ADG1204
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ADG1204

Low Capacitance, Low Charge Injection, ±15 V/+12 V, 4:1 iCMOS Multiplexer

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Info: : PRODUCTION tooltip
Info: : PRODUCTION tooltip
Part Details
Part Models 5
1ku List Price Starting From $2.50
Features
  • 1.5 pF off source capacitance
  • <1 pC charge injection
  • 33 V supply range
  • 120 Ω on resistance
  • Fully specified at ±15 V, +12 V
  • No VL supply required
  • 3 V logic-compatible inputs
  • Rail-to-rail operation
  • 14-lead TSSOP and 12-lead LFCSP
  • Typical power consumption < 0.03 μW
Additional Details
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The ADG1204 is a complementary metal-oxide semiconductor (CMOS) analog multiplexer, comprising four single channels designed on an iCMOS (industrial CMOS) process. iCMOS® is a modular manufacturing process that combines high voltage CMOS and bipolar technologies. It enables the development of a wide range of high performance analog ICs capable of 33 V operation in a footprint that no previous generation of high voltage devices has been able to achieve. Unlike analog ICs using conventional CMOS processes, iCMOS components can tolerate high supply voltages while providing increased performance, dramatically lower power consumption, and reduced package size.

The ultralow capacitance and charge injection of this multiplexer makes it an ideal solution for data acquisition and sample-andhold applications, where low glitch and fast settling are required. Fast switching speed coupled with high signal bandwidth makes the device suitable for video signal switching. iCMOS construction ensures ultralow power dissipation, making the device ideally suited for portable and battery-powered instruments.

The ADG1204 switches one of four inputs to a common output, D, as determined by the 3-bit binary address lines: A0, A1, and EN. Logic 0 on the EN pin disables the device. Each switch conducts equally well in both directions when on and has an input signal range that extends to the supplies. In the off condition, signal levels up to the supplies are blocked. All switches exhibit break-before-make switching action.

Product Highlights

  1. 1. 1.5 pF off capacitance (±15 V supply).
  2. <1 pC charge injection.
  3. 3 V logic-compatible digital inputs: VIH = 2.0 V, VIL = 0.8 V.
  4. No VL logic power supply required.
  5. Ultralow power dissipation: <0.03 μW.
  6. 14-lead TSSOP and 12-lead, 3 mm × 3 mm LFCSP packages.

Applications

  • Automatic test equipment
  • Data acquisition systems
  • Battery-powered systems
  • Sample-and-hold systems
  • Audio signal routing
  • Video signal routing
  • Communication systems
Part Models 5
1ku List Price Starting From $2.50

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Documentation

Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
ADG1204YCPZ-500RL7
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ADG1204YCPZ-REEL7
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ADG1204YRUZ
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ADG1204YRUZ-REEL
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ADG1204YRUZ-REEL7
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Product Lifecycle

PCN

Feb 13, 2014

- 14_0038

Conversion of 3x3mm body Size LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines.

Nov 16, 2009

- 06_0157

Qualification of the 8" H6 Thin Film BiPolar Wafer Fab Process at Analog Devices, Limerick, Ireland

ADG1204YCPZ-500RL7

PRODUCTION

ADG1204YCPZ-REEL7

PRODUCTION

ADG1204YRUZ

PRODUCTION

ADG1204YRUZ-REEL

PRODUCTION

ADG1204YRUZ-REEL7

PRODUCTION

Oct 26, 2009

- 09_0202

Inclusion of Banding Tape for LFCSP REEL7 parts.

Jan 27, 2009

- 09_0013

Changes to Idd Specifications on ADG12xx, ADG14xx and ADG13xx datasheets

ADG1204YCPZ-500RL7

PRODUCTION

ADG1204YCPZ-REEL7

PRODUCTION

ADG1204YRUZ

PRODUCTION

ADG1204YRUZ-REEL

PRODUCTION

ADG1204YRUZ-REEL7

PRODUCTION

Apr 5, 2021

- 21_0035

Amkor Philippines as an Alternate Site for TSSOP_4.4

ADG1204YRUZ

PRODUCTION

ADG1204YRUZ-REEL

PRODUCTION

ADG1204YRUZ-REEL7

PRODUCTION

Jun 22, 2010

- 09_0217

Addition of Jiangsu Changjiang Electronics Technology (JCET) as an alternate Assembly source for 10L MSOP and 14L TSSOP,and Advanced Semiconductor Engineering (ASE) for 10L MSOP and 14L SOICN package.

Filter by Model

reset

Reset Filters

Part Models

Product Lifecycle

PCN

Feb 13, 2014

- 14_0038

arrow down

Conversion of 3x3mm body Size LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines.

Nov 16, 2009

- 06_0157

arrow down

Qualification of the 8" H6 Thin Film BiPolar Wafer Fab Process at Analog Devices, Limerick, Ireland

ADG1204YCPZ-500RL7

PRODUCTION

ADG1204YCPZ-REEL7

PRODUCTION

ADG1204YRUZ

PRODUCTION

ADG1204YRUZ-REEL

PRODUCTION

ADG1204YRUZ-REEL7

PRODUCTION

Oct 26, 2009

- 09_0202

arrow down

Inclusion of Banding Tape for LFCSP REEL7 parts.

Jan 27, 2009

- 09_0013

arrow down

Changes to Idd Specifications on ADG12xx, ADG14xx and ADG13xx datasheets

ADG1204YCPZ-500RL7

PRODUCTION

ADG1204YCPZ-REEL7

PRODUCTION

ADG1204YRUZ

PRODUCTION

ADG1204YRUZ-REEL

PRODUCTION

ADG1204YRUZ-REEL7

PRODUCTION

Apr 5, 2021

- 21_0035

arrow down

Amkor Philippines as an Alternate Site for TSSOP_4.4

ADG1204YRUZ

PRODUCTION

ADG1204YRUZ-REEL

PRODUCTION

ADG1204YRUZ-REEL7

PRODUCTION

Jun 22, 2010

- 09_0217

arrow down

Addition of Jiangsu Changjiang Electronics Technology (JCET) as an alternate Assembly source for 10L MSOP and 14L TSSOP,and Advanced Semiconductor Engineering (ASE) for 10L MSOP and 14L SOICN package.

Software & Part Ecosystem

Software & Part Ecosystem

Evaluation Kit

Evaluation Kits 1

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EVAL-14TSSOPEBZ

EVAL-14TSSOPEBZ Evaluation Board

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EVAL-14TSSOPEBZ

EVAL-14TSSOPEBZ Evaluation Board

EVAL-14TSSOPEBZ Evaluation Board

Features and Benefits

  • 14-lead TSSOP evaluation board 
  • Clamp allows the main device to be easily changed 
  • Gold pin connectors allow the addition of passive components 
  • SMB connectors for the input/output of signals 
  • Additional space on-board to allow for prototyping 

Product Detail

The EVAL-14TSSOPEBZ evaluation board evaluates 14-lead TSSOP devices in the Switches and Multiplexers Portfolio that must be purchased separately from the evaluation board. A clamp is supplied with the EVAL-14TSSOPEBZ to secure a 14-lead TSSOP device to the evaluation board without the need for soldering, making the board reusable for multiple devices.

A 14-lead TSSOP device can be clamped or soldered to the center of the evaluation board. Each pin of the device that the eval board evaluates has a corresponding link from K1 to K14 that can be set to either VDD or GND. A wire screw terminal supplies VDD and GND. SMB connectors on the board allow additional external signals to be supplied to the device. In addition, there is space available at the top of the board for prototyping.

For full details, see the corresponding product data sheet, which must be used in conjunction with this user guide when using the evaluation board.

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