REF02S
量产航空航天用+5V精密基准电压源/温度传感器
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REF02精密基准电压源能够提供稳定的+5V输出，输出电压可以在±6%范围内调整，且对温度稳定性的影响极小。它采用改进的带隙设计，以单电源供电，输入电压范围为7 V至40 V，功耗低至1 mA，并且可实现出色的温度稳定性。该器件具有低噪声和低功耗特性，堪称要求稳定基准电压源应用的理想之选。应用范围包括数模和模数转换器、便携式仪器仪表以及数字电压表。它还可用作单芯片温度传感器，从而进一步增强其多功能特性。
参考资料
低剂量率辐射报告 1
高剂量率辐射报告 1
ADI 始终高度重视提供符合最高质量和可靠性水平的产品。我们通过将质量和可靠性检查纳入产品和工艺设计的各个范围以及制造过程来实现这一目标。出货产品的“零缺陷”始终是我们的目标。查看我们的质量和可靠性计划和认证以了解更多信息。
| 产品型号 | 引脚/封装图-中文版 | 文档 | CAD 符号，脚注和 3D模型 |
|---|---|---|---|
| 5962L8551405VHA | 10-Lead FlatPack | ||
| 5962R8551401V2A | 20-Lead LCC | ||
| 5962R8551401VGA | 20 ld LCC | ||
| 5962R8551401VHA | 10-Lead FlatPack | ||
| 5962R8551401VPA | 8-Lead CerDIP | ||
| REF020000C | CHIPS OR DIE | ||
| REF02R000C | CHIPS OR DIE |
| 产品型号 | 产品生命周期 | PCN |
|---|---|---|
|
11月 19, 2021 - 21_0229 REF02S Aerospace Models Change of Wafer Diameter |
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| 5962L8551405VHA | 量产 | |
| 5962R8551401V2A | 量产 | |
| 5962R8551401VGA | 量产 | |
| 5962R8551401VHA | 量产 | |
| 5962R8551401VPA | 量产 | |
| REF020000C | 量产 | |
| REF02R000C | 量产 | |
|
7月 30, 2018 - 16_0026 Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices |
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| 5962L8551405VHA | 量产 | |
| 5962R8551401V2A | 量产 | |
| 5962R8551401VGA | 量产 | |
| 5962R8551401VHA | 量产 | |
| 5962R8551401VPA | 量产 | |
| REF020000C | 量产 | |
| REF02R000C | 量产 | |
|
10月 29, 2017 - 17_0079 Qualification of TeamQuest Technology Inc., Philippines as an Alternate Test Site for TC-Vos Testing |
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| 5962L8551405VHA | 量产 | |
| 5962R8551401V2A | 量产 | |
| 5962R8551401VGA | 量产 | |
| 5962R8551401VHA | 量产 | |
| 5962R8551401VPA | 量产 | |
|
11月 18, 2015 - 15_0219 Laser Marking Standardization for Aerospace Packages |
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| 5962L8551405VHA | 量产 | |
| 5962R8551401V2A | 量产 | |
| 5962R8551401VGA | 量产 | |
| 5962R8551401VHA | 量产 | |
| 5962R8551401VPA | 量产 | |
| REF020000C | 量产 | |
| REF02R000C | 量产 | |
|
10月 2, 2013 - 13_0163 Qualify TSSI Cavite, Phils for Burn-in and Life Test of MIL-PRF-38535 QMLV Aerospace Devices |
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| 5962L8551405VHA | 量产 | |
| 5962R8551401V2A | 量产 | |
| 5962R8551401VGA | 量产 | |
| 5962R8551401VHA | 量产 | |
| 5962R8551401VPA | 量产 | |
|
11月 7, 2012 - 12_0199 Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages. |
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| 5962L8551405VHA | 量产 | |
| 5962R8551401VHA | 量产 | |
| 5962R8551401VPA | 量产 | |
|
11月 9, 2011 - 11_0050 Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines |
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| 5962R8551401V2A | 量产 | |
| 5962R8551401VGA | 量产 | |
| 5962R8551401VHA | 量产 | |
| 5962R8551401VPA | 量产 | |
|
11月 9, 2011 - 11_0182 Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines |
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| 5962R8551401V2A | 量产 | |
| 5962R8551401VGA | 量产 | |
| 5962R8551401VHA | 量产 | |
| 5962R8551401VPA | 量产 | |
|
9月 29, 2022 - 22_0195 Shipment Carrier Change for TO-99 Header Package |
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| 5962R8551401VGA | 量产 | |
|
9月 21, 2009 - 09_0188 Change of Bottom Brand from Ink to Laser for Aerospace Cerpak Packages |
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| 5962R8551401VHA | 量产 | |
|
2月 9, 2009 - 08_0073 Change of Seal Glass Material for Cerdip & Cerpak Packages |
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| 5962R8551401VHA | 量产 | |
| 5962R8551401VPA | 量产 | |
这是最新版本的数据手册
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