HMC-ALH382-DIE
Info : RECOMMENDED FOR NEW DESIGNS
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HMC-ALH382-DIE

Low Noise Amplifier Chip, 57 - 65 GHz

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Info : RECOMMENDED FOR NEW DESIGNS tooltip
Info : RECOMMENDED FOR NEW DESIGNS tooltip
Part Models 3
1ku List Price
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Features
  • Noise Figure: 3.8 dB
  • P1dB: +12 dBm
  • Gain: 21 dB
  • Supply Voltage: +2.5V
  • 50 Ohm Matched Input/Output
  • Die Size: 1.55 x 0.73 x 0.1 mm
Additional Details
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The HMC-ALH382 is a high dynamic range, four stage GaAs HEMT MMIC Low Noise Amplifier (LNA) which operates between 57 and 65 GHz. The HMC-ALH382 features 21 dB of small signal gain, 4 dB of noise figure and an output power of +12 dBm at 1dB compression from a +2.5V supply voltage. All bond pads and the die backside are Ti/Au metallized and the amplifier device is fully passivated for reliable operation.

This versatile LNA is compatible with conventional die attach methods, as well as thermocompression thermosonic wirebonding, making it ideal for MCM and hybrid microcircuit applications. All data shown herein is measured with the chip in a 50 Ohm environment and contacted with RF probes.

Applications

  • Short Haul / High Capacity Links
  • Wireless LANs
  • Military & Space
Part Models 3
1ku List Price
price unavailable

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Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
HMC-ALH382
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HMC-ALH382-SX
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HMC8657
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Software & Part Ecosystem

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