AD637
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AD637

High Precision, Wideband RMS-to-DC Converter

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Info: : PRODUCTION tooltip
Info: : PRODUCTION tooltip
Part Models 15
1ku List Price Starting From $17.34
Features
  • High accuracy
    0.02% maximum nonlinearity, 0 V to 2 V rms input
    0.10% additional error to crest factor of 3
  • Computes
    True rms
    Square
    Mean square
    Absolute value
  • dB output (60 dB range)
  • Wide bandwidth
    8 MHz at 2 V rms input
    600 kHz at 100 mV rms
  • Chip select/power-down feature allows
    Analog three-state operation
    Quiescent current reduction from 2.2 mA to 350 μA
  • 14-lead SBDIP, 14-lead low cost CERDIP, and 16-lead SOIC_W
Additional Details
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The AD637 is a complete, high accuracy, rms-to-dc converter that computes the true rms value of any complex waveform. It offers performance that is unprecedented in integrated circuit rms-to-dc converters and comparable to discrete and modular techniques in accuracy, bandwidth, and dynamic range. The AD637 computes the true root mean square, mean square, or absolute value of any complex ac (or ac plus dc) input waveform and gives an equivalent dc output voltage. The true rms value of a waveform is more useful than an average rectified signal because it relates directly to the power of the signal. The rms value of a statistical signal relates to the standard deviation of the signal.

Superior crest factor compensation permits measurements of signals with crest factors of up to 10 with less than 1% additional error. The wide bandwidth of the AD637 permits the measurement of signals up to 600 kHz with inputs of 200 mV rms and up to 8 MHz when the input levels are above 1 V rms.

Direct dB value of the rms output with a range of 60 dB is available on a separate pin. An externally programmed reference current allows the user to select the 0 dB reference voltage to correspond to any level between 0.1 V and 2.0 V rms.

A chip select connection on the AD637 permits the user to decrease the supply current from 2.2 mA to 350 µA during periods when the rms function is not in use. This feature facilitates the addition of precision rms measurement to remote or handheld applications where minimum power consumption is critical. In addition, when the AD637 is powered down, the output goes to a high impedance state. This allows several AD637s to be tied together to form a wideband true rms multiplexer.

The input circuitry of the AD637 is protected from overload voltages in excess of the supply levels. The inputs are not damaged by input signals if the supply voltages are lost.

The AD637 is laser wafer trimmed to achieve rated performance without external trimming. The only external component required is a capacitor that sets the averaging period. The value of this capacitor also determines low frequency accuracy, ripple level, and settling time.

The on-chip buffer amplifier is used either as an input buffer or in an active filter configuration. The filter can be used to reduce the amount of ac ripple, thereby increasing accuracy.

The AD637 is available in accuracy Grade J and Grade K for commercial temperature range (0°C to 70°C) applications, accuracy Grade A and Grade B for industrial range (−40°C to +85°C) applications, and accuracy Grade S rated over the −55°C to +125°C temperature range. All versions are available in hermetically sealed, 14-lead SBDIP, 14-lead CERDIP, and 16-lead SOIC_W packages.

Part Models 15
1ku List Price Starting From $17.34

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Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
5962-8963701CA
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AD637AQ
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AD637ARZ
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AD637BRZ
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AD637JDZ
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AD637JQ
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AD637JRZ
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AD637JRZ-R7
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AD637JRZ-RL
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AD637KDZ
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AD637KQ
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AD637KRZ
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AD637SD
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AD637SD/883B
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AD637SQ/883B
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Part Models

Product Lifecycle

PCN

Apr 9, 2018

- 16_0026

Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices

Nov 7, 2012

- 12_0199

Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.

Jun 6, 2012

- 12_0066

Add capacity for Burn In of Hermetic, 883 & QMLQ/Class B devices at TSSI Cavite

Nov 9, 2011

- 11_0050

Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines

5962-8963701CA

AD637AQ

AD637JDZ

AD637JQ

AD637KDZ

PRODUCTION

AD637KQ

AD637SD

AD637SD/883B

AD637SQ/883B

Nov 9, 2011

- 11_0182

Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines

5962-8963701CA

AD637AQ

AD637JDZ

AD637JQ

AD637KDZ

PRODUCTION

AD637KQ

AD637SD

AD637SD/883B

AD637SQ/883B

Aug 4, 2010

- 10_0117

Halogen Free Material Change for SOIC_W Products at Carsem

AD637ARZ

AD637BRZ

AD637JRZ

AD637JRZ-R7

AD637JRZ-RL

AD637KRZ

Filter by Model

reset

Reset Filters

Part Models

Product Lifecycle

PCN

Apr 9, 2018

- 16_0026

arrow down

Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices

Nov 7, 2012

- 12_0199

arrow down

Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.

Jun 6, 2012

- 12_0066

arrow down

Add capacity for Burn In of Hermetic, 883 & QMLQ/Class B devices at TSSI Cavite

Nov 9, 2011

- 11_0050

arrow down

Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines

5962-8963701CA

AD637AQ

AD637JDZ

AD637JQ

AD637KDZ

PRODUCTION

AD637KQ

AD637SD

AD637SD/883B

AD637SQ/883B

Nov 9, 2011

- 11_0182

arrow down

Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines

5962-8963701CA

AD637AQ

AD637JDZ

AD637JQ

AD637KDZ

PRODUCTION

AD637KQ

AD637SD

AD637SD/883B

AD637SQ/883B

Aug 4, 2010

- 10_0117

arrow down

Halogen Free Material Change for SOIC_W Products at Carsem

AD637ARZ

AD637BRZ

AD637JRZ

AD637JRZ-R7

AD637JRZ-RL

AD637KRZ

Software & Part Ecosystem

Evaluation Kits 1

EVAL-AD637

AD637 Evaluation Board

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EVAL-AD637

AD637 Evaluation Board

AD637 Evaluation Board

Product Detail

The AD637-EVALZ is available on-line and is fully tested and ready for bench testing after connecting power and signal I/O. The circuit is configured for dual power supplies, and standard BNC connectors serve as the signal input and output ports. See the AD637 data sheet for schematics and further details.

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