HMC863

Obsolete

HMC863 / HMC863LP4E

Half-Watt Power Amplifier Chip or SMT, 22 GHz to 26.5 GHz or 24 GHz to 29.5 GHz

Part Models: 3
1ku List Price: price unavailable

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Overview

Saturated output power: +27.5 dBm at 15% PAE, +28 dBm at 18% PAE
High output IP3: +33 dBm, +39 dBm
High gain: 21.5 dB, 27 dB
DC supply: +6 V at 350 mA or 375 mA
50 Ω matched input/output
Die size: 2.41 × 0.95 × 0.1 mm
24-lead, 4 × 4 mm, surface-mount technology (SMT) package

The HMC863 devices are three-stage, GaAs, monolithic microwave integrated circuit (MMIC), and PHEMT half-watt power amplifiers which operate between 22 GHz to 26.5 GHz or 24 GHz to 29.5 GHz. These amplifiers provide up to 21.5 dB or 27 dB of gain and +27.5 dBm at 15% PAE or +28 dBm at 18% PAE of saturated output power from a +6 V supply. The RF inputs/outputs are dc-blocked and matched to 50 Ω for ease of integration into multichip modules (MCMs) or higher level assemblies. All data is taken with the chip in a 50 Ω test fixture connected via 0.025 mm (1 mil) diameter wire bonds of 0.31 mm (12 mils) length. The power amplifier SMT can also be operated from a 5 V supply with only a slight decrease in output power and IP3.

Applications

Point-to-point radios
Point-to-multipoint radios
VSAT
Military and space

Suggested Replacement Parts

GaAs pHEMT MMIC 1/2 Watt Power Amplifier, 24 - 29.5 GHz

Part Models: 3
1ku List Price: price unavailable

Documentation

Data Sheet 2

HMC863 Die Data Sheet 04/14/2015

HMC863LP4E Data Sheet 04/14/2015

ADI has always placed the highest emphasis on delivering products that meet the maximum levels of quality and reliability. We achieve this by incorporating quality and reliability checks in every scope of product and process design, and in the manufacturing process as well. "Zero defects" for shipped products is always our goal. View our quality and reliability program and certifications for more information.

Part Model	Pin/Package Drawing	Documentation	CAD Symbols, Footprints, and 3D Models
HMC863	CHIPS OR DIE	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
HMC863LP4E	24-Lead QFN (4mm x 4mm w/ EP)	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys
HMC863LP4ETR	24-Lead QFN (4mm x 4mm w/ EP)	Material Declaration Reliablity Data Package Resources	Ultra Librarian SamacSys

Part Models	Product Lifecycle	PCN

Jun 6, 2022 - 22_0048 Addition of ASE Korea as an Alternate Assembly Site for Select LFCSP Products
		PCN22_0048_Form Material_Report Qualification Results Summary Detailed Change Description
HMC863LP4E	Obsolete
HMC863LP4ETR	Obsolete
Jan 11, 2017 - 16_0010 Discontinuance of Select RF and Microwave Products
		PDN16_0010_Form Material_Report
HMC863	Obsolete
HMC863LP4E	Obsolete
HMC863LP4ETR	Obsolete