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  4. MAX98374


Features and Benefits

  • Wide Input Supply Range (5.5V to 16V)
  • Dynamic Headroom Tracking (DHT) Maintains a Consistent Listening Experience
  • Integrated Thermal Protection and Output Foldback
  • Remote Output Sensing Allows up to 20dB THD+N Improvement with Ferrite Bead Filters
  • Class D EMI Reduction Enables Filterless Operation
    • Active Emissions Limiting (AEL)
    • Spread-Spectrum Modulation (SSM)
    • Switching Edge Rate Control
  • 110dB A-Weighted Dynamic Range
  • 0.006% THD+N at 3W into 8Ω, f = 1kHz
  • 0.025% THD+N at 3W into 8Ω, f = 6kHz
  • Output Power at 1% THD+N:
    • 13.5W into 8Ω, VPVDD = 16V
    • 12.5W into 4Ω, VPVDD = 12V
  • Output Power at 10% THD+N:
    • 16.9W into 8Ω, VPVDD = 16V
    • 15.3W into 4Ω, VPVDD = 12V
  • Speaker Amplifier Efficiency:
    • 90.5% at 10W into 8Ω, VPVDD = 12V
    • 81% at 15.3W into 4Ω, VPVDD = 12V
  • BDE Provides Supply Brownout Protection
  • Extensive Click-and-Pop Suppression
  • Space Saving Packages
    • 25-Bump WLP (2.17mm x 2.25mm x 0.64mm, 0.4mm Pitch)
    • 22-Pin FCQFN (3mm x 3mm x 0.55mm, 0.4mm Pitch)

Product Details

The MAX98374 is a high-efficiency, mono Class D speaker amplifier featuring dynamic headroom tracking (DHT) and brownout protection. As the power-supply voltage varies due to sudden transients and declining battery life, DHT automatically optimizes the headroom available to the Class D amplifier to maintain a consistent listening experience. A wide 5.5V to 16V supply range allows the device to exceed 16W into an 8Ω load.

The flexible digital interface supports either the MIPI SoundWire® compatible interface for audio and control data, or the PCM interface for audio data and a standard I2C interface for control data. The PCM interface supports I2S, left-justified, and TDM audio data formats at 16-, 32-, 44.1-, 48-, 88.2-, and 96kHz sample rates with 16-, 24-, and 32-bit data. In TDM mode, the device can support up to 16 channels of audio data. A unique clocking structure eliminates the need for an external master clock for PCM communication, which reduces pin count and simplifies board layout.

Active emissions limiting (AEL), spread spectrum modulation (SSM), and edge rate control minimize EMI and eliminate the need for the output filtering found in traditional Class D devices.

Thermal foldback protection ensures robust behavior when the thermal limits of the device are reached. When enabled, it automatically reduces the output power when the temperature exceeds a user specified threshold. This allows for uninterrupted music playback even at high ambient temperatures. Traditional thermal protection is also available in addition to robust overcurrent protection.

A flexible brownout-detection engine (BDE) can be programmed to initiate various gain reductions, signal limiting, and clip functions based on supply voltage status. Threshold, hysteresis, and attack/release rates are programmable.

The device is available in a 0.4mm pitch, 25-bump waferlevel package (WLP), or in a 0.4mm pitch, 22-pin FCQFN package. The device operates over the extended -40°C to +85°C temperature range.


  • Notebook Computers
  • Sound Bars
  • Tablets

Product Lifecycle icon-recommended Recommended for New Designs

This product has been released to the market. The data sheet contains all final specifications and operating conditions. For new designs, ADI recommends utilization of these products.

Evaluation Kits (2)

Tools & Simulations

Software Development

Design Resources

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well.  "Zero defects" for shipped products is always our goal.View our quality and reliability program and certifications for more information.

Part Number Material Declaration Reliability Data Pin/Package Drawing CAD Symbols, Footprints & 3D Models
MAX98374EFF+ Material Declaration Reliability Data Flip-Chip Quad Flatpack, No Leads
MAX98374EFF+T Material Declaration Reliability Data Flip-Chip Quad Flatpack, No Leads
MAX98374EWA+ Material Declaration Reliability Data Wafer-Level Package 5x5 Bump, Full Array
MAX98374EWA+T Material Declaration Reliability Data Wafer-Level Package 5x5 Bump, Full Array
Wafer Fabrication Data

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Evaluation Boards

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Pricing displayed is based on 1-piece. The USA list pricing shown is for budgetary use only, shown in United States dollars (FOB USA per unit), and is subject to change. International prices may vary due to local duties, taxes, fees and exchange rates.