AD524S
Info: : PRODUCTION
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AD524S

Aerospace Instrumentation Amplifier

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Info: : PRODUCTION tooltip
Info: : PRODUCTION tooltip
Part Details
Part Models 2
1ku List Price
price unavailable
Features
  • Low Noise
  • Low Nonlinearity
  • High CMRR
  • Low Offset Voltage
  • Low Offset Voltage Drift
  • Gain Bandwidth Product: 25 MHz
  • Pin Programmable Gains of 1, 10, 100, 1000
  • Input Protection, Power On–Power Off
  • No External Components Required
  • Internally Compensated
Additional Details
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The AD524 is a precision monolithic instrumentation amplifier designed for data acquisition applications requiring high accuracy under worst-case operating conditions. An outstanding combination of high linearity, high common mode rejection, low offset voltage drift, and low noise makes the AD524 suitable for use in many data acquisition systems.

The AD524 has a low output offset voltage drift and low input offset voltage drift. In addition to the outstanding dc specifications the AD524 also has a 25MHz gain bandwidth product (G = 1000). To make it suitable for high speed data ac-quisition systems the AD524 has an output slew rate of 5 V/µs and settles in 15µs to 0.01% for gains of 1 to 100.

As a complete amplifier the AD524 does not require any external components for fixed gains of 1, 10, 100 and 1,000. For other gain settings between 1 and 1000 only a single resistor is required. The AD524 input is fully protected for both power on and power off fault conditions.

Part Models 2
1ku List Price
price unavailable

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Documentation

Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
5962R8853901V2A
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Product Lifecycle

PCN

Jul 30, 2018

- 16_0026

Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices

Feb 27, 2017

- 17_0028

AD524S Change in Wafer Diameter for Aerospace Models

Nov 18, 2015

- 15_0219

Laser Marking Standardization for Aerospace Packages

Oct 2, 2013

- 13_0163

Qualify TSSI Cavite, Phils for Burn-in and Life Test of MIL-PRF-38535 QMLV Aerospace Devices

Nov 9, 2011

- 11_0050

Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines

5962R8853901V2A

5962R8853901VEA

Nov 9, 2011

- 11_0182

Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines

5962R8853901V2A

5962R8853901VEA

Jun 1, 2011

- 11_0088

Top and Bottom Mark Standardization for Certain LCC (Leadless Chip Carrier) and Metal Can Packages

Nov 7, 2012

- 12_0199

Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.

Filter by Model

reset

Reset Filters

Part Models

Product Lifecycle

PCN

Jul 30, 2018

- 16_0026

arrow down

Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices

Feb 27, 2017

- 17_0028

arrow down

AD524S Change in Wafer Diameter for Aerospace Models

Nov 18, 2015

- 15_0219

arrow down

Laser Marking Standardization for Aerospace Packages

Oct 2, 2013

- 13_0163

arrow down

Qualify TSSI Cavite, Phils for Burn-in and Life Test of MIL-PRF-38535 QMLV Aerospace Devices

Nov 9, 2011

- 11_0050

arrow down

Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines

5962R8853901V2A

5962R8853901VEA

Nov 9, 2011

- 11_0182

arrow down

Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines

5962R8853901V2A

5962R8853901VEA

Jun 1, 2011

- 11_0088

arrow down

Top and Bottom Mark Standardization for Certain LCC (Leadless Chip Carrier) and Metal Can Packages

Nov 7, 2012

- 12_0199

arrow down

Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.

Software & Part Ecosystem

Software & Part Ecosystem

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