DAC8800

量产

八通道8位数模转换器

数据手册 (Rev. A) 产品选型表

产品模型: 3

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产品详情

总体非调整误差：±1/2 LSB
建立时间：2µs
串行数据输入
±满量程输出由V_REFH和V_REFL设定

单极性和双极性工作模式
兼容TTL输入
20引脚DIP或SOL封装
低成本

产品模型: 3

参考资料

数据手册 1

DAC8800: Octal 8-Bit D/A Converter Data Sheet (Rev.A) 09/30/1989

应用笔记 2

AN-219: Electronic Adjustment Made Easy with the TrimDAC^® 01/01/2000

AN-142: Voltage Adjustment Applications of the DAC-8800 TrimDAC^®, an Octal, 8-Bit D/A Converter 01/01/2000

ADI 始终高度重视提供符合最高质量和可靠性水平的产品。我们通过将质量和可靠性检查纳入产品和工艺设计的各个范围以及制造过程来实现这一目标。出货产品的“零缺陷”始终是我们的目标。查看我们的质量和可靠性计划和认证以了解更多信息。

产品型号	引脚/封装图-中文版	文档	CAD 符号，脚注和 3D模型
DAC8800BR/883C	20-Lead CerDIP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
DAC8800FPZ	20-Lead PDIP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
DAC8800FSZ-REEL	20-Lead SOIC (Wide)	Material Declaration Reliablity Data	Ultra Librarian SamacSys

产品型号	产品生命周期	PCN

4月 9, 2018 - 16_0026 Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices
		PCN16_0026_Form Material_Report Qualification Results Summary
DAC8800BR/883C
11月 7, 2012 - 12_0199 Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.
		PCN12_0199_Form Material_Report Qualification Report Summary Datasheet Specification Comparison
DAC8800BR/883C
6月 6, 2012 - 12_0066 Add capacity for Burn In of Hermetic, 883 & QMLQ/Class B devices at TSSI Cavite
		PCN12_0066_Form Material_Report Qualification Report Summary
DAC8800BR/883C
11月 9, 2011 - 11_0050 Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines
		PCN11_0050_Form Material_Report
DAC8800BR/883C		PCN11_0050_Form Material_Report
11月 9, 2011 - 11_0182 Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
		PCN11_0182_Form Material_Report
DAC8800BR/883C
DAC8800FPZ	量产
DAC8800FSZ-REEL	量产
7月 31, 2009 - 09_0106 Removal of Die Fab Code from Topside Marking of Remaining Mil-Grade Products
		09_0106Supporting Material_Report PCN09_0106_Form
DAC8800BR/883C		09_0106Supporting Material_Report PCN09_0106_Form
3月 7, 2019 - 19_0046 Assembly Transfer of 18,20,24,28 Lead PDIP to Cirtek
		PCN19_0046_Form Material_Report Detailed Change Description Qualification Results Summary
DAC8800FPZ	量产
8月 19, 2009 - 07_0024 Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad
		Material_Report Material_Report Parts List PCN07_0024_Form Qual Data
DAC8800FPZ	量产
8月 4, 2010 - 10_0117 Halogen Free Material Change for SOIC_W Products at Carsem
		PCN10_0117_Form Material_Report Reliability Report
DAC8800FSZ-REEL	量产	PCN10_0117_Form Material_Report Reliability Report

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