HMC558

HMC558 / HMC558LC3B

GaAs monolithic microwave integrated circuit (MMIC) double-balanced mixer chip and surface mount technology (SMT), 5.5 GHz to 14.0 GHz

Data Sheet

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Overview

High local oscillator (LO) radio frequency (RF) isolation: 45 dBm
Passive double-balanced topology
Low conversion loss: 7 dB
Wide intermediate frequency (IF) bandwidth: dc to 6 GHz

Small size (HMC558): 0.91 mm × 0.94 mm × 0.1 mm
12-Lead ceramic 3 mm × 3 mm SMT package (HMC558LC3B): 9 mm²

The HMC558 devices are passive (HMC558) and general purpose (HMC558LC3B) double-balanced mixers that are available in a chip (HMC558) and a leadless RoHS compliant SMT package (HMC558LC3B), both of which can be used as an upconverter or downconverter between 5.5 GHz and 14.0 GHz. These mixers are fabricated in a GaAs metal semiconductor field effect transistor (MESFET) process, and require no external components or matching circuitry. The HMC558G devices provide excellent LO to RF and LO to IF isolation due to optimized balun structures and operates with LO drive levels as low as 9 dBm. Measurements were made with the HMC558 chip mounted into in a 50 Ω test fixture and includes the parasitic effects of wire bond assembly. Connections were made with a 1 mil wire bond with minimal length (<12 mil). The RoHS compliant HMC558LC3B eliminates the need for wire bonding, and is compatible with high volume surface mount manufacturing techniques.

Applications