Features and Benefits
- Frequency range of 5 MHz to 1800 MHz
- High gain of 25.8 dB at 1800 MHz
- Excellent reverse isolation: −37 dB typical
- Excellent NPR (MER) performance: 51 dB at 67 dBmV TCP
- Excellent return losses:
- −20 dB at 45 MHz to 1218 MHz
- −18 dB at 1218 MHz to 1800 MHz
- VDD operation: 5.0 V to 8.0 V
- Configurable dc current (total) from 250 mA to 530 mA
- 32-lead, 5 mm x 5 mm, LFCSP
The ADCA5191 is a medium power gain block amplifier that provides excellent linearity across a flexible bias range allowing power efficient design implementation for various applications.
The device provides 25.8 dB of flat gain up to 1800 MHz, making this ideal for Data Over Cable Service Interface Specification (DOCSIS) 4.0 downstream applications. The device is also well suited for upstream applications to 700 MHz as the output stage. It is conveniently packaged in an industry-standard, 5 mm × 5 mm, 32-lead, lead frame chip-scale package (LFCSP) with an exposed pad on the bottom of the package for improved thermal performance.
Product Lifecycle Recommended for New Designs
This product has been released to the market. The data sheet contains all final specifications and operating conditions. For new designs, ADI recommends utilization of these products.
Evaluation Kits (1)
The ADCA5191-EVALZ evaluation board consists of a 2-layer printed circuit board (PCB) fabricated from a 62 mil laminate mounted to an aluminum heat sink. The heat sink assists in providing thermal relief to the device as well as mechanical support to the PCB. Mounting holes on the heat sink allow attachment to larger heat sinks for improved thermal management.
The ADCA5191-EVALZ is populated with components to interface the IC to a typical CATV application. J1 (RF_IN) and J2 (RF_OUT) are 75 Ω, N type, male coaxial connectors. The respective RF traces of the ports have a 75 Ω characteristic impedance. The ADCA5191-EVALZ is populated with components suitable for use over the −40 °C to +100 °C operating temperature range of the ADCA5191.
Access to the supply voltage (VDD) and GND is through a 3-pin header (P1) on the ADCA5191-EVALZ.
RF traces are 75 Ω microstrip at the input and output RF connectors. The package ground leads and the exposed paddle connect directly to the ground plane. Multiple vias connect the LFCSP ground paddle to the bottom ground plane to provide adequate electrical conduction and thermal conduction to the heat sink. The transfer of heat from the ADCA5191-EVALZ ground to the heat sink is further facilitated by the insertion of a piece of indium approximately the footprint of the LFCSP between the ADCA5191-EVALZ bottom and the heat sink. There are no components on the bottom side of the PCB.
Consult the ADCA5191 data sheet in conjunction with the user guide when using the ADCA5191-EVALZ evaluation board.
Documentation & Resources
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal.View our quality and reliability program and certifications for more information.
|Part Number||Material Declaration||Reliability Data||Pin/Package Drawing||CAD Symbols, Footprints & 3D Models|
|ADCA5191ACPZ||Material Declaration||Reliability Data||32-Lead LFCSP (5mm x 5mm x 0.75mm w/ EP)|
|ADCA5191ACPZ-R7||Material Declaration||Reliability Data||32-Lead LFCSP (5mm x 5mm x 0.75mm w/ EP)|
|Wafer Fabrication Data|
Sample & Buy
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Pricing displayed is based on 1-piece. The USA list pricing shown is for budgetary use only, shown in United States dollars (FOB USA per unit), and is subject to change. International prices may vary due to local duties, taxes, fees and exchange rates.