ADG333A
PRODUCTIONQuad SPDT Switch
- Part Models
- 5
- 1ku List Price
- Starting From $3.75
Overview
- 44 V supply maximum ratings
- VSS to VDD analog signal range
- Low on resistance (45 Ω max)
- Low ∆RON (5 Ω max)
- Low RON match (4 Ω max)
- Low power dissipation
- Fast switching times
- tON < 175 ns
- tOFF < 145 ns
- Low leakage currents (5 nA max)
- Low charge injection (10 pC max)
- Break-before-make switching action
The ADG333A is a monolithic complementary metal-oxide semiconductor (CMOS) device comprising four independently selectable single-pole, double-throw (SPDT) switches. It is designed on a linear compatible CMOS (LC2MOS) process, which provides low power dissipation yet achieves a high switching speed and a low on resistance.
The on-resistance profile is very flat over the full analog input range, ensuring good linearity and low distortion when switching audio signals. High switching speed also makes the device suitable for video signal switching. CMOS construction ensures ultralow power dissipation, making the device ideally suited for portable, battery-powered instruments.
When they are on, each switch conducts equally well in both directions and has an input signal range that extends to the power supplies. In the off condition, signal levels up to the supplies are blocked. All switches exhibit break-before-make switching action for use in multiplexer applications. Low charge inject is inherent in the design.
Product Highlights
- Extended signal range. The ADG333A is fabricated on an enhanced LC2MOS process, giving an increased signal range which extends to the supply rails.
- Low power dissipation.
- Low RON.
- Single-supply operation. For applications in which the analog signal is unipolar, the ADG333A can be operated from a single rail power supply. The device is fully specified with a single 12 V supply.
Applications
- Audio and video switching
- Battery-powered systems
- Test equipment
- Communication systems
Documentation
Data Sheet 1
Application Note 1
Technical Articles 3
Product Selection Guide 1
Rarely Asked Question Page 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| ADG333ABNZ | 20-Lead PDIP | ||
| ADG333ABRSZ | 20-Lead SSOP | ||
| ADG333ABRSZ-REEL | 20-Lead SSOP | ||
| ADG333ABRZ | 20-Lead SOIC (Wide) | ||
| ADG333ABRZ-REEL | 20-Lead SOIC (Wide) |
| Part Models | Product Lifecycle | PCN |
|---|---|---|
|
Mar 7, 2019 - 19_0046 Assembly Transfer of 18,20,24,28 Lead PDIP to Cirtek |
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| ADG333ABNZ | ||
|
Feb 8, 2010 - 04_0080 Qualification of the 8" C6 and Q Wafer Fab Processes at Analog Devices, Limerick, Ireland. |
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| ADG333ABNZ | ||
| ADG333ABRSZ | ||
| ADG333ABRSZ-REEL | PRODUCTION | |
| ADG333ABRZ | ||
| ADG333ABRZ-REEL | ||
|
Aug 19, 2009 - 07_0024 Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad |
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| ADG333ABNZ | ||
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Aug 25, 2010 - 10_0065 Halogen Free Material Change for SSOP Products at Carsem |
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| ADG333ABRSZ | ||
| ADG333ABRSZ-REEL | PRODUCTION | |
|
Jul 21, 2014 - 13_0297 Qualification of ASE Chungli, as an Alternate Assembly Site for Select 16L, 20L, 24L and 28L SOICW Packages |
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| ADG333ABRZ | ||
| ADG333ABRZ-REEL | ||
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Feb 7, 2011 - 10_0003 Halogen Free Material Change for SOIC Wide Body Products Assembled at Amkor |
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| ADG333ABRZ | ||
| ADG333ABRZ-REEL | ||
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Aug 4, 2010 - 10_0117 Halogen Free Material Change for SOIC_W Products at Carsem |
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| ADG333ABRZ | ||
| ADG333ABRZ-REEL | ||
This is the most up-to-date revision of the Data Sheet.