Features and Benefits
- Conversion gain: 11 dB (typical) at IFOUT = 100 MHz
- Image rejection: 25 dB (typical) at IFOUT = 100 MHz
- LO to RF isolation: 46 dB (typical)
- LO to IF isolation: 26 dB (typical)
- IF output frequency: dc to 3.5 GHz
- 32-lead, 4.9 mm × 4.9 mm ceramic leadless chip carrier
The HMC908A is a compact, gallium arsenide (GaAs), monolithic microwave integrated circuit (MMIC), inphase/quadrature (I/Q) downconverter in a leadless, RoHS compliant ceramic leadless chip carrier. This device provides a small signal conversion gain of 11 dB with a noise figure of 2 dB and 25 dB of image rejection at 100 MHz. The HMC908A utilizes a low noise amplifier (LNA) followed by an image rejection mixer that is driven by a local oscillator (LO) buffer amplifier. The image rejection mixer eliminates the need for a filter following the LNA, and removes thermal noise at the image frequency. I and Q mixer outputs are provided and an external 90° hybrid is needed to select the required sideband. The HMC908A is a much smaller alternative to hybrid style image rejection mixer downconverter assemblies, and it eliminates the need for wire bonding by allowing the use of surface-mount manufacturing techniques.
- Point to point radios
- Point to multipoint radios and very small aperture terminals (VSATs)
- Test equipment and sensors
- Military end use
Product Lifecycle Recommended for New Designs
This product has been released to the market. The data sheet contains all final specifications and operating conditions. For new designs, ADI recommends utilization of these products.
Evaluation Kits (1)
All RF traces are routed on Layer 1 (primary side), and all other remaining layers are ground planes that provide a solid ground for RF transmission lines. The top dielectric material is Rogers 4350, offering low loss performance. The prepreg material in the middle sticks core layers together, which includes an Isola 370HR layer with copper traces above and below. Both the prepreg material and the Isola 370HR core layer are used to achieve required board finish thickness.
The circuit board used in the application uses radio frequency (RF) circuit design techniques. Signal lines must have 50 Ω impedance while the package ground leads and exposed paddle must be connected directly to the ground plane. Use a sufficient number of via holes to connect the top and bottom ground planes. The EV1HMC908ALC5 evaluation board is available from Analog Devices, Inc. upon request.
Tools & Simulations
ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal.
Sample & Buy
The USA list pricing shown is for BUDGETARY USE ONLY, shown in United States dollars (FOB USA per unit for the stated volume), and is subject to change. International prices may differ due to local duties, taxes, fees and exchange rates. For volume-specific price or delivery quotes, please contact your local Analog Devices, Inc. sales office or authorized distributor. Pricing displayed for Evaluation Boards and Kits is based on 1-piece pricing.