LTC4307
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LTC4307

Low Offset Hot Swappable 2-Wire Bus Buffer with Stuck Bus Recovery

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Info: : PRODUCTION tooltip
Info: : PRODUCTION tooltip
Part Details
Part Models 10
1ku List Price Starting From $2.60
Features
  • Bidirectional Buffer with Stuck Bus Recovery
  • 60mV Buffer Offset Independent of Load
  • 30ms Stuck Bus Timeout
  • Compatible with Non-Compliant VOL I2C Devices
  • Prevents SDA and SCL Corruption During Live Board Insertion and Removal from Backplane
  • ±5kV Human Body Model ESD Protection
  • Isolates Input SDA and SCL Line from Output
  • Compatible with I2C, I2C Fast Mode and SMBus
  • READY Open-Drain Output
  • 1V Precharge on All SDA and SCL Lines
  • High Impedance SDA, SCL Pins for VCC = 0V
  • Small 8-Lead (3mm × 3mm) DFN and 8-Lead MSOP Packages
Additional Details
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The LTC4307 hot swappable, 2-wire bus buffer allows I/O card insertion into a live backplane without corruption of the data and clock busses. The LTC4307 provides bidirectional buffering, keeping the backplane and card capacitances isolated. Low offset and high VOL tolerance allows multiple devices to be cascaded on the clock and data busses. If SDAOUT or SCLOUT are low for 30ms, the LTC4307 will automatically break the bus connection. At this time the LTC4307 automatically generates up to 16 clock pulses on SCLOUT in an attempt to free the bus. A connection will resume if the stuck bus is cleared.

During insertion, the SDA and SCL lines are pre-charged to 1V to minimize bus disturbances. When driven high, the ENABLE input allows the LTC4307 to connect after a stop bit or bus idle. Driving ENABLE low breaks the connection between SDAIN and SDAOUT, SCLIN and SCLOUT. READY is an open-drain output which indicates that the backplane and card sides are connected.

Applications

  • Live Board Insertion
  • Servers
  • Capacitance Buffer/Bus Extender
  • RAID Systems
  • ATCA
Part Models 10
1ku List Price Starting From $2.60

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Documentation

Documentation

Video

Part Model Pin/Package Drawing Documentation CAD Symbols, Footprints, and 3D Models
LTC4307CDD#PBF
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LTC4307CMS8#TRPBF
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LTC4307IDD#PBF
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LTC4307IDD#TRPBF
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LTC4307IMS8#3ZZPBF
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LTC4307IMS8#3ZZTRPBF
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Product Lifecycle

PCN

Jun 30, 2020

- 20_0244

Notification of Wafer Fab Location Change for 0.6µm CMOS Process Devices from ADI Milpitas (Hillview) to Vanguard Int. (Taiwan)

LTC4307CDD#PBF

PRODUCTION

LTC4307CDD#TRPBF

PRODUCTION

LTC4307CMS8#PBF

PRODUCTION

LTC4307CMS8#TRPBF

PRODUCTION

LTC4307IDD#PBF

PRODUCTION

LTC4307IDD#TRPBF

PRODUCTION

LTC4307IMS8#3ZZPBF

PRODUCTION

LTC4307IMS8#PBF

PRODUCTION

LTC4307IMS8#TRPBF

PRODUCTION

Feb 3, 2020

- 20_0128

Laser Top Mark for 8 Lead MSOP Packages Assembled in ADPG and UTAC

LTC4307CMS8#PBF

PRODUCTION

LTC4307CMS8#TRPBF

PRODUCTION

LTC4307IMS8#PBF

PRODUCTION

LTC4307IMS8#TRPBF

PRODUCTION

Filter by Model

reset

Reset Filters

Part Models

Product Lifecycle

PCN

Jun 30, 2020

- 20_0244

arrow down

Notification of Wafer Fab Location Change for 0.6µm CMOS Process Devices from ADI Milpitas (Hillview) to Vanguard Int. (Taiwan)

LTC4307CDD#PBF

PRODUCTION

LTC4307CDD#TRPBF

PRODUCTION

LTC4307CMS8#PBF

PRODUCTION

LTC4307CMS8#TRPBF

PRODUCTION

LTC4307IDD#PBF

PRODUCTION

LTC4307IDD#TRPBF

PRODUCTION

LTC4307IMS8#3ZZPBF

PRODUCTION

LTC4307IMS8#PBF

PRODUCTION

LTC4307IMS8#TRPBF

PRODUCTION

Feb 3, 2020

- 20_0128

arrow down

Laser Top Mark for 8 Lead MSOP Packages Assembled in ADPG and UTAC

LTC4307CMS8#PBF

PRODUCTION

LTC4307CMS8#TRPBF

PRODUCTION

LTC4307IMS8#PBF

PRODUCTION

LTC4307IMS8#TRPBF

PRODUCTION

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Software & Part Ecosystem

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