MAX77324
RECOMMENDED FOR NEW DESIGNS4.8VIN, 1.5A High-Efficiency, Ultra-Small Buck Converter
Ultra-small 6.89mm2 total solution 1.5A buck converter with 93% efficiency for single cell battery applications
- Part Models
- 4
- 1ku List Price
- Starting From $0.51
Overview
- 1.5A Output Current Step-down Converter
- 2.5V to 4.8V VIN Range
- 0.6V to 2V Adjustable VOUT Range, ±2% Accuracy
- MAX77324EWTAD+
- Skip Mode for High Light-Load Efficiency
- 40µA Quiescent Current
- MAX77324GEWTAD+
- PWM Mode Only
- 93% Peak Efficiency (3.8VIN, 1.8VOUT)
- 1µA Shutdown Current
- 2MHz Nominal Switching Frequency
- Enable Pin for Direct Hardware Control
- Cycle-by-Cycle Inductor Current Limit
- UVLO, Soft-Start, Active Output Discharge, Short-Circuit, and Thermal Shutdown Protections
- 1.22mm x 0.85mm, 6-Bump WLP
- 6.89mm2 Total Solution Area
- Uses Small 0603 0.47µH Inductor
The MAX77324 is a single channel high-efficiency synchronous step-down (buck) converter capable of delivering up to 1.5A of current. With a 6.89mm2 total solution size, up to 93% efficiency, and 40µA quiescent current, it is optimized for portable space constrained battery-operated applications.
The device operates over a 2.5V to 4.8V input voltage range to support Li+ battery powered applications. The output voltage is adjustable from 0.6V to 2V, with a better than 2% accuracy over the whole temperature range. The device uses constant-on-time PWM control scheme. A nominal 2MHz switching frequency reduces the overall solution footprint by use of small 0603 inductor. An automatic SKIP mode is also implemented to improve the light-load efficiency for MAX77324EWTAD+. MAX77324GEWTAD+ operates in PWM mode for all load conditions. The device provides low output voltage ripple, excellent line and load regulation, and transient response. A dedicated enable pin allows for simple hardware control.Built-in undervoltage lockout (UVLO), soft-start, active output discharge, cycle-by-cycle short-circuit, and thermal shutdown protections insure safe operations under abnormal operating conditions.
The device is available in a space-saving 1.22mm x 0.85mm, 6-bump wafer-level package (WLP).
Applications
- 1-Cell Battery Powered Equipment
- Portable/Wearables
- Internet of Things (IoT) Devices
- Space Constrained Equipment
Documentation
Data Sheet 1
Design Note 1
Technical Articles 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| MAX77324EWTAD+ | Wafer-Level Package 3x2 Bump, Full Array | ||
| MAX77324EWTAD+T | Wafer-Level Package 3x2 Bump, Full Array | ||
| MAX77324GEWTAD+ | Wafer-Level Package 3x2 Bump, Full Array | ||
| MAX77324GEWTAD+T | Wafer-Level Package 3x2 Bump, Full Array |
This is the most up-to-date revision of the Data Sheet.
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Evaluation Kits
Evaluation Kit for the MAX77324
Resources
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