HMC553

Obsolete

HMC553 / HMC553LC3B

GaAsmonolithic microwave integrated circuit (MMIC) fundamental mixer chip and double-balanced mixer surface mount technology (SMT), 7 GHz to 14 GHz

Data Sheet Product Selection Table

Part Models: 4
1ku List Price: price unavailable

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Overview

Highlocal oscillator (LO) to radio frequency (RF) isolation
HMC553: 48 dB
HMC553LC3B: 50 dB
Passive double-balanced topology
Low conversion loss: 7 dB

Wide intermediate frequency(IF)bandwidth: dcto 5 GHz
Small size (HMC553): 0.83 mm× 1.12 mm × 0.1 mm
RoHS compliant 3 mm ×3 mm SMT package (HMC553LC3B)

The HMC553 devices are passive (HMC553) and general purpose (HMC553LC3B) double-balanced mixers that are available in a chip (HMC553) and a leadless RoHS compliant SMT package (HMC553LC3B), both of which can be used as an upconverter or downconverter between 7 GHz and 14 GHz. These mixers are fabricated in a GaAs metal semiconductor field effect transistor (MESFET) process, and require no external components or matching circuitry. The HMC553 devices provide excellent LO to RF and LO to IF isolation due to optimized balun structures and operates with LO drive levels as low as 9 dBm. Measurements were made with the HMC553 chip mounted into in a 50 Ω test fixture and includes the parasitic effects of wire bond assembly. Connections were made with a 1 mil wire bond with minimal length (<12 mil). The RoHS compliant HMC553LC3B eliminates the need for wire bonding, and is compatible with high volume surface mount manufacturing techniques.

Applications

Point-to-point radios
Point-to-multipoint radios
Test equipment and sensors
Military end use
Microwave radio
Space
Communications, radar, and electronic warfare (EW)

Part Models: 4
1ku List Price: price unavailable

Documentation

Data Sheet 2

HMC553 Die Data Sheet 04/14/2015

HMC553LC3B Data Sheet 04/14/2015

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
HMC553	CHIPS OR DIE	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
HMC553LC3B	12-Lead LCC (3mm x 3mm w/ EP)	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
HMC553LC3BTR	12-Lead LCC (3mm x 3mm w/ EP)	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
HMC553LC3BTR-R5	12-Lead LCC (3mm x 3mm w/ EP)	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys

Part Models	Product Lifecycle	PCN

Jan 11, 2017 - 16_0010 Discontinuance of Select RF and Microwave Products
		PDN16_0010_Form Material_Report
HMC553
HMC553LC3B
HMC553LC3BTR
HMC553LC3BTR-R5