The ADG1211 / ADG1212 / ADG1213 are monolithic complementary metal-oxide semiconductor (CMOS) devices containing four independently selectable switches designed on an iCMOS® (industrial CMOS) process. iCMOS is a modular manufacturing process combining high voltage CMOS and bipolar technologies. It enables the development of a wide range of high performance analog ICs capable of 33 V operation in a footprint that no previous generation of high voltage devices has been able to achieve. Unlike analog ICs using conventional CMOS processes, iCMOS components can tolerate high supply voltages while providing increased performance, dramatically lower power consumption, and reduced package size.
The ultralow capacitance and charge injection of these switches make them ideal solutions for data acquisition and sample-and-hold applications, where low glitch and fast settling are required. Fast switching speed coupled with high signal bandwidth make the devices suitable for video signal switching.
iCMOS construction ensures ultralow power dissipation, making the devices ideally suited for portable and battery-powered instruments.
The ADG1211 / ADG1212 / ADG1213 contain four independent single-pole/single-throw (SPST) switches. The ADG1211 and ADG1212 differ only in that the digital control logic is inverted. The ADG1211 switches are turned on with Logic 0 on the appropriate control input, while Logic 1 is required for the ADG1212. The ADG1213 has two switches with digital control logic similar to that of the ADG1211; the logic is inverted on the other two switches. The ADG1213 exhibits break-before-make switching action for use in multiplexer applications.
Each switch conducts equally well in both directions when on and has an input signal range that extends to the supplies. In the off condition, signal levels up to the supplies are blocked.
- Ultralow capacitance.
- <1 pC charge injection.
- 3 V logic-compatible digital inputs: VIH = 2.0 V, VIL = 0.8 V.
- No VL logic power supply required.
- Ultralow power dissipation: <0.03 μW.
- 16-lead TSSOP and 3 mm × 3 mm LFCSP packages.
- Automatic test equipment
- Data acquisition systems
- Battery-powered systems
- Sample-and-hold systems
- Audio signal routing
- Video signal routing
- Communication systems
At least one model within this product family is in production and available for purchase. The product is appropriate for new designs but newer alternatives may exist.
A 16-lead TSSOP device can be clamped or soldered to the center of the evaluation board. Each pin of the device has a corresponding link from K1 to K16 that can be set to either VDD or GND. A wire screw terminal supplies VDD and GND. SMB connectors on the board allow additional external signals to be supplied to the device. In addition, there is space available at the top of the board for prototyping.
Full specifications of the device under test (DUT) are available in the corresponding product data sheet, which should be consulted in conjunction with this user guide when using the evaluation board.
Product Selection Guide
Switches and Multiplexers Product Selection Guide
Data-acquisition system uses fault protection
By Catherine Redmond, Analog Devices, Inc. (EDN, 4/15/2004)
Precision SPI Switch Configuration Increases Channel Density
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