar Wafer Fab Process at Analog Devices, Limerick, Ireland

    ADG1411YCPZ-REEL

    PRODUCTION

    ADG1411YCPZ-REEL7

    PRODUCTION

    ADG1411YRUZ

    PRODUCTION

    ADG1411YRUZ-REEL7

    PRODUCTION

    Jan 27, 2009

    - 09_0013

    arrow down

    Changes to Idd Specifications on ADG12xx, ADG14xx and ADG13xx datasheets

    ADG1411YCPZ-REEL

    PRODUCTION

    ADG1411YCPZ-REEL7

    PRODUCTION

    ADG1411YRUZ

    PRODUCTION

    ADG1411YRUZ-REEL7

    PRODUCTION

    Apr 5, 2021

    - 21_0035

    arrow down

    Amkor Philippines as an Alternate Site for TSSOP_4.4

    Jan 20, 2012

    - 11_0218

    arrow down

    Halogen Free Material Change for Certain TSSOP Products at Carsem

    Software & Part Ecosystem

    Software & Part Ecosystem

    Evaluation Kit

    Evaluation Kits 2

    reference details image

    EVAL-16LFCSP

    Evaluation Board for the 16-Lead LFCSP Devices in the Switches and Multiplexers Portfolio

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    EVAL-16LFCSP

    Evaluation Board for the 16-Lead LFCSP Devices in the Switches and Multiplexers Portfolio

    Evaluation Board for the 16-Lead LFCSP Devices in the Switches and Multiplexers Portfolio

    Features and Benefits

    • 16-lead, 4 mm × 4 mm LFCSP evaluation board
    • Easily changeable clamshell socket for the main device
    • Gold pin connectors for the addition of passive components
    • SMB connectors for the input and output of signals
    • Additional space on board for prototyping

    Product Detail

    The EVAL-16LFCSPEBZ enables easy evaluation of the 16-lead lead frame chip scale package (LFCSP) devices in the Switches and Multiplexers Portfolio that are purchased separately. The EVAL-16LFCSPEBZ is supplied with a clamshell socket to secure a 16-lead LFCSP device to the evaluation board without the need for soldering. In addition, there are three sets of gold pin connectors in each trace, for board flexibility and reusability for multiple evaluations.

    Figure 1 in the user guide shows the EVAL-16LFCSPEBZ. A 16-lead LFCSP device can be inserted into the socket in the center of the evaluation board. Each device pin has a corresponding three-pin header link, from K1 to K16. This can either be connected to an external signal source by removing the corresponding link or use the link to choose between VDD or GND. A wire screw terminal, J5, supplies the VDD and GND. The Subminiature Version B (SMB) connectors on the EVAL-16LFCSPEBZ allow additional external signals to be supplied to the device. In addition, there is a perfboard space and two 16-lead LFCSP pads (3 mm x 3 mm and 2.1 mm x 2.1 mm) available on top of the EVAL-16LFCSPEBZ for prototyping.

    The full specifications of the device under test (DUT) are available in the corresponding product data sheet, which must be consulted with the EVAL-16LFCSPEBZ user guide when using the EVAL-16LFCSPEBZ.

    reference details image

    EVAL-16TSSOP

    Evaluation Board for 16 lead TSSOP Devices in the Switch/Mux Portfolio

    zoom

    EVAL-16TSSOP

    Evaluation Board for 16 lead TSSOP Devices in the Switch/Mux Portfolio

    Evaluation Board for 16 lead TSSOP Devices in the Switch/Mux Portfolio

    Features and Benefits

    • 16 lead TSSOP evaluation board
    • Clamp to allow the main device to be changed easily
    • Gold pin connectors to allow the addition of passive components
    • SMB connectors for the input/output of signals
    • Additional space on board to allow for prototyping

    Product Detail

    The EVAL-16TSSOPEBZ evaluation board evaluates 16-lead TSSOP devices in the Switches and Multiplexers Portfolio that are purchased separately. A clamp is supplied with the EVAL-16TSSOPEBZ to secure a 16-lead TSSOP device to the evaluation board without the need for soldering, making the board reusable for multiple devices.

    A 16-lead TSSOP device can be clamped or soldered to the center of the evaluation board. Each pin of the device has a corresponding link from K1 to K16 that can be set to either VDD or GND. A wire screw terminal supplies VDD and GND. SMB connectors on the board allow additional external signals to be supplied to the device. In addition, there is space available at the top of the board for prototyping.

    Full specifications of the device under test (DUT) are available in the corresponding product data sheet, which should be consulted in conjunction with this user guide when using the evaluation board.

    Tools & Simulations

    Tools & Simulations 2

    LTspice® is a powerful, fast and free simulation software, schematic capture and waveform viewer with enhancements and models for improving the simulation of analog circuits.

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