Overview
Features and Benefits
- Single Chip Construction
- Very High Speed Settling to 1/2 LSB
AD565A: 250 ns max - Full-Scale Switching Time: 30 ns
- Guaranteed for Operation with ±12 V (AD565A) Supplies
- Low Cost
- Linearity Guaranteed Over temperature 1/2 LSB max (K, T Grades)
- Monotonicity Guaranteed Over temperature
- Low Power = 225mW max
- Use with On-Board High Stability Reference
Product Details
The AD565A and AD566A are fast 12-bit digital-to-analog converters which incorporate the latest advances in analog circuit design to achieve high speeds at low cost.
The AD565A and AD566A use 12 precision, high-speed bipolar current-steering switches, control amplifier and a laser-trimmed thin-film resistor network to produce a very fast, high accuracy analog output current. The AD565A also includes a buried Zener reference that features low-noise, long-term stability and temperature drift characteristics comparable to the best discrete reference diodes.
The combination of performance and flexibility in the AD565A and AD566A has resulted from major innovations in circuit design, an important new high-speed bipolar process, and continuing advances in laser-wafer-trimming techniques (LWT). The AD565A and AD566A have a 10-90% full-scale transition time less than 35 ns and settle to within ±1/2 LSB in 250 ns max (350 ns for AD566A). Both are laser-trimmed at the wafer level to ±1/8 LSB typical linearity and are specified to ±1/4 LSB max error (K and T grades) at +25°C. High speed and accuracy make the AD565A and AD566A the ideal choice for high-speed display drivers as well as fast analog-to-digital converters.
The laser trimming process which provides the excellent linearity is also used to trim both the absolute value and the temperature coefficient of the reference of the AD565A resulting in a typical full-scale gain TC of 10 ppm/°C. When tighter TC performance is required or when a system reference is available, the AD566A may be used with an external reference.
AD565A and AD566A are available in four performance grades. The J and K are specified for use over the 0°C to +70°C temperature range while the S and T grades are specified for the -55&176;C to +125°C range. The D grades are all packaged in a 24-pin, hermetically sealed, ceramic, dual-in-line package. The JR grade is packaged in a 28-pin plastic SOIC.
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Product Lifecycle
Not Recommended for New Designs
This designates products ADI does not recommend broadly for new designs.
Documentation & Resources
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JAN to Generic Cross Reference1/22/2009
Design Resources
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal.View our quality and reliability program and certifications for more information.
Part Number | Material Declaration | Reliability Data | Pin/Package Drawing | CAD Symbols, Footprints & 3D Models |
---|---|---|---|---|
AD41454 | Material Declaration | Reliability Data | CHIPS OR DIE | |
AD565AJD | Material Declaration | Reliability Data | 24 ld Side-Brazed CerDIP | |
AD565AJRZ | Material Declaration | Reliability Data | 28-Lead SOIC (Wide) | |
AD565AJRZ-REEL | Material Declaration | Reliability Data | 28-Lead SOIC (Wide) | |
AD565AKD | Material Declaration | Reliability Data | 24 ld Side-Brazed CerDIP | |
AD565ASD | Material Declaration | Reliability Data | 24 ld Side-Brazed CerDIP | |
AD565ASD/883B | Material Declaration | Reliability Data | 24 ld Side-Brazed CerDIP | |
AD565ATD | Material Declaration | Reliability Data | 24 ld Side-Brazed CerDIP | |
AD565ATD/883B | Material Declaration | Reliability Data | 24 ld Side-Brazed CerDIP | |
JM38510/12103BJA | Material Declaration | Reliability Data | 24 ld Side-Brazed CerDIP | |
Wafer Fabrication Data |
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