MAX77533
14V Input, 1.5A High-Efficiency Buck Converter with 9μA ISUP
Save Power and Board Space with Small Solution Size
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Overview
Features and Benefits
- 1.5A Single Channel Buck Regulator
- 3V to 14V Input Voltage Range
- Output Voltage Range
- 0.8V to 5V I2C Programmable in 50mV Steps Internal Feedback
- 1.2V, 1.8V, or 3.3V Factory Preset Options Internal Feedback
- 0.8V to 99%VSUP with External Feedback Resistors
- High-Efficiency, Low Supply Current Extends Battery Life
- 94% Peak Efficiency at 7.4VSUP, 3.3VOUT (2520 Inductor)
- 9μA ISUP (12VSUP, 1.8VOUT Internal Feedback Version)
- Selectable Light-Load SKIP and Forced-PWM Modes
- 1MHz or 550kHz Fixed-Frequency Switching
- Hardware or Software Control
- Enable Input and Power-OK Output Pins
- Optional I2C Full Control Interface
- Protection Features
- Cycle-by-Cycle Inductor Peak Current Limit
- Short-Circuit Hiccup Mode, UVLO, and Thermal Shutdown Protections
- 1ms Default Soft-Start
- Small Size
- 1.85mm x 1.4mm (0.7mm max. height) WLP
- 12-Bump, 0.4mm Pitch, 3 x 4 Array
Product Details
The MAX77533 is a synchronous 1.5A step-down DC-DC converter optimized for portable 2-cell and 3-cell battery-operated and USB-C applications. The converter operates on an input supply between 3V and 14V. Output voltage is adjustable between 0.8V and 5V in 50mV steps through an I2C serial interface (internal feedback) or 0.8V to 99% of the supply voltage with external feedback resistors. Factory-programmed default voltages of 1.2V, 1.8V, and 3.3V with internal feedback are offered to reduce component count for common rails. The device features a low-IQ SKIP mode which allows excellent efficiency at light loads.
Dedicated enable and power-OK (POK) pins allow simple hardware control. An I2C serial interface is optionally used for full configuration and control for dynamic voltage scaling and system power optimization.
Built-in undervoltage lockout (UVLO), output active discharge, cycle-by-cycle current limit, thermal shutdown, and short-circuit protection ensure safe operation under abnormal operating conditions.
The MAX77533 is available in a 12-bump, 0.4mm pitch wafer-level package (WLP).
Applications
- 2-cell/3-cell High Power Density Supplies
- Drones, HD Cameras, and Notebook Computers
- Portable Li+/Li-ion Battery Powered Devices
- Space-Constrained Portable Electronics
Product Categories
Product Lifecycle
Recommended for New Designs
This product has been released to the market. The data sheet contains all final specifications and operating conditions. For new designs, ADI recommends utilization of these products.
Evaluation Kits (4)
Documentation & Resources
Tools & Simulations
EE-Sim® Power Tools
The EE-Sim DC-DC Converter Tool uses your requirements to quickly create a complete power design including a schematic, BOM with commercially available parts, and time and frequency domain simulations. Your customized schematic can be downloaded for further analysis in the standalone EE-Sim OASIS Simulator, featuring SIMPLIS and SIMetrix SPICE engines.
Software Development
Design Resources
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal.View our quality and reliability program and certifications for more information.
| Part Number | Material Declaration | Reliability Data | Pin/Package Drawing | CAD Symbols, Footprints & 3D Models |
|---|---|---|---|---|
| MAX77533AEWC+ | Material Declaration | Reliability Data | Wafer-Level Package 4x3 Bump, Full Array | |
| MAX77533AEWC+T | Material Declaration | Reliability Data | Wafer-Level Package 4x3 Bump, Full Array | |
| MAX77533BEWC12+ | Material Declaration | Reliability Data | Wafer-Level Package 4x3 Bump, Full Array | |
| MAX77533BEWC12+T | Material Declaration | Reliability Data | Wafer-Level Package 4x3 Bump, Full Array | |
| MAX77533BEWC33+ | Material Declaration | Reliability Data | Wafer-Level Package 4x3 Bump, Full Array | |
| MAX77533BEWC33+T | Material Declaration | Reliability Data | Wafer-Level Package 4x3 Bump, Full Array | |
| Wafer Fabrication Data |
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Evaluation Boards
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Pricing displayed is based on 1-piece. The USA list pricing shown is for budgetary use only, shown in United States dollars (FOB USA per unit), and is subject to change. International prices may vary due to local duties, taxes, fees and exchange rates.