ADL5723
Info : RECOMMENDED FOR NEW DESIGNS
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ADL5723

10.1 GHz to 11.7 GHz, Low Noise Amplifier

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Info : RECOMMENDED FOR NEW DESIGNS tooltip
Info : RECOMMENDED FOR NEW DESIGNS tooltip
Part Models 1
1ku List Price
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Features
  • Frequency range: 10.1 GHz to 11.7 GHz
  • Typical gain of >24 dB
  • Low noise input
    • Noise figure
      • 2.2 dB typical at 10.1 GHz
      • 2.3 dB typical at 11.7 GHz
  • High linearity input
    • ≥2.2 dBm typical input third-order intercept (IIP3)
    • −10 dBm typical input 1 dB compression point (P1dB)
  • Matched 50 Ω single-ended input
  • Matched 100 Ω differential outputs
  • 8-lead, 2.00 mm × 2.00 mm LFCSP microwave packaging
Additional Details
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The ADL5723 is a narrow-band, high performance, low noise amplifier (LNA) targeting microwave radio link receiver designs. The monolithic silicon germanium (SiGe) design is optimized for microwave radio link bands ranging from 10.1 GHz to 11.7 GHz. The unique design offers a single-ended 50 Ω input impedance and provides a 100 Ω balanced differential output that is ideal for driving Analog Devices, Inc., differential downconverters and radio frequency (RF) sampling analog-to-digital converters (ADCs). This LNA provides noise figure performance that, in the past, required more expensive three-five (III-V) compounds process technology to achieve.

The ADL5721 and ADL5723 to ADL5726 family of narrow-band LNAs are each packaged in a tiny, thermally enhanced, 2.00 mm ×2.00 mm LFCSP package. The ADL5721 and ADL5723 to ADL5726 family operates over the temperature range of −40°C to +85°C.

Applications

  • Point to point microwave radios
  • Instrumentation
  • Satellite communications (SATCOM)
  • Phased arrays
Part Models 1
1ku List Price
price unavailable

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Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
ADL5723ACPZN-R7
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Product Lifecycle

PCN

Aug 1, 2016

- 16_0035

Assembly Relocation of Select LFCSP, Mini-LFCSP and LFCSP Side Solderable Products to STATS ChipPAC China Jiangyin

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Product Lifecycle

PCN

Aug 1, 2016

- 16_0035

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Assembly Relocation of Select LFCSP, Mini-LFCSP and LFCSP Side Solderable Products to STATS ChipPAC China Jiangyin

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