ADG1404
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ADG1404

1.8 Ω Maximum On Resistance, ±15 V/12 V/±5 V, 4:1, iCMOS Multiplexer

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Info: : PRODUCTION tooltip
Info: : PRODUCTION tooltip
Part Details
Part Models 4
1ku List Price Starting From $3.42
Features
  • 1.5 Ω on resistance
  • 0.3 Ω on-resistance flatness
  • 0.1 Ω on-resistance match between channels
  • Up to 400 mA continuous current
  • Fully specified at +12 V, ±15 V, and ±5 V
  • No VL supply required
  • 3 V logic-compatible inputs
  • Rail-to-rail operation
  • 14-lead TSSOP and 4 mm × 4 mm, 16-lead LFCSP
Additional Details
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The ADG1404 is a complementary metal-oxide semiconductor (CMOS) analog multiplexer, comprising four single channels designed on an iCMOS® process. iCMOS (industrial CMOS) is a modular manufacturing process that combines high voltage CMOS and bipolar technologies. It enables the development of a wide range of high performance analog ICs capable of 33 V operation in a footprint that no previous generation of high voltage devices achieve. Unlike analog ICs using conventional CMOS processes, iCMOS components can tolerate high supply voltages while providing increased performance, dramatically lower power consumption, and reduced package size.

The on-resistance profile is very flat over the full analog input range, ensuring excellent linearity and low distortion when switching audio signals.

iCMOS construction ensures ultralow power dissipation, making the device ideally suited for portable and battery-powered instruments.

The ADG1404 switches one of four inputs to a common output, D, as determined by the 3-bit binary address lines, A0, A1, and EN. Logic 0 on the EN pin disables the device. Each switch conducts equally well in both directions when on and has an input signal range that extends to the supplies. In the off condition, signal levels up to the supplies are blocked. All switches exhibit break-before-make switching action. Inherent in the design is low charge injection for minimum transients when switching the digital inputs.

Product Highlights

  1. 2.6 Ω maximum on resistance over temperature.
  2. Minimum distortion.
  3. Ultralow power dissipation: <0.03 μW.
  4. 14-lead TSSOP and 16-lead, 4 mm × 4 mm LFCSP package.

Applications

  • Automatic test equipment
  • Data acquisition systems
  • Battery-powered systems
  • Sample-and-hold systems
  • Audio signal routing
  • Communication systems
  • Relay replacement
Part Models 4
1ku List Price Starting From $3.42

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Documentation

Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
ADG1404YCPZ-REEL
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ADG1404YCPZ-REEL7
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ADG1404YRUZ
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ADG1404YRUZ-REEL7
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Product Lifecycle

PCN

May 5, 2014

- 14_0020

Conversion of 4x4mm body Size LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines.

Feb 15, 2010

- 07_0061

LFCSP Package Manufacturing Line Transfer from Amkor Korea to Amkor PRC

Nov 16, 2009

- 06_0157

Qualification of the 8" H6 Thin Film BiPolar Wafer Fab Process at Analog Devices, Limerick, Ireland

ADG1404YCPZ-REEL

PRODUCTION

ADG1404YCPZ-REEL7

PRODUCTION

ADG1404YRUZ

PRODUCTION

ADG1404YRUZ-REEL7

PRODUCTION

Jan 27, 2009

- 09_0013

Changes to Idd Specifications on ADG12xx, ADG14xx and ADG13xx datasheets

ADG1404YCPZ-REEL

PRODUCTION

ADG1404YCPZ-REEL7

PRODUCTION

ADG1404YRUZ

PRODUCTION

ADG1404YRUZ-REEL7

PRODUCTION

Apr 5, 2021

- 21_0035

Amkor Philippines as an Alternate Site for TSSOP_4.4

Jan 20, 2012

- 11_0218

Halogen Free Material Change for Certain TSSOP Products at Carsem

Filter by Model

reset

Reset Filters

Part Models

Product Lifecycle

PCN

May 5, 2014

- 14_0020

arrow down

Conversion of 4x4mm body Size LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines.

Feb 15, 2010

- 07_0061

arrow down

LFCSP Package Manufacturing Line Transfer from Amkor Korea to Amkor PRC

Nov 16, 2009

- 06_0157

arrow down

Qualification of the 8" H6 Thin Film BiPolar Wafer Fab Process at Analog Devices, Limerick, Ireland

ADG1404YCPZ-REEL

PRODUCTION

ADG1404YCPZ-REEL7

PRODUCTION

ADG1404YRUZ

PRODUCTION

ADG1404YRUZ-REEL7

PRODUCTION

Jan 27, 2009

- 09_0013

arrow down

Changes to Idd Specifications on ADG12xx, ADG14xx and ADG13xx datasheets

ADG1404YCPZ-REEL

PRODUCTION

ADG1404YCPZ-REEL7

PRODUCTION

ADG1404YRUZ

PRODUCTION

ADG1404YRUZ-REEL7

PRODUCTION

Apr 5, 2021

- 21_0035

arrow down

Amkor Philippines as an Alternate Site for TSSOP_4.4

Jan 20, 2012

- 11_0218

arrow down

Halogen Free Material Change for Certain TSSOP Products at Carsem

Software & Part Ecosystem

Software & Part Ecosystem

Evaluation Kit

Evaluation Kits 2

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EVAL-14TSSOPEBZ

EVAL-14TSSOPEBZ Evaluation Board

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EVAL-14TSSOPEBZ

EVAL-14TSSOPEBZ Evaluation Board

EVAL-14TSSOPEBZ Evaluation Board

Features and Benefits

  • 14-lead TSSOP evaluation board 
  • Clamp allows the main device to be easily changed 
  • Gold pin connectors allow the addition of passive components 
  • SMB connectors for the input/output of signals 
  • Additional space on-board to allow for prototyping 

Product Detail

The EVAL-14TSSOPEBZ evaluation board evaluates 14-lead TSSOP devices in the Switches and Multiplexers Portfolio that must be purchased separately from the evaluation board. A clamp is supplied with the EVAL-14TSSOPEBZ to secure a 14-lead TSSOP device to the evaluation board without the need for soldering, making the board reusable for multiple devices.

A 14-lead TSSOP device can be clamped or soldered to the center of the evaluation board. Each pin of the device that the eval board evaluates has a corresponding link from K1 to K14 that can be set to either VDD or GND. A wire screw terminal supplies VDD and GND. SMB connectors on the board allow additional external signals to be supplied to the device. In addition, there is space available at the top of the board for prototyping.

For full details, see the corresponding product data sheet, which must be used in conjunction with this user guide when using the evaluation board.
reference details image

EVAL-16LFCSP

Evaluation Board for the 16-Lead LFCSP Devices in the Switches and Multiplexers Portfolio

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EVAL-16LFCSP

Evaluation Board for the 16-Lead LFCSP Devices in the Switches and Multiplexers Portfolio

Evaluation Board for the 16-Lead LFCSP Devices in the Switches and Multiplexers Portfolio

Features and Benefits

  • 16-lead, 4 mm × 4 mm LFCSP evaluation board
  • Easily changeable clamshell socket for the main device
  • Gold pin connectors for the addition of passive components
  • SMB connectors for the input and output of signals
  • Additional space on board for prototyping

Product Detail

The EVAL-16LFCSPEBZ enables easy evaluation of the 16-lead lead frame chip scale package (LFCSP) devices in the Switches and Multiplexers Portfolio that are purchased separately. The EVAL-16LFCSPEBZ is supplied with a clamshell socket to secure a 16-lead LFCSP device to the evaluation board without the need for soldering. In addition, there are three sets of gold pin connectors in each trace, for board flexibility and reusability for multiple evaluations.

Figure 1 in the user guide shows the EVAL-16LFCSPEBZ. A 16-lead LFCSP device can be inserted into the socket in the center of the evaluation board. Each device pin has a corresponding three-pin header link, from K1 to K16. This can either be connected to an external signal source by removing the corresponding link or use the link to choose between VDD or GND. A wire screw terminal, J5, supplies the VDD and GND. The Subminiature Version B (SMB) connectors on the EVAL-16LFCSPEBZ allow additional external signals to be supplied to the device. In addition, there is a perfboard space and two 16-lead LFCSP pads (3 mm x 3 mm and 2.1 mm x 2.1 mm) available on top of the EVAL-16LFCSPEBZ for prototyping.

The full specifications of the device under test (DUT) are available in the corresponding product data sheet, which must be consulted with the EVAL-16LFCSPEBZ user guide when using the EVAL-16LFCSPEBZ.

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