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Features
- Frequency range: 17.7 GHz to 19.7 GHz
- Typical gain of >25.1 dB
- Low noise input
- Noise figure: 2.4 dB typical
- High linearity input
- >−1.5 dBm typical input third-order intercept (IIP3)
- −11.5 dBm input 1 dB compression point (P1dB) at 19.7 GHz
- Matched 50 Ω single-ended input
- Matched 100 Ω differential outputs
- 8-lead, 2.00 mm × 2.00 mm LFCSP microwave packaging
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The ADL5725 is a narrow-band, high performance, low noise amplifier (LNA) targeting microwave radio link receiver designs. The monolithic silicon germanium (SiGe) design is optimized for microwave radio link bands ranging from 17.7 GHz to 19.7 GHz. The unique design offers a single-ended 50 Ω input impedance and provides a 100 Ω balanced differential output that is ideal for driving Analog Devices, Inc., differential downconverters and radio frequency (RF) sampling analog-to-digital converters (ADCs). This low noise amplifier provides noise figure performance that, in the past, required more expensive three-five (III-V) compounds process technology to achieve.
The ADL5721 and ADL5723 to ADL5726 family of narrow-band LNAs are each packaged in a tiny, thermally enhanced, 2.00 mm × 2 mm LFCSP package. The ADL5721 and ADL5723 to ADL5726 family operates over the temperature range of −40°C to +85°C.
Applications
- Point to point microwave radios
- Instrumentation
- Satellite communications (SATCOM)
- Phased arrays
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ADL5725
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ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| ADL5725ACPZN-R7 |
8-Lead LFCSP (2mm x 2mm w/ EP)
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- ADL5725ACPZN-R7
- Pin/Package Drawing
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8-Lead LFCSP (2mm x 2mm w/ EP)
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Reliablity Data
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Product Lifecycle
PCN
Aug 1, 2016
- 16_0035
Assembly Relocation of Select LFCSP, Mini-LFCSP and LFCSP Side Solderable Products to STATS ChipPAC China Jiangyin
Filter by Model
Part Models
Product Lifecycle
PCN
Aug 1, 2016
- 16_0035
Assembly Relocation of Select LFCSP, Mini-LFCSP and LFCSP Side Solderable Products to STATS ChipPAC China Jiangyin
Software & Part Ecosystem
Evaluation Kits 1
EVAL-ADL5725
ADL5725 Evaluation Board
Product Detail
Resources
Evaluation Kits1
Tools & Simulations 3
S-Parameter 1
S-Parameter
Sys-Parameter
ADIsimRF
