New Content (1)
Features and Benefits
- Drop-in replacement for RFCM3327 and RFCM3328
- Total composite power: 73 dBmV
- High power gain: 25 dB at 1218 MHz
- Excellent linearity
- Very low distortion
- Composite triple beat: −80 dBc typical
- Composite second-order: −80 dBc typical
- Carrier to intermodulation noise: 59 dB typical
- Low noise figure: 3 dB typical at 45 MHz and 4 dB typical at 1218 MHz
- Unconditionally stable
- Configurable current: 350 mA to 480 mA at 24 V
- Temperature monitor
- 9-terminal thermally enhanced chip array small outline no lead cavity [LGA_CAV]
The Analog Devices, Inc., ADCA3270 is a 24 V power doubler, monolithic microwave IC (MMIC) with 25 dB of power gain. The device achieves high RF output up to 73 dBmV composite power under 18 dB tilt conditions by using advanced circuit design techniques with gallium arsenide (GaAs), pseudomorphic high electron transistor (pHEMT), and gallium nitride (GaN) HEMT technologies. The dc current and supply voltage can be adjusted externally for optimum distortion performance vs. power consumption over a range of output levels. The ADCA3270 provides high gain, simplifying the design and manufacturing of DOCSIS 3.1 infrastructure equipment.
The ADCA3270 is packaged in a 9-terminal thermally enhanced chip array small outline no lead cavity [LGA_CAV] with an industry-standard footprint.
Product Lifecycle Recommended for New Designs
This product has been released to the market. The data sheet contains all final specifications and operating conditions. For new designs, ADI recommends utilization of these products.
Evaluation Kits (1)
The ADCA3270-EVALZ evaluation board consists of a 2-layer printed circuit board (PCB) fabricated from a 32 mil laminate mounted to an aluminum heat sink. The heat sink assists in providing thermal relief to the device as well as mechanical support to the PCB. Mounting holes on the heat sink allow attachment to larger heat sinks for improved thermal management.
The ADCA3270-EVALZ is populated with components to interface the IC to a typical CATV application. J1 (RF_IN) and J2 (RF_OUT) are 75 Ω, N type, male connectors. The respective RF traces of the ports have a 75 Ω characteristic impedance. The ADCA3270-EVALZ is populated with components suitable for use over the −30°C to +110°C operating temperature range of the ADCA3270.
Access to VCC and GND is through a 3-pin header (P1) on the ADCA3270-EVALZ. The TSEN pin monitors the on-chip thermistor voltage.
RF traces are 75 Ω microstrip. Package ground leads and the exposed paddle connect directly to the ground plane. Multiple vias connect the LGA_CAV ground paddle to the bottom ground plane to provide adequate electrical conduction and thermal conduction to the heat sink. The transfer of heat from the ADCA3270-EVALZ ground to the heat sink is further facilitated by the insertion of a piece of indium approximately the footprint of the LGA_CAV between the ADCA3270-EVALZ bottom and the heat sink. There are no components on the bottom side of the PCB.
Consult the ADCA3270 data sheet in conjunction with the user guide when using the ADCA3270-EVALZ evaluation board.
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal.
Sample & Buy
The USA list pricing shown is for BUDGETARY USE ONLY, shown in United States dollars (FOB USA per unit for the stated volume), and is subject to change. International prices may differ due to local duties, taxes, fees and exchange rates. For volume-specific price or delivery quotes, please contact your local Analog Devices, Inc. sales office or authorized distributor. Pricing displayed for Evaluation Boards and Kits is based on 1-piece pricing.