LTC2875
PRODUCTION±60V Fault Protected 3.3V or 5V 25kV ESD High Speed CAN FD Transceiver
- Part Models
- 12
- 1ku List Price
- Starting From $2.10
Overview
- Protected from Overvoltage Line Faults to ±60V
- 3.3V or 5V Supply Voltage
- High Speed CAN FD Operation Up to 4Mbps
- ±25kV ESD Interface Pins, ±8kV All Other Pins
- Variable Slew Rate Driver with Active Symmetry Control and SPLIT Pin for Low Electromagnetic Emission (EME)
- Extended Common Mode Range (±36V)
- Ideal Passive Behavior to CAN Bus with Supply Off
- Current Limited Drivers and Thermal Shutdown
- Power-Up/Down Glitch-Free Driver Outputs
- Micropower Shutdown Mode
- Transmit Data (TXD) Dominant Timeout Function
- ISO 11898-2 and CAN FD Compliant
- DeviceNet Compatible
- Up to MP-Grade Available (–55°C to 125°C)
- 3mm × 3mm 8-Lead DFN and SO-8 Packages
The LTC2875 is a robust high speed, low power CAN transceiver operating on 3.3V or 5V supplies that features ±60V overvoltage fault protection on the data transmission lines during all modes of operation, including powerdown. The maximum data rate has been extended to 4Mbps to support high speed protocols based on the CAN physical layer. Supports up to 4Mbps CAN with Flexible Data Rate (CAN FD). Enhanced ESD protection allows these parts to withstand ±25kV HBM on the transceiver interface pins without latchup or damage.
Extended ±36V input common mode range and high common mode rejection on the CAN receiver provides tolerance of large ground loop voltages. A sophisticated CAN driver with active symmetry control maintains tight control of the common mode voltage for excellent electromagnetic emission, while the variable slew rate and split termination support allow additional EME reduction.
Applications
- Industrial Control and Instrumentation Networks
- Automotive and Transportation Electronics
- Building Automation, Security Systems, HVAC
- Medical Equipment
Documentation
Data Sheet 1
Reliability Data 1
User Guide 1
Technical Articles 1
Video 1
Product Selector Card 1
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.
| Part Model | Pin/Package Drawing | Documentation | CAD Symbols, Footprints, and 3D Models |
|---|---|---|---|
| LTC2875HDD#PBF | 8-Lead DFN (3mm x 3mm x 0.75mm w/ EP) | ||
| LTC2875HDD#TRPBF | 8-Lead DFN (3mm x 3mm x 0.75mm w/ EP) | ||
| LTC2875HS8#PBF | 8-Lead SOIC (Narrow 0.15 Inch) | ||
| LTC2875HS8#TRPBF | 8-Lead SOIC (Narrow 0.15 Inch) | ||
| LTC2875IDD#PBF | 8-Lead DFN (3mm x 3mm x 0.75mm w/ EP) | ||
| LTC2875IDD#TRPBF | 8-Lead DFN (3mm x 3mm x 0.75mm w/ EP) | ||
| LTC2875IS8#PBF | 8-Lead SOIC (Narrow 0.15 Inch) | ||
| LTC2875IS8#TRPBF | 8-Lead SOIC (Narrow 0.15 Inch) | ||
| LTC2875MPDD#PBF | 8-Lead DFN (3mm x 3mm x 0.75mm w/ EP) | ||
| LTC2875MPDD#TRPBF | 8-Lead DFN (3mm x 3mm x 0.75mm w/ EP) | ||
| LTC2875MPS8#PBF | 8-Lead SOIC (Narrow 0.15 Inch) | ||
| LTC2875MPS8#TRPBF | 8-Lead SOIC (Narrow 0.15 Inch) |
| Part Models | Product Lifecycle | PCN |
|---|---|---|
|
Jul 31, 2020 - 20_0245 Notification of Wafer Fab Location Change for 0.6µm BICMOS Process Devices from ADI Milpitas (Hillview) to Vanguard Int. (Taiwan) |
||
| LTC2875HDD#PBF | PRODUCTION | |
| LTC2875HDD#TRPBF | PRODUCTION | |
| LTC2875HS8#PBF | PRODUCTION | |
| LTC2875HS8#TRPBF | PRODUCTION | |
| LTC2875IDD#PBF | PRODUCTION | |
| LTC2875IDD#TRPBF | PRODUCTION | |
| LTC2875IS8#PBF | PRODUCTION | |
| LTC2875IS8#TRPBF | PRODUCTION | |
| LTC2875MPDD#PBF | PRODUCTION | |
| LTC2875MPDD#TRPBF | PRODUCTION | |
| LTC2875MPS8#PBF | PRODUCTION | |
| LTC2875MPS8#TRPBF | PRODUCTION | |
|
Mar 12, 2019 - 19_0044 Die Revision for LTC2875 |
||
| LTC2875HDD#PBF | PRODUCTION | |
| LTC2875HDD#TRPBF | PRODUCTION | |
| LTC2875HS8#PBF | PRODUCTION | |
| LTC2875HS8#TRPBF | PRODUCTION | |
| LTC2875IDD#PBF | PRODUCTION | |
| LTC2875IDD#TRPBF | PRODUCTION | |
| LTC2875IS8#PBF | PRODUCTION | |
| LTC2875IS8#TRPBF | PRODUCTION | |
| LTC2875MPDD#PBF | PRODUCTION | |
| LTC2875MPDD#TRPBF | PRODUCTION | |
| LTC2875MPS8#PBF | PRODUCTION | |
| LTC2875MPS8#TRPBF | PRODUCTION | |
|
Oct 24, 2024 - 24_0246 Migrating Bottom Trace Code Marking to Top Side Laser Marking for SOIC_N Package |
||
| LTC2875HS8#PBF | PRODUCTION | |
| LTC2875HS8#TRPBF | PRODUCTION | |
| LTC2875IS8#PBF | PRODUCTION | |
| LTC2875IS8#TRPBF | PRODUCTION | |
| LTC2875MPS8#PBF | PRODUCTION | |
| LTC2875MPS8#TRPBF | PRODUCTION | |
|
Oct 12, 2022 - 22_0255 Epoxy Change from Henkel 8290 to 8290A for 8-Lead SOIC Package (PCN part 2 of 2) |
||
| LTC2875HS8#PBF | PRODUCTION | |
| LTC2875HS8#TRPBF | PRODUCTION | |
| LTC2875IS8#PBF | PRODUCTION | |
| LTC2875IS8#TRPBF | PRODUCTION | |
|
Jun 16, 2021 - 21_0026 Laser Top Mark for 8SOICN Assembled in ADPG, UTL and CRM |
||
| LTC2875HS8#PBF | PRODUCTION | |
| LTC2875HS8#TRPBF | PRODUCTION | |
| LTC2875IS8#PBF | PRODUCTION | |
| LTC2875IS8#TRPBF | PRODUCTION | |
| LTC2875MPS8#PBF | PRODUCTION | |
| LTC2875MPS8#TRPBF | PRODUCTION | |
|
Dec 14, 2023 - 22_0255 Epoxy Change from Henkel 8290 to 8290A for 8-Lead SOIC Package (PCN part 2 of 2) |
||
| LTC2875MPS8#PBF | PRODUCTION | |
| LTC2875MPS8#TRPBF | PRODUCTION | |
This is the most up-to-date revision of the Data Sheet.
Hardware Ecosystem
Tools & Simulations
LTspice
Models for the following parts are available in LTspice:
- LTC2875
IBIS Model 1
LTspice® is a powerful, fast and free simulation software, schematic capture and waveform viewer with enhancements and models for improving the simulation of analog circuits.