ADG1401
Info: : PRODUCTION
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ADG1401

1 Ω On Resistance, ±15 V/+12 V/±5 V, iCMOS SPST Switches

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Info: : PRODUCTION tooltip
Info: : PRODUCTION tooltip
Part Details
Part Models 3
1ku List Price Starting From $1.74
Features
  • 1 Ω on resistance
  • 0.2 Ω on resistance flatness
  • Up to 435 mA continuous current
  • 8-lead MSOP and 8-lead, 3 mm × 2 mm LFCSP packages
  • No VL supply required
  • 3 V logic-compatible inputs
  • Rail-to-rail operation
  • Fully specified at +12 V, ±15 V, ±5 V
Additional Details
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The ADG1401 / ADG1402 contain a single-pole/single-throw (SPST) switch. Figure 1 shows that with a logic input of 1, the switch of the ADG1401 is closed and that of the ADG1402 is open. Each switch conducts equally well in both directions when on and has an input signal range that extends to the supplies. In the off condition, signal levels up to the supplies are blocked.

The iCMOS® (industrial CMOS) modular manufacturing process combines high voltage, complementary metal-oxide semiconductor (CMOS) and bipolar technologies. It enables the development of a wide range of high performance analog ICs capable of 33 V operation in a footprint that no other generation of high voltage parts has achieved. Unlike analog ICs using conventional CMOS processes, iCMOS components can tolerate high supply voltages while providing increased performance, dramatically lower power consumption, and a reduced package size.

The on resistance profile is very flat over the full analog input range ensuring excellent linearity and low distortion when switching audio signals. The iCMOS construction ensures ultralow power dissipation, making the part ideally suited for portable and battery-powered instruments.

PRODUCT HIGHLIGHTS

  1. 1.3 Ω maximum on resistance at 25°C.
  2. Minimum distortion.
  3. 3 V logic-compatible digital inputs: VIH = 2.0 V, VIL = 0.8 V.
  4. No VL logic power supply required.
  5. 8-lead MSOP and 8-lead, 3 mm × 2 mm LFCSP packages.

APPLICATIONS

  • Automatic test equipment
  • Data acquisition systems
  • Battery-powered systems
  • Sample-and-hold systems
  • Audio signal routing
  • Video signal routing
  • Communication systems
  • Relay replacements
Part Models 3
1ku List Price Starting From $1.74

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Documentation

Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
ADG1401BCPZ-REEL7
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ADG1401BRMZ
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ADG1401BRMZ-REEL7
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Part Models

Product Lifecycle

PCN

Aug 8, 2022

- 22_0192

Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages

Aug 1, 2016

- 16_0035

Assembly Relocation of Select LFCSP, Mini-LFCSP and LFCSP Side Solderable Products to STATS ChipPAC China Jiangyin

Jan 5, 2015

- 14_0246

Qualification of ASE Chungli, as an Alternate Assembly Site for Select MSOP Devices

May 15, 2012

- 10_0006

Halogen Free Material Change for mini SOIC Products

Filter by Model

reset

Reset Filters

Part Models

Product Lifecycle

PCN

Aug 8, 2022

- 22_0192

arrow down

Qualification of an Alternate Adhesive Material and Molding Compound for Select LFCSP Packages

Aug 1, 2016

- 16_0035

arrow down

Assembly Relocation of Select LFCSP, Mini-LFCSP and LFCSP Side Solderable Products to STATS ChipPAC China Jiangyin

Jan 5, 2015

- 14_0246

arrow down

Qualification of ASE Chungli, as an Alternate Assembly Site for Select MSOP Devices

May 15, 2012

- 10_0006

arrow down

Halogen Free Material Change for mini SOIC Products

Software & Part Ecosystem

Software & Part Ecosystem

Evaluation Kit

Evaluation Kits 2

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EVAL-8MSOP

Evaluation Board for 8 lead MSOP Devices in the Switch/Mux Portfolio

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EVAL-8MSOP

Evaluation Board for 8 lead MSOP Devices in the Switch/Mux Portfolio

Evaluation Board for 8 lead MSOP Devices in the Switch/Mux Portfolio

Features and Benefits

  • 8 lead MSOP evaluation board
  • Clamp to allow the main device to be changed easily
  • Gold pin connectors to allow the addition of passive components
  • SMB connectors for the input/output of signals
  • Additional space on board to allow for prototyping

Product Detail

The EVAL-8MSOPEBZ is the evaluation board for the 8 lead MSOP devices in the switch/mux portfolio which are to be purchased separately. A clamp is supplied with the board so that the device can be secured to the board without the need for soldering. This makes the board reusable for multiple devices.


The device can be clamped or soldered to the center of the evaluation board. Each pin of the device is broke out to a link that can be set to either VDD or GND and a wire screw terminal is provided to supply VDD and GND.  SMB connectors are on the board allow for additional external signals to be supplied to the device. In addition, there is space at the top of the board available for prototyping.


Full specifications of the device under test are available in the product data sheet, which should be consulted in conjunction with this user guide when using the evaluation board.

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AD-PAARRAY3552R-SL

RF Front-end GaN Power Amplifier Biasing, Protection, and Control Reference Design

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AD-PAARRAY3552R-SL

RF Front-end GaN Power Amplifier Biasing, Protection, and Control Reference Design

RF Front-end GaN Power Amplifier Biasing, Protection, and Control Reference Design

Features and Benefits

  • Designed to cover full Tx signal chains with integrated MCU and user-friendly GUI for faster and easier integration
  • Supports fault event protection - overvoltage (OV), overcurrent (OC), and overtemperature (OT)
  • Supports ultrafast sub-µs GaN gate voltage switching ~ (<1 µs)
  • Supports ultrafast (<10 µs) fault event protection from detection up to GaN gate pinch-off
  • Wide range of gate bias voltages from -10 V to +10 V
  • Configurable power-up and power-down sequence

Product Detail

The AD-PAARRAY3552R-SL reference design provides control, protection, and proper biasing sequence for GaN power amplifier (PA) arrays. The design incorporates the AD3553R high-speed, dual-channel, 16-bit DAC to support the ultrafast sub-µs voltage settling time of GaN gates.

Key fault events, including overvoltage, overcurrent, and overtemperature, are effectively managed by the LTC7000, a static switch driver responsible for system fault protection.

The on-board MAX32666 ultralow-power ARM® Cortex®-M4 microprocessor provides essential debug and programming features for a comprehensive software development experience with the system. The system's firmware is built on ADI's open-source no-OS framework and includes a user-friendly graphical interface (GUI) for evaluation. Updates are easily applied through an SWD UART bootloader, streamlining prototyping.

The system can be powered by an external +48 V supply, requiring high current capabilities.

APPLICATIONS

  • 5G massive MIMOs
  • Macro base stations
Specifications
Fault Events
Fault Default Limit
Overvoltage +55 V
Overcurrent 3.5 A
Overtemperature 75°C
Output Ports
Port Name No. of ports
GaN gate ports 6
+48 V Gan drain ports 4
+5 V ports 5
Enable ports 2
Power Supply
External +48 V DC at 5 A
Operating Conditions
Temperature Range 45°C to +75°C
Tools & Simulations

Tools & Simulations 3

LTspice® is a powerful, fast and free simulation software, schematic capture and waveform viewer with enhancements and models for improving the simulation of analog circuits.

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