AD7841

量产

8通道、14位、并行输入、电压输出DAC

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产品详情

ADI 始终高度重视提供符合最高质量和可靠性水平的产品。我们通过将质量和可靠性检查纳入产品和工艺设计的各个范围以及制造过程来实现这一目标。出货产品的“零缺陷”始终是我们的目标。查看我们的质量和可靠性计划和认证以了解更多信息。

产品型号	引脚/封装图-中文版	文档	CAD 符号，脚注和 3D模型
AD7841ASZ	44-Lead MQFP (13.9mm x 10mm)	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD7841ASZ-REEL	44-Lead MQFP (13.9mm x 10mm)	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD7841BSZ	44-Lead MQFP (13.9mm x 10mm)	Material Declaration Reliablity Data	Ultra Librarian SamacSys

产品型号	产品生命周期	PCN

10月 18, 2016 - 16_0034 Assembly Relocation of Select LQFP,LQFP_EP,MQFP,TQFP,TQFP_EP Products to Stats ChipPAC China Jiangyin
		PCN16_0034_Form Material_Report Qualification Results Summary Qualification Results Summary Qualification Results Summary
AD7841ASZ	量产
AD7841ASZ-REEL	量产
AD7841BSZ	量产
2月 8, 2010 - 04_0080 Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland.
		PCN04_0080_Form Material_Report Reliability Report Reliability Report
AD7841ASZ	量产
AD7841ASZ-REEL	量产
AD7841BSZ	量产
8月 19, 2009 - 07_0024 Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad
		Material_Report Material_Report Parts List PCN07_0024_Form Qual Data
AD7841ASZ	量产
AD7841ASZ-REEL	量产
AD7841BSZ	量产
1月 5, 2009 - 07_0077 Certification of STATSChipPAC Shanghai, China and AMKOR Philippines as additional sources for Assembly & Test of QFP Packages
		07_0077Rev D_LQFP_Dec17 07_0077Rev D_MQFP_Dec15 07_0077Rev D_Obsolesence_Dec15 07_0077Rev D_TQFP_Dec15 Material_Report PCN07_0077_Form QFP Transfer Qualification Results-tests_DEC12CL
AD7841ASZ	量产
AD7841ASZ-REEL	量产
AD7841BSZ	量产