AD7574

数据手册 1

• AD7574: CMOS µP-Compatible 8-Bit ADC Scanned Data Sheet (Rev.A) 06/01/1979

应用笔记 1

• AN-293: AD7574 Analog to Microprocessor Interface 01/01/2000

技术文章 1

• 高速ADC的电源设计 02/01/2012

ADI 始终高度重视提供符合最高质量和可靠性水平的产品。我们通过将质量和可靠性检查纳入产品和工艺设计的各个范围以及制造过程来实现这一目标。出货产品的“零缺陷”始终是我们的目标。查看我们的质量和可靠性计划和认证以了解更多信息。

产品型号	引脚/封装图-中文版	文档	CAD 符号，脚注和 3D模型
AD7574AQ	18-Lead Side-Brazed CerDIP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD7574BQ	18-Lead Side-Brazed CerDIP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD7574JNZ	18-Lead PDIP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD7574SCHIPS	none available	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD7574SQ	18-Lead Side-Brazed CerDIP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD7574TQ	18-Lead Side-Brazed CerDIP	Material Declaration Reliablity Data	Ultra Librarian SamacSys
AD7574TQ/883B	18-Lead Side-Brazed CerDIP	Material Declaration Reliablity Data	Ultra Librarian SamacSys

根据型号筛选

产品型号	产品生命周期	PCN
11月 7, 2012 - 12_0199 Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.
		PCN12_0199_Form Material_Report Qualification Report Summary Datasheet Specification Comparison
AD7574AQ
AD7574BQ
AD7574SQ
AD7574TQ
AD7574TQ/883B
11月 9, 2011 - 11_0050 Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines
		PCN11_0050_Form Material_Report
AD7574AQ
AD7574BQ
AD7574SQ
AD7574TQ
AD7574TQ/883B
11月 9, 2011 - 11_0182 Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines
		PCN11_0182_Form Material_Report
AD7574AQ
AD7574BQ
AD7574SQ
AD7574TQ
AD7574TQ/883B
3月 7, 2019 - 19_0046 Assembly Transfer of 18,20,24,28 Lead PDIP to Cirtek
		PCN19_0046_Form Material_Report Detailed Change Description Qualification Results Summary
AD7574JNZ
8月 19, 2009 - 07_0024 Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad
		Material_Report Material_Report Parts List PCN07_0024_Form Qual Data
AD7574JNZ
4月 9, 2018 - 16_0026 Qualify TeamQuest Technology, Inc. for Burn-in and Life Test of Military and Aerospace Devices
		PCN16_0026_Form Material_Report Qualification Results Summary
AD7574TQ/883B