AD7226
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AD7226

LC2CMOS, Quad 8-Bit Voltage Output DAC

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warning : NOT RECOMMENDED FOR NEW DESIGNS tooltip
warning : NOT RECOMMENDED FOR NEW DESIGNS tooltip
Part Details
Part Models 10
1ku List Price Starting From $10.92
Features
  • Four 8-Bit DACs with Output Amplifiers
  • Skinny 20-Lead DIP, SOIC, SSOP, and PLCC Packages
  • Microprocessor-Compatible
  • TTL/CMOS-Compatible
  • No User Trims
  • Extended Temperature Range Operation
  • Single Supply Operation Possible
Additional Details
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NEWER ALTERNATIVES:

  • AD5304 2.5 V to 5.5 V, 500 µA, Quad Voltage Output 8-Bit DAC in a 10-Lead Packages
  • AD5307 2.5 V to 5.5 V, 400 µA, Quad Voltage Output 8-Bit DAC in a 16-Lead TSSOP

The AD7226 contains four 8-bit voltage-output digital-to-analog converters, with output buffer amplifiers and interface logic on a single monolithic chip. No external trims are required to achieve full specified performance for the part.

Separate on-chip latches are provided for each of the four D/A converters. Data is transferred into one of these data latches through a common 8-bit TTL/CMOS (5 V) compatible input port. Control inputs A0 and A1 determine which DAC is loaded when WR goes low. The control logic is speed-compatible with most 8-bit microprocessors.

Each D/A converter includes an output buffer amplifier capable of driving up to 5 mA of output current. The amplifiers’ offsets are laser-trimmed during manufacture, thereby eliminating any requirement for offset nulling.

Specified performance is guaranteed for input reference voltages from 2 V to 12.5 V with dual supplies. The part is also specified for single supply operation at a reference of 10 V.

The AD7226 is fabricated in an all ion-implanted high speed Linear Compatible CMOS (LC2MOS) process which has been specifically developed to allow high speed digital logic circuits and precision analog circuits to be integrated on the same chip.

APPLICATIONS

  • Process control
  • Automatic Test Equipment
  • Automatic Calibration of Large System Parameters
Part Models 10
1ku List Price Starting From $10.92

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Documentation

Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
5962-87802012A
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5962-8780201RA
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AD7226BQ
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AD7226BRSZ
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AD7226KNZ
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AD7226KPZ
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AD7226KPZ-REEL
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AD7226KRZ
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AD7226KRZ-REEL
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AD7226TQ
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Product Lifecycle

PCN

Apr 9, 2018

- 16_0026

Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices

Nov 9, 2011

- 11_0050

Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines

5962-87802012A

PRODUCTION

5962-8780201RA

AD7226BQ

AD7226TQ

Nov 9, 2011

- 11_0182

Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines

5962-87802012A

PRODUCTION

5962-8780201RA

AD7226BQ

AD7226TQ

Feb 8, 2010

- 04_0080

Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland.

5962-87802012A

PRODUCTION

5962-8780201RA

AD7226BQ

AD7226KNZ

PRODUCTION

AD7226KPZ

PRODUCTION

AD7226KPZ-REEL

PRODUCTION

AD7226KRZ

PRODUCTION

AD7226KRZ-REEL

PRODUCTION

AD7226TQ

Feb 1, 2010

- 10_0020

Test Solutions Services, Inc.(TSSI) as Subcontractor Burn-in Facility.

5962-87802012A

PRODUCTION

5962-8780201RA

Nov 7, 2012

- 12_0199

Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.

Aug 25, 2010

- 10_0065

Halogen Free Material Change for SSOP Products at Carsem

Mar 7, 2019

- 19_0046

Assembly Transfer of 18,20,24,28 Lead PDIP to Cirtek

Aug 19, 2009

- 07_0024

Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad

Feb 7, 2011

- 10_0003

Halogen Free Material Change for SOIC Wide Body Products Assembled at Amkor

AD7226KRZ

PRODUCTION

AD7226KRZ-REEL

PRODUCTION

Filter by Model

reset

Reset Filters

Part Models

Product Lifecycle

PCN

Apr 9, 2018

- 16_0026

arrow down

Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices

Nov 9, 2011

- 11_0050

arrow down

Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines

5962-87802012A

PRODUCTION

5962-8780201RA

AD7226BQ

AD7226TQ

Nov 9, 2011

- 11_0182

arrow down

Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines

5962-87802012A

PRODUCTION

5962-8780201RA

AD7226BQ

AD7226TQ

Feb 8, 2010

- 04_0080

arrow down

Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland.

5962-87802012A

PRODUCTION

5962-8780201RA

AD7226BQ

AD7226KNZ

PRODUCTION

AD7226KPZ

PRODUCTION

AD7226KPZ-REEL

PRODUCTION

AD7226KRZ

PRODUCTION

AD7226KRZ-REEL

PRODUCTION

AD7226TQ

Feb 1, 2010

- 10_0020

arrow down

Test Solutions Services, Inc.(TSSI) as Subcontractor Burn-in Facility.

5962-87802012A

PRODUCTION

5962-8780201RA

Nov 7, 2012

- 12_0199

arrow down

Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.

Aug 25, 2010

- 10_0065

arrow down

Halogen Free Material Change for SSOP Products at Carsem

Mar 7, 2019

- 19_0046

arrow down

Assembly Transfer of 18,20,24,28 Lead PDIP to Cirtek

Aug 19, 2009

- 07_0024

arrow down

Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad

Feb 7, 2011

- 10_0003

arrow down

Halogen Free Material Change for SOIC Wide Body Products Assembled at Amkor

AD7226KRZ

PRODUCTION

AD7226KRZ-REEL

PRODUCTION

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