HMC908A

RECOMMENDED FOR NEW DESIGNS

9 GHz to 12 GHz, GaAs, MMIC, I/Q Downconverter

Data Sheet (Rev. 0) Product Selection Table

Part Models: 3
1ku List Price: price unavailable

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Part Details

Conversion gain: 11 dB (typical) at IF_OUT = 100 MHz
Image rejection: 25 dB (typical) at IF_OUT = 100 MHz
LO to RF isolation: 46 dB (typical)
LO to IF isolation: 26 dB (typical)
IF output frequency: dc to 3.5 GHz
32-lead, 4.9 mm × 4.9 mm ceramic leadless chip carrier

Part Models: 3
1ku List Price: price unavailable

Documentation

Data Sheet 1

HMC908A: 9 GHz to 12 GHz, GaAs, MMIC, I/Q Downconverter (Rev.0) 05/02/2019

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
HMC908ALC5	32-Lead LCC (4.9mm x 4.9mm)	Material Declaration Reliablity Data	Ultra Librarian SamacSys
HMC908ALC5TR	32-Lead LCC (4.9mm x 4.9mm)	Material Declaration Reliablity Data	Ultra Librarian SamacSys
HMC908ALC5TR-R5	32-Lead LCC (4.9mm x 4.9mm)	Material Declaration Reliablity Data	Ultra Librarian SamacSys

This is the most up-to-date revision of the Data Sheet.

Tools & Simulations

S-Parameter 1

HMC908A S-Parameter

Evaluation Kits

HMC908A Evaluation Board

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Product Details

All RF traces are routed on Layer 1 (primary side), and all other remaining layers are ground planes that provide a solid ground for RF transmission lines. The top dielectric material is Rogers 4350, offering low loss performance. The prepreg material in the middle sticks core layers together, which includes an Isola 370HR layer with copper traces above and below. Both the prepreg material and the Isola 370HR core layer are used to achieve required board finish thickness.

The circuit board used in the application uses radio frequency (RF) circuit design techniques. Signal lines must have 50 Ω impedance while the package ground leads and exposed paddle must be connected directly to the ground plane. Use a sufficient number of via holes to connect the top and bottom ground planes. The EV1HMC908ALC5 evaluation board is available from Analog Devices, Inc. upon request.

Resources

Land Pattern File
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