AD842

NOT RECOMMENDED FOR NEW DESIGNS

Wideband, High Output Current, Fast Settling Op Amp

Data Sheet (Rev. F) Product Selection Table

Part Models: 7
1ku List Price: Starting From $7.79

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Part Details

Gain Bandwidth Product: 80 MHz (Gain = 2)
Fast Settling: 100 ns to 0.01% for a 10 V Step
Slew Rate: 375 V/µs
Stable at Gains of 2 or Greater
Full Power Bandwidth: 6.0 MHz for 20 V p-p
Input Offset Voltage: 1.5 mV max
Input Offset Drift: 14 µV/°C
Input Voltage Noise: 9 nV/√Hz typ
Open-Loop Gain: 90 V/mV into a 499 Ω Load
Output Current: 100 mA min
Quiescent Supply Current: 14 mA max

Part Models: 7
1ku List Price: Starting From $7.79

Documentation

Data Sheet 2

AD842: Wideband, High Output Current Fast Settling Op Amp Data Sheet (Rev.F) 03/19/2009

AD842: Military Data Sheet 01/01/2000

Application Note 2

AN-581: Biasing and Decoupling Op Amps in Single Supply Applications (Rev.0) 02/14/2015

AN-402: Replacing Output Clamping Op Amps with Input Clamping Amps 08/07/2023

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
AD842JNZ	14-Lead PDIP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD842JRZ-16	16-Lead SOIC Wide	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD842KNZ	14-Lead PDIP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD842SCHIPS	none available	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD842SE/883B	20 ld LCC	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD842SQ	14-Lead CerDIP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD842SQ/883B	14-Lead CerDIP	Material Declaration Reliablity Data	Ultra Librarian SamacSys

Part Models	Product Lifecycle	PCN
No Match Found
Mar 29, 2021 - 21_0033 Assembly Site Transfer for 14/16L 300_MIL PDIP to Cirtek
		PCN21_0033_Form Material_Report Detailed Change Description Qualification Results Summary
AD842JNZ
AD842KNZ
Aug 19, 2009 - 07_0024 Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad
		Material_Report Material_Report Parts List PCN07_0024_Form Qual Data
AD842JNZ
AD842KNZ
Aug 4, 2010 - 10_0117 Halogen Free Material Change for SOIC_W Products at Carsem
		PCN10_0117_Form Material_Report Reliability Report
AD842JRZ-16		PCN10_0117_Form Material_Report Reliability Report
Apr 9, 2018 - 16_0026 Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices
		PCN16_0026_Form Material_Report Qualification Results Summary
AD842SE/883B
AD842SQ/883B
Jun 6, 2012 - 12_0066 Add capacity for Burn In of Hermetic, 883 & QMLQ/Class B devices at TSSI Cavite
		PCN12_0066_Form Material_Report Qualification Report Summary
AD842SE/883B
AD842SQ/883B
Nov 9, 2011 - 11_0050 Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines
		PCN11_0050_Form Material_Report
AD842SE/883B
AD842SQ
AD842SQ/883B
Nov 9, 2011 - 11_0182 Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
		PCN11_0182_Form Material_Report
AD842SE/883B
AD842SQ
AD842SQ/883B
Nov 7, 2012 - 12_0199 Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.
		PCN12_0199_Form Material_Report Qualification Report Summary Datasheet Specification Comparison
AD842SQ
AD842SQ/883B

This is the most up-to-date revision of the Data Sheet.

Tools & Simulations

VRMS/dBm/dBu/dBV calculators

A utility to convert between standard units of power measurement and signal strength.

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Power Dissipation vs Die Temp

This tool estimates die temperature and power dissipation based on the supply voltages, ambient temperature, load characteristics, and package thermal data.

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