AD767
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AD767

Microprocessor-Compatible 12-Bit D/A Converter

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warning : NOT RECOMMENDED FOR NEW DESIGNS tooltip
Part Models 9
1ku List Price Starting From $25.44
Features
  • Complete 12-Bit D/A Function
    On-chip Output Amplifier
    High Stability Buried Zener Reference
  • Fast 40 ns Write Pulse
  • 0.3" Skinny DIP and PLCC Packages
  • Single Chip Construction
  • Monotonicity Guaranteed Over Temperature
  • Settling time: 3 µs max to 1/2 LSB
  • Guaranteed for Operation with ±12 V or ±15 V Supplies
  • TTL/5 V CMOS Compatible Logic Inputs
  • MIL-STD-883 Compliant Versions Available
Additional Details
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The AD767 is a complete voltage output 12-bit digital-to-analog converter including high stability buried Zener reference and input latch on a single chip. The converter uses 12 precision high-speed bipolar current steering switches and a laser-trimmed thin-film resistor network to provide high accuracy.

Microprocessor compatibility is achieved by the on-chip latch. The design of the input latch allows direct interface to 12-bit buses. The latch responds to strobe pulses as short as 40 ns, allowing use with the fastest available microprocessors.

The functional completeness and high performance of the AD767 result from a combination of advanced switch design, high-speed bipolar manufacturing process, and the proven laser wafer-trimming (LWT) technology.

The subsurface (buried) Zener diode on the chip provides a low-noise voltage reference which has long-term stability and temperature drift characteristics comparable to the best discrete reference diodes. The laser trimming process which provides the excellent linearity is also used to trim the absolute value of the reference as well as its temperature coefficient. The AD767 is thus well suited for wide temperature range performance with ±½ LSB maximum linearity error and guaranteed monotonicity over the full temperature range. Typical full-scale gain is 5 ppm/ºC.

Part Models 9
1ku List Price Starting From $25.44

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Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
5962-8961701LA
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AD767AD
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AD767BD
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AD767JNZ
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AD767JPZ
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AD767JPZ-REEL
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AD767KNZ
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AD767KPZ
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AD767SD/883B
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Part Models

Product Lifecycle

PCN

Apr 9, 2018

- 16_0026

Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices

Jun 6, 2012

- 12_0066

Add capacity for Burn In of Hermetic, 883 & QMLQ/Class B devices at TSSI Cavite

Nov 9, 2011

- 11_0050

Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines

5962-8961701LA

AD767AD

PRODUCTION

AD767BD

PRODUCTION

AD767SD/883B

Nov 9, 2011

- 11_0182

Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines

5962-8961701LA

AD767AD

PRODUCTION

AD767BD

PRODUCTION

AD767JNZ

PRODUCTION

AD767JPZ

PRODUCTION

AD767JPZ-REEL

PRODUCTION

AD767KNZ

PRODUCTION

AD767KPZ

PRODUCTION

AD767SD/883B

Mar 7, 2019

- 19_0046

Assembly Transfer of 18,20,24,28 Lead PDIP to Cirtek

Aug 19, 2009

- 07_0024

Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad

Filter by Model

reset

Reset Filters

Part Models

Product Lifecycle

PCN

Apr 9, 2018

- 16_0026

arrow down

Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices

Jun 6, 2012

- 12_0066

arrow down

Add capacity for Burn In of Hermetic, 883 & QMLQ/Class B devices at TSSI Cavite

Nov 9, 2011

- 11_0050

arrow down

Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines

5962-8961701LA

AD767AD

PRODUCTION

AD767BD

PRODUCTION

AD767SD/883B

Nov 9, 2011

- 11_0182

arrow down

Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines

5962-8961701LA

AD767AD

PRODUCTION

AD767BD

PRODUCTION

AD767JNZ

PRODUCTION

AD767JPZ

PRODUCTION

AD767JPZ-REEL

PRODUCTION

AD767KNZ

PRODUCTION

AD767KPZ

PRODUCTION

AD767SD/883B

Mar 7, 2019

- 19_0046

arrow down

Assembly Transfer of 18,20,24,28 Lead PDIP to Cirtek

Aug 19, 2009

- 07_0024

arrow down

Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad

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