HMC526

Obsolete

HMC526 / HMC526LC4

GaAsmonolithic microwave integrated circuit (MMIC) I/Q mixer, image reject mixer (IRM) chip and surface mount technology (SMT), 6 GHz to 10 GHz

Data Sheet Product Selection Table

Part Models: 4
1ku List Price: price unavailable

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Overview

Wide intermediate frequency (IF) bandwidth: dc to 3.5 GHz
Image rejection: 40 dB
Local oscillator (LO) to radio frequency (RF) isolation: 50 dB

High input IP3: 28 dBm
Die size (HMC526): 1.49 mm × 1.14 mm × 0.1 mm
RoHS compliant 4 mm × 4 mm SMT package (HMC526LC4)

The HMC526 devices are compact I/Q MMIC mixers that are available in a chip (HMC526) or a leadless Pb-free RoHS compliant SMT package (HMC526LC4), both of which can be used as either an IRM or a single sideband (SSB) upconverter. The mixers utilize two standard Hittite double-balanced mixer cells and a 90° hybrid fabricated in a GaAs metal semiconductor field effect transistor (MESFET) process. A low frequency quadrature hybrid was used to produce a 100 MHz USB IF output. These products are much smaller alternatives to hybrid style IRMs and SSB upconverter assemblies. All data shown for the HMC526 is taken with the chip mounted in a 50 Ω test fixture and includes the effects of 1 mil diameter × 20 mil length bond wires on each port. The HMC526LC4 eliminates the need for wire bonding allowing use of surface mount manufacturing techniques.

Applications

Point-to-point radios
Point-to-multipoint radios
Very small aperture terminal (VSAT)
Test equipment and sensors
Military end use

Part Models: 4
1ku List Price: price unavailable

Documentation

Data Sheet 2

HMC526 Die Data Sheet 04/15/2015

HMC526LC4 Data Sheet 04/15/2015

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
HMC526	CHIPS OR DIE	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
HMC526LC4	24-Lead LCC (4mm x 4mm w/ EP)	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
HMC526LC4TR	24-Lead LCC (4mm x 4mm w/ EP)	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
HMC526LC4TR-R5	24-Lead LCC (4mm x 4mm w/ EP)	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys

Part Models	Product Lifecycle	PCN

Jan 11, 2017 - 16_0010 Discontinuance of Select RF and Microwave Products
		PDN16_0010_Form Material_Report
HMC526
HMC526LC4
HMC526LC4TR
HMC526LC4TR-R5	Obsolete