ADRF5532
Info : RECOMMENDED FOR NEW DESIGNS
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ADRF5532

2.3 GHz to 2.7 GHz, Receiver Front End

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Info : RECOMMENDED FOR NEW DESIGNS tooltip
Info : RECOMMENDED FOR NEW DESIGNS tooltip
Part Models 3
1ku List Price Starting From $7.95
Features
  • Integrated RF front end
    • LNA and high-power silicon SPDT switch
    • On-chip bias and matching
    • Single-supply operation
  • Gain: 35.5 dB typical at 2.6 GHz
  • Gain flatness: 0.2 dB at 25°C across 400 MHz bandwidth
  • Low noise figure: 1.2 dB typical at 2.6 GHz
  • Low insertion loss: 0.7 dB typical at 2.6 GHz
  • High-power handling at TCASE = 105°C
    • Full lifetime
      • LTE average power (8 dB PAR): 36.5 dBm
    • Single event (<10 sec operation)
      • LTE average power (8 dB PAR): 39 dBm
  • High Input IP3: −4 dBm
  • Low-supply current
    • Receive operation: 118 mA typical at 5 V
    • Transmit operation: 15 mA typical at 5 V
  • Positive logic control
  • 5 mm × 3 mm, 24-lead LFCSP package
  • Pin compatible with the ADRF5534, 3.1 GHz to 4.2 GHz receiver front end
Additional Details
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The ADRF5532 is an integrated RF, front-end multichip module designed for time division duplex (TDD) applications. The device operates from 2.3 GHz to 2.7 GHz. The ADRF5532 is configured with a low-noise amplifier (LNA) and a high-power, silicon, single pole double throw (SPDT) switch.

In the receive operation at 2.6 GHz, the LNA offers a low noise figure (NF) of 1.2 dB and a high gain of 35.5 dB with a third order input intercept point (IIP3) of −4 dBm.

In the transmit operation, the switch provides a low insertion loss of 0.7 dB and handles a long-term evolution (LTE) average power of 36.5 dBm for a full lifetime operation (8 dB peak to average ratio (PAR)) and 39 dBm for a single event (<10 sec) LNA protection operation.

The device is featured in an RoHS compliant, compact, 5 mm × 3 mm, 24-lead LFCSP package.

APPLICATIONS

  • Wireless infrastructure
  • TDD massive multiple input and multiple output (MIMO) and active antenna systems
  • TDD-based communication systems
Part Models 3
1ku List Price Starting From $7.95

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Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
ADRF5532BCPZN
  • HTML
  • HTML
ADRF5532BCPZN-R7
  • HTML
  • HTML
ADRF5532BCPZN-RL
  • HTML
  • HTML

Software & Part Ecosystem

Evaluation Kits 1

reference details image

EVAL-ADRF5532

Evaluating the ADRF5532, 2.3 GHz to 2.7 GHz, Receiver Front End

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EVAL-ADRF5532

Evaluating the ADRF5532, 2.3 GHz to 2.7 GHz, Receiver Front End

Evaluating the ADRF5532, 2.3 GHz to 2.7 GHz, Receiver Front End

Features and Benefits

  • Full featured evaluation board for the ADRF5532 
  • Easy connection to test equipment
  • Thru line for calibration

Product Detail

The ADRF5532 is an integrated RF, front-end multichip module designed for time division duplex (TDD) applications. The device operates from 2.3 GHz to 2.7 GHz. The ADRF5532 is configured with a low-noise amplifier (LNA) and a high-power, silicon, single pole double throw (SPDT) switch.

This user guide describes the ADRF5532-EVALZ, designed to easily evaluate the features and performance of the ADRF5532. Figure 1 shows a photograph of the ADRF5532-EVALZ.

Note that the ADRF5532 IC is populated on the ADRF5534 bare evaluation board. However, the whole assembly is the ADRF5532- EVALZ

Full details about the device are available in the ADRF5532 data sheet. Consult it when using the ADRF5532-EVALZ.

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