SMP04
Info: : PRODUCTION
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SMP04

CMOS Quad Sample-and-Hold Amplifier

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Info: : PRODUCTION tooltip
Info: : PRODUCTION tooltip
Part Details
Part Models 5
1ku List Price Starting From $8.09
Features
  • Four Independent Sample-and-Holds
  • Internal Hold Capacitor
  • High Accuracy: 12 Bit
  • Very Low Droop Rate: 2 mV/s typ
  • Output Buffers Stable for CL ≤ 500 pF
  • TTL/CMOS Compatible Logic Inputs
  • Single or Dual Supply Applications
  • Monolithic Low Power CMOS Design
  • Signal Processing Systems
  • Multichannel Data Acquisition Systems
  • Automatic Test Equipment
  • Medical and Analytical Instrumentation
  • Event Analysis
  • DAC Deglitching
Additional Details
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The SMP04 is a monolithic quad sample-and-hold; it has four internal precision buffer amplifiers and internal hold capacitors. It is manufactured in ADI's advanced oxide isolated CMOS technology to obtain high accuracy, low droop rate and fast acquisition time required by data acquisition and signal processing systems. The device can acquire an 8-bit input signal to ±1/2 LSB in less than seven microseconds. The SMP04 can operate from single or dual power supplies with TTL/CMOS logic compatibility. Its output swing includes the negative supply.

The SMP04 is ideally suited for a wide variety of sample-and- hold applications including amplifier offset or VCA gain adjustments. One or more can be used with a single or multiple DACs to provide multiple setpoints within a system.

The SMP04 offers significant cost and size reduction over lent module or discrete designs. It is available in a 16-pin hermetic or plastic DIP and surface mount SOIC packages. It is specified the extended industrial temperature range of 0°C to +85°C.

Part Models 5
1ku List Price Starting From $8.09

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Documentation

Documentation

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
SMP04EPZ
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  • HTML
SMP04EQ
  • HTML
  • HTML
SMP04ESZ
  • HTML
  • HTML
SMP04ESZ-REEL
  • HTML
  • HTML
SMP04GBC
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Part Models

Product Lifecycle

PCN

Mar 29, 2021

- 21_0033

Assembly Site Transfer for 14/16L 300_MIL PDIP to Cirtek

Nov 9, 2011

- 11_0182

Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines

SMP04EPZ

PRODUCTION

SMP04EQ

SMP04ESZ

PRODUCTION

SMP04ESZ-REEL

PRODUCTION

Aug 19, 2009

- 07_0024

Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad

Nov 7, 2012

- 12_0199

Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.

Nov 9, 2011

- 11_0050

Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines

Mar 25, 2021

- 21_0080

Amkor Philippines as an Alternate Site for SOICN

Oct 5, 2010

- 10_0146

Halogen Free Material Change for 14/16L SOIC_N Products

Dec 14, 2011

- 11_0208

Addition of a Polyimide Layer to SMP04 Diesale Part

Filter by Model

reset

Reset Filters

Part Models

Product Lifecycle

PCN

Mar 29, 2021

- 21_0033

arrow down

Assembly Site Transfer for 14/16L 300_MIL PDIP to Cirtek

Nov 9, 2011

- 11_0182

arrow down

Test Site Transfer from Analog Devices Philippines Inc in Paranaque to Analog Devices General Trias in Cavite, Philippines

SMP04EPZ

PRODUCTION

SMP04EQ

SMP04ESZ

PRODUCTION

SMP04ESZ-REEL

PRODUCTION

Aug 19, 2009

- 07_0024

arrow down

Package Material Changes for SOT23, MiniSO, MQFP, PDIP, PLCC, SOIC (narrow and wide body), SSOP, TSSOP and TSSOP exposed pad

Nov 7, 2012

- 12_0199

arrow down

Qualification of New Conductive Silver-Filled Glass Die Attach Adhesive for Cerdip and Ceramic Flatpack (Cerpack) Packages.

Nov 9, 2011

- 11_0050

arrow down

Transfer of ADI Hermetics Assembly location from Paranaque, Manila to General Trias, Cavite Philippines

Mar 25, 2021

- 21_0080

arrow down

Amkor Philippines as an Alternate Site for SOICN

Oct 5, 2010

- 10_0146

arrow down

Halogen Free Material Change for 14/16L SOIC_N Products

Dec 14, 2011

- 11_0208

arrow down

Addition of a Polyimide Layer to SMP04 Diesale Part

Software & Part Ecosystem

Software & Part Ecosystem

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