Not the part you were looking for?
Ask a Question
Submit your question below and we will return the best answer from ADI’s knowledge database:
Other places you can find help
Support
Analog Devices Support Portal is a one-stop shop to answer all your ADI questions.
Visit the ADI Support PageFeatures
- Integrated RF front end
- LNA and high-power silicon SPDT switch
- On-chip bias and matching
- Single-supply operation
- Gain: 35.5 dB typical at 2.6 GHz
- Gain flatness: 0.2 dB at 25°C across 400 MHz bandwidth
- Low noise figure: 1.2 dB typical at 2.6 GHz
- Low insertion loss: 0.7 dB typical at 2.6 GHz
- High-power handling at TCASE = 105°C
- Full lifetime
- LTE average power (8 dB PAR): 36.5 dBm
- Single event (<10 sec operation)
- LTE average power (8 dB PAR): 39 dBm
- High Input IP3: −4 dBm
- Low-supply current
- Receive operation: 118 mA typical at 5 V
- Transmit operation: 15 mA typical at 5 V
- Positive logic control
- 5 mm × 3 mm, 24-lead LFCSP package
- Pin compatible with the ADRF5534, 3.1 GHz to 4.2 GHz receiver front end
The ADRF5532 is an integrated RF, front-end multichip module designed for time division duplex (TDD) applications. The device operates from 2.3 GHz to 2.7 GHz. The ADRF5532 is configured with a low-noise amplifier (LNA) and a high-power, silicon, single pole double throw (SPDT) switch.
In the receive operation at 2.6 GHz, the LNA offers a low noise figure (NF) of 1.2 dB and a high gain of 35.5 dB with a third order input intercept point (IIP3) of −4 dBm.
In the transmit operation, the switch provides a low insertion loss of 0.7 dB and handles a long-term evolution (LTE) average power of 36.5 dBm for a full lifetime operation (8 dB peak to average ratio (PAR)) and 39 dBm for a single event (<10 sec) LNA protection operation.
The device is featured in an RoHS compliant, compact, 5 mm × 3 mm, 24-lead LFCSP package.
APPLICATIONS
- Wireless infrastructure
- TDD massive multiple input and multiple output (MIMO) and active antenna systems
- TDD-based communication systems
Ask a Question
Submit your question below and we will return the best answer from ADI’s knowledge database:
Other places you can find help
Support
Analog Devices Support Portal is a one-stop shop to answer all your ADI questions.
Visit the ADI Support Page{{modalTitle}}
{{modalDescription}}
{{dropdownTitle}}
- {{defaultSelectedText}} {{#each projectNames}}
- {{name}} {{/each}} {{#if newProjectText}}
- {{newProjectText}} {{/if}}
{{newProjectTitle}}
{{projectNameErrorText}}
ADRF5532
Documentation
Filters
1 Applied
Data Sheet
2
User Guide
1
Documentation
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
---|---|---|---|
ADRF5532BCPZN | 24-lead LFCSP (5 mm x 3 mm x 0.95 mm) |
|
|
ADRF5532BCPZN-R7 | 24-lead LFCSP (5 mm x 3 mm x 0.95 mm) |
|
|
ADRF5532BCPZN-RL | 24-lead LFCSP (5 mm x 3 mm x 0.95 mm) |
|
- ADRF5532BCPZN
- Pin/Package Drawing
- 24-lead LFCSP (5 mm x 3 mm x 0.95 mm)
- Documentation
- HTML Material Declaration
- HTML Reliablity Data
- CAD Symbols, Footprints, and 3D Models
- Ultra Librarian
- SamacSys
- ADRF5532BCPZN-R7
- Pin/Package Drawing
- 24-lead LFCSP (5 mm x 3 mm x 0.95 mm)
- Documentation
- HTML Material Declaration
- HTML Reliablity Data
- CAD Symbols, Footprints, and 3D Models
- Ultra Librarian
- SamacSys
- ADRF5532BCPZN-RL
- Pin/Package Drawing
- 24-lead LFCSP (5 mm x 3 mm x 0.95 mm)
- Documentation
- HTML Material Declaration
- HTML Reliablity Data
- CAD Symbols, Footprints, and 3D Models
- Ultra Librarian
- SamacSys
Software & Part Ecosystem
Evaluation Kits 1
EVAL-ADRF5532
Evaluating the ADRF5532, 2.3 GHz to 2.7 GHz, Receiver Front End
Product Detail
The ADRF5532 is an integrated RF, front-end multichip module designed for time division duplex (TDD) applications. The device operates from 2.3 GHz to 2.7 GHz. The ADRF5532 is configured with a low-noise amplifier (LNA) and a high-power, silicon, single pole double throw (SPDT) switch.
This user guide describes the ADRF5532-EVALZ, designed to easily evaluate the features and performance of the ADRF5532. Figure 1 shows a photograph of the ADRF5532-EVALZ.
Note that the ADRF5532 IC is populated on the ADRF5534 bare evaluation board. However, the whole assembly is the ADRF5532- EVALZ
Full details about the device are available in the ADRF5532 data sheet. Consult it when using the ADRF5532-EVALZ.
Resources