AD7579

不推荐用于新设计

LC²MOS 10位采样ADC，采用(8+2)读取数据格式

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产品详情

ADI 始终高度重视提供符合最高质量和可靠性水平的产品。我们通过将质量和可靠性检查纳入产品和工艺设计的各个范围以及制造过程来实现这一目标。出货产品的“零缺陷”始终是我们的目标。查看我们的质量和可靠性计划和认证以了解更多信息。

产品型号	引脚/封装图-中文版	文档	CAD 符号，脚注和 3D模型
5962-8969801LX	24 ld CerDIP(300 Mil)	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD7579JNZ	24-Lead PDIP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD7579KNZ	24-Lead PDIP	Material Declaration Reliablity Data	Ultra Librarian SamacSys

产品型号	产品生命周期	PCN
未找到匹配项目
4月 9, 2018 - 16_0026 Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices
		PCN16_0026_Form Material_Report Qualification Results Summary
5962-8969801LX
11月 7, 2012 - 12_0199 Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.
		PCN12_0199_Form Material_Report Qualification Report Summary Datasheet Specification Comparison
5962-8969801LX
11月 9, 2011 - 11_0050 Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines
		PCN11_0050_Form Material_Report
5962-8969801LX		PCN11_0050_Form Material_Report
11月 9, 2011 - 11_0182 Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
		PCN11_0182_Form Material_Report
5962-8969801LX		PCN11_0182_Form Material_Report
3月 7, 2019 - 19_0046 Assembly Transfer of 18,20,24,28 Lead PDIP to Cirtek
		PCN19_0046_Form Material_Report Detailed Change Description Qualification Results Summary
AD7579JNZ
AD7579KNZ
8月 19, 2009 - 07_0024 Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad
		Material_Report Material_Report Parts List PCN07_0024_Form Qual Data
AD7579JNZ
AD7579KNZ

这是最新版本的数据手册