SSM2019

PRODUCTION

Self-Contained Audio Preamplifier

Data Sheet (Rev. A) Product Selection Table

Part Models: 5
1ku List Price: Starting From $2.62

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Overview

Excellent Noise Performance:950 pV/rtHz or 1.5 dB Noise Figure
Ultralow THD:<0.01%@G =100 Over the Full Audio Band
Wide Bandwidth:1 MHz @G =100
High Slew Rate: 20 V/us (Typical)
Unity Gain Stable

True Differential Inputs
Subaudio 1/f Noise Corner
8-Pin Mini-DIP or 16-Pin SOIC
Only One External Component Required
Very Low Cost
Extended Temperature Range:–40ºC to +85ºC

The SSM2019 is a latest generation audio preamplifier, combining SSM preamplifier design expertise with advanced processing. The result is excellent audio performance from a monolithic device, requiring only one external gain set resistor or potentiometer. The SSM2019 is further enhanced by unity gain stability.

Key specifications include ultralow noise (1.5 dB noise figure) and THD (<0.01% at G = 100), complemented by wide bandwidth and high slew rate.

Applications for this low-cost device include microphone preamplifiers and bus summing amplifiers in professional and consumer audio equipment, sonar, and other applications requiring a low noise instrumentation amplifier with high gain capability.

APPLICATIONS

Audio Mix Consoles
Intercom/Paging Systems
Two-Way Radio
Sonar
Digital Audio Systems

Part Models: 5
1ku List Price: Starting From $2.62

Documentation

Data Sheet 1

SSM2019: Self-Contained Audio Preamplifier Data Sheet (Rev.A) 10/18/2002

Application Note 2

AN-211: The Alexander Current-Feedback Audio Power Amplifier 01/01/2000

AN-938: Digital and Analog Measurement Units for Digital CMOS Microphone Preamplifier ASICs 12/01/2007

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
SSM2019BNZ	8-Lead PDIP	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
SSM2019BRNZ	8-Lead SOIC	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
SSM2019BRNZRL	8-Lead SOIC	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
SSM2019BRWZ	16-Lead SOIC Wide	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
SSM2019BRWZRL	16-Lead SOIC Wide	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys

Part Models	Product Lifecycle	PCN

Oct 1, 2025 - 25_0156 Qualification of Wafer Fabrication Site Analog Devices, Inc. Camas WA for HVBP1 Products
		PCN25_0156_Form Material_Report Qualification Results Summary
SSM2019BNZ	PRODUCTION
SSM2019BRNZ	PRODUCTION
SSM2019BRNZRL	PRODUCTION
SSM2019BRWZ	PRODUCTION
SSM2019BRWZRL	PRODUCTION
Aug 19, 2009 - 07_0024 Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad
		Material_Report Material_Report Parts List PCN07_0024_Form Qual Data
SSM2019BNZ	PRODUCTION
Aug 4, 2010 - 10_0117 Halogen Free Material Change for SOIC_W Products at Carsem
		PCN10_0117_Form Material_Report Reliability Report
SSM2019BRWZ	PRODUCTION
SSM2019BRWZRL	PRODUCTION

This is the most up-to-date revision of the Data Sheet.

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