ADP3334

不推荐用于新设计

高精度、低IQ、500 MA ANYCAP®可调低压差稳压器

数据手册 (Rev. C) 产品选型表

产品模型: 5

Viewing:

概述

高线路和负载精度：±0.9%(25℃)、全部温度下±1.8%
电流容量500 mA
超低压差
仅需C_O = 1.0 µF便可保持稳定
anyCAP = 使用任意类型的电容（包括MLCC）均可保持稳定

限流、限热
低噪声
低关断电流：< 1.0 µA（典型值）
电源电压范围：2.6 V至11 V
输出范围：1.5 V至10 V
环境温度范围：–40°C至+85°C

ADP3334属于ADP333x系列精密低压差anyCAP®稳压器。ADP3334输入电压范围为2.6 V至11 V，最大连续负载电流为500 mA。新颖的anyCAP® 架构仅需一个小型1 µF输出电容就能保持稳定，且LDO对电容等效串联电阻(ESR)不敏感。这使得ADP3334采用任何电容均能保持稳定，包括面向空间受限应用的陶瓷电容(MLCC)。

产品模型: 5

参考资料

ADI 始终高度重视提供符合最高质量和可靠性水平的产品。我们通过将质量和可靠性检查纳入产品和工艺设计的各个范围以及制造过程来实现这一目标。出货产品的“零缺陷”始终是我们的目标。查看我们的质量和可靠性计划和认证以了解更多信息。

产品型号	引脚/封装图-中文版	文档	CAD 符号，脚注和 3D模型
ADP3334ACPZ-REEL7	8-Lead LFCSP (3mm x 3mm)	Material Declaration Reliablity Data 资料包	Ultra Librarian SamacSys
ADP3334ARMZ-REEL7	8-Lead MSOP	Material Declaration Reliablity Data 资料包	Ultra Librarian SamacSys
ADP3334ARZ	8-Lead SOIC	Material Declaration Reliablity Data 资料包	Ultra Librarian SamacSys
ADP3334ARZ-REEL	8-Lead SOIC	Material Declaration Reliablity Data 资料包	Ultra Librarian SamacSys
ADP3334ARZ-REEL7	8-Lead SOIC	Material Declaration Reliablity Data 资料包	Ultra Librarian SamacSys

产品型号	产品生命周期	PCN

7月 8, 2025 - 24_0103 Qualification of Wafer Fabrication Site at Analog Devices, Inc. Camas for CBCMOS2 Products
		PCN24_0103_Form Material_Report Delta Qualification Matrix Qualification Results Summary
ADP3334ACPZ-REEL7	量产
ADP3334ARMZ-REEL7	量产
ADP3334ARZ	量产
ADP3334ARZ-REEL	量产
ADP3334ARZ-REEL7	量产
7月 25, 2017 - 17_0068 CANCELLED: Addition of ASE Korea as an Alternate Assembly Site for Select 3x3mm and 4x4mm Body Sizes LFCSP Devices
		PCN17_0068_Form Material_Report Detailed Change Description Package Outline Drawing Qualification Results Summary
ADP3334ACPZ-REEL7	量产
4月 24, 2014 - 14_0038 Conversion of 3x3mm body Size LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to Amkor Philippines.
		PCN14_0038_Form Material_Report Detailed Change Description Package Outline Drawing Qualification Report Summary
ADP3334ACPZ-REEL7	量产
9月 10, 2012 - 11_0020 Conversion of Select Sizes of LFCSP Package Outlines from Punch to Sawn and Transfer of Assembly Site to StatsChippac Malaysia.
		PCN11_0020_Form Material_Report Detailed Change Description Package Outline Drawing Qualification Report Summary
ADP3334ACPZ-REEL7	量产
1月 5, 2015 - 14_0246 Qualification of ASE Chungli, as an Alternate Assembly Site for Select MSOP Devices
		PCN14_0246_Form Material_Report Detailed Change Description Qualification Results Summary
ADP3334ARMZ-REEL7	量产
5月 15, 2012 - 10_0006 Halogen Free Material Change for mini SOIC Products
		PCN10_0006_Form Material_Report Qualification Report Summary Qualification Report Summary
ADP3334ARMZ-REEL7	量产