AD648S
Info: : PRODUCTION
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AD648S

Aerospace Dual Precision, Low Power BiFET Op Amp

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Info: : PRODUCTION tooltip
Info: : PRODUCTION tooltip
Part Details
Part Models 5
1ku List Price
price unavailable
Features
  • DC Performance:
    Quiescent Current: 400 µA Max
    Bias Current: 10pA Max
    Noise: 2µV p-p typical, 0.1 to 10Hz
  • AC Performance:
    Slew Rate: 1.8V/µs typical
    Unity Gain Bandwidth: 1MHz typical
Additional Details
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The AD648 is a matched pair of low-power, precision monolithic operational amplifiers. It offers both low bias current (10pA max, warmed up) and low quiescent current (400µA max) and is fabricated with ion-implanted FET and laser wafer trimming technologies. Input bias current is guaranteed over the AD648's entire common-mode voltage range.

The AD648 is recommended for any dual supply op amp application requiring low power and excellent DC and AC performance. In applications such as battery-powered, precision instrument front ends and CMOS DAC buffers, the AD648's excellent combination of low input offset voltage and drift, low bias current and low 1/f noise reduces output errors. High common-mode rejection and high open-loop gain ensures better then 12-bit linearity in high impedance, buffer applications.

Part Models 5
1ku List Price
price unavailable

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Documentation

Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
5962-9753501VGA
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5962-9753501VPA
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5962-9753502VGA
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5962-9753502VPA
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AD648-000C
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Part Models

Product Lifecycle

PCN

Sep 29, 2022

- 22_0195

Shipment Carrier Change for TO-99 Header Package

Jul 30, 2018

- 16_0026

Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices

5962-9753501VGA

5962-9753501VPA

5962-9753502VGA

5962-9753502VPA

Nov 18, 2015

- 15_0219

Laser Marking Standardization for Aerospace Packages

5962-9753501VGA

5962-9753501VPA

5962-9753502VGA

5962-9753502VPA

Oct 2, 2013

- 13_0163

Qualify TSSI Cavite, Phils for Burn-in and Life Test of MIL-PRF-38535 QMLV Aerospace Devices

5962-9753501VGA

5962-9753501VPA

5962-9753502VGA

5962-9753502VPA

Nov 9, 2011

- 11_0050

Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines

5962-9753501VGA

5962-9753501VPA

5962-9753502VGA

5962-9753502VPA

Nov 9, 2011

- 11_0182

Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines

5962-9753501VGA

5962-9753501VPA

5962-9753502VGA

5962-9753502VPA

Nov 7, 2012

- 12_0199

Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.

Feb 9, 2009

- 08_0073

Change of Seal Glass Material for Cerdip & Cerpak Packages

Filter by Model

reset

Reset Filters

Part Models

Product Lifecycle

PCN

Sep 29, 2022

- 22_0195

arrow down

Shipment Carrier Change for TO-99 Header Package

Jul 30, 2018

- 16_0026

arrow down

Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices

5962-9753501VGA

5962-9753501VPA

5962-9753502VGA

5962-9753502VPA

Nov 18, 2015

- 15_0219

arrow down

Laser Marking Standardization for Aerospace Packages

5962-9753501VGA

5962-9753501VPA

5962-9753502VGA

5962-9753502VPA

Oct 2, 2013

- 13_0163

arrow down

Qualify TSSI Cavite, Phils for Burn-in and Life Test of MIL-PRF-38535 QMLV Aerospace Devices

5962-9753501VGA

5962-9753501VPA

5962-9753502VGA

5962-9753502VPA

Nov 9, 2011

- 11_0050

arrow down

Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines

5962-9753501VGA

5962-9753501VPA

5962-9753502VGA

5962-9753502VPA

Nov 9, 2011

- 11_0182

arrow down

Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines

5962-9753501VGA

5962-9753501VPA

5962-9753502VGA

5962-9753502VPA

Nov 7, 2012

- 12_0199

arrow down

Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.

Feb 9, 2009

- 08_0073

arrow down

Change of Seal Glass Material for Cerdip & Cerpak Packages

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